In this paper, we have addressed the problem of ordering transactions in network-on-chips (NoCs) for post-silicon validation. The main idea is to extract the order of the transactions from the local partial orders in each NoC tile based on a set of “happened-before” rules, assuming transactions do not have a timestamp. The assumption is based on the fact that implementation and usage of a global time as timestamp in such systems may not be practical or efficient. When a new transaction is received in a tile, we send special messages to the neighboring tiles to inform them regarding the new transaction. The process of sending those special messages continues recursively in all the tiles that receive them until another such special message is detected. This way, we relate local orders of different tiles with each other. We show that our method can reconstruct the correct transaction orders when communication delays are deterministic. We have shown the effectiveness of our method by correctly ordering the transaction in NoCs with mesh and torus topologies with different sizes from 5*5 to 9*9. Also, we have implemented the proposed method in hardware to show its feasibility.

Bus-based system-on-a-chip (SoC) design has become the major integrated methodology for shortening SoC design time. The main challenge is how to verify on-chip bus protocols efficiently. Although traditional simulation-based bus protocol monitors can check whether bus signals obey bus protocol or not. They are still lack of an efficient bus protocols verification environment such as FPGA-level or chip-level. To overcome the shortage, we propose a rule-based synthesizable AMBA AHB on-chip bus protocol checker, which contains 73 related AHB on-chip bus protocol rules to check AHB bus signal behaviors, and two corresponding verification mechanisms: an error reference table (ERT) and a windowed trace buffer, to shorten verification time.

3D graphics application is widely used in consumer electronics which is an inevitable tendency in the future. In general, the higher abstraction level is used to model a complex system like 3D graphics SoC. However, the concerned issue is that how to use efficient methods to traverse design space hierarchically, reduce simulation time, and refine the performance fast. This paper demonstrates a system-level design space exploration model for a tile-based 3D graphics SoC refinement. This model uses UML tools which can assist designers to traverse the whole system and reduces simulation time dramatically by adopting SystemC. As a result, the system performance is improved 198% at geometry function and 69% at rendering function, respectively.

To improve the computation efficiency of the application specific instruction-set processor (ASIP), a strategy of hardware/software collaborative design is usually utilized. In this process, the auto-customization of specific instruction set has always been a key part to support the automated design of ASIP. The key issue of this problem is how to effectively reduce the huge exponential exploration space in the instruction identification process. To address this issue, we first formulate it as a feasible sub-graph enumeration problem under multiple constraints, and then propose a fast instruction identification algorithm based on a new model called basic convex pattern (BCP). The kernel technique in this algorithm is the transformation from the graph exploration to the formula-based computations. The experimental results have indicated that the proposed algorithm has a distinct reduction in the execution time.

In this paper, a methodology based on a mix-mode interconnection architecture is proposed for constructing an application specific network on chip to minimize the total communication time. The proposed architecture uses a globally asynchronous communication network and a locally synchronous bus (or cross-bar or multistage interconnection network MIN). First, a local bus is given for a group of IP cores so that the communications within this local bus can be arranged to be exclusive in time. If the communications of some IP cores should be required to be completed within a given amount of time, then a non-blocking MIN or a crossbar switch should be made for those IP cores instead of a bus. Then, a communication ratio (CR) for each pair of local buses is provided by users, and based on the Huffman coding philosophy, a process is applied to construct a binary tree (BT) with switches on the internal nodes and buses on the leaves. Since the binary tree system is deadlock free (no cycle exists in any path), the router is just a relatively simple and cheap switch. Simulation results show that the proposed methodology and architecture of NOC is better on switching circuit cost and performance than the SPIN and the mesh architecture using our developed deadlock-free router.

In the Reconfigurable System-On-a-Chip (RSOC), an FPGA core is embedded to improve the design flexibility of SOC. In this paper, we demonstrate that the embedded FPGA core is also feasible for use in implementing the proposed hybrid pattern Built-In Self-Test (BIST) in order to reduce the test cost of SOC. The hybrid pattern BIST, which combines Linear Feedback Shift Register (LFSR) with the proposed on-chip Deterministic Test Pattern Generator (DTPG), can achieve not only complete Fault Coverage (FC) but also minimum test sequence by applying a selective number of pseudorandom patterns. Furthermore, the hybrid pattern BIST is designed under the resource constraint of target FPGA core so that it can be implemented on any size of FPGA core and take full advantage of the target FPGA resource to reduce test cost. Moreover, the reconfigurable core-based approach has minimum hardware overhead since the FPGA core can be reconfigured as normal mission logic after testing such that it eliminates the hardware overhead of BIST logic. Experimental results for ISCAS 89 benchmarks and a platform FPGA chip have proven the efficiency of the proposed approach.

A direct tunneling memory (DTM) with ultra-thin tunnel oxide and depleted floating gate has been proposed for low power embedded RAM. To achieve excellent charge retention characteristics with ultra-thin tunnel oxide, floating gate depletion is adopted to utilize the band bending at the interface between floating gate and tunnel oxide in charge retention period. The depleted floating gate is also effective to suppress the degradation of program/erase speed caused by the gate re-oxidation process. These effects were evaluated by the device and process simulations and confirmed by the experimental data. As a consequence, both fast programming time and superior retention time have been achieved, which is a promising performance as a low power embedded RAM for system-on-a-chip (SoC) applications.

This paper describes fully integrated active guard band filters for suppressing the substrate coupling noise and their noise suppression effect measured by test chip experiments. The noise cancellation circuit of the active guard band filters simply consists of an inverter and a source follower. The substrate noise suppression effect was measured by using a test chip fabricated in a 0.18 µm CMOS triple-well process for system-on-a-chip. The noise with the filter was less than 5% of that without the filter and the noise suppression effect was observed from 1 MHz to 200 MHz by the statistical measurement of the voltage comparator. The noise suppression effect was also observed for actual digital switching noise produced by digital inverters. Configuration of the active guard band filter was investigated by simulation and it is shown that high and uniform noise suppression effect is achieved by placing the guard bands in the L-shape around the target triple-well area on the p-substrate.

Future electronic systems can not be built only with System-on-a-Chip (SoC), since many SoC issues have become evident. Relatively low yield due to the larger die size and the huge investment in developing the process to embed different kinds of technologies are some of the issues. Instead, superconnect technology is getting more important as a viable solution in building electronic systems. The superconnect connects separately built and tested chips not by the printed circuit board but rather directly to construct high-performance yet low-cost electronic systems and may use around 10 micron level design rules. System-in-a-Package and stacked chips using interposers are some realization of the superconnect. The superconnect will also be used to mitigate IR-drop problems and RC delay problems in global on-chip interconnect.