In this study, the transient characteristics on the super-steep subthreshold slope (SS) of a PN-body tied (PNBT) silicon-on-insulator field-effect transistor (SOI-FET) were investigated using technology computer-aided design and pulse measurements. Carrier charging effects were observed on the super-steep SS PNBT SOI-FET. It was found that the turn-on delay time decreased to nearly zero when the gate overdrive-voltage was set to 0.1-0.15 V. Additionally, optimizing the gate width improved the turn-on delay. This has positive implications for the low speed problems of this device. However, long-term leakage current flows on turn-off. The carrier lifetime affects the leakage current, and the device parameters must be optimized to realize both a high on/off ratio and high-speed operation.

In this paper, we review a super-steep subthreshold slope (SS) (<1 mV/dec) body-tied (BT) silicon on insulator (SOI) metal oxide semiconductor field effect transistor (MOSFET) fabricated with 0.15 µm SOI technology and discuss the possibility of its use in ultralow voltage applications. The mechanism of the super-steep SS in the BT SOI MOSFET was investigated with technology computer-aided design simulation. The gate length/width and Si thickness optimizations promise further reductions in operation voltage, as well as improvement of the ION/IOFF ratio. In addition, we demonstrated control of the threshold voltage and hysteresis characteristics using the substrate and body bias in the BT SOI MOSFET.

We report the characterization of hysteresis in SOI-based super-steep subthreshold slope FETs, which are conventional floating body and body-tied, and newly proposed PN-body-tied structures. We found that the hysteresis widths of the PN-body-tied structures are smaller than that of the conventional floating body and body-tied structures; this means that they are feasible for switching devices. Detailed characterizations of the hysteresis widths of each device are also reported in the study, such as dependency on the gate length and the impurity concentration.

A negative capacitor is fabricated using poly(vinylidene fluoride-trifluoroethylene) copolymer and connected in series to an a-IZO TFT. It is experimentally demonstrated that the negative capacitance of the negative capacitor can create steep switching in the a-IZO TFT (e.g., a subthreshold slope change from 342mV/decade to 102mV/decade at room-temperature).

Location control of grains by µ-Czochralski process with excimer-laser is a powerful tool for realizing high performance single-crystalline Si TFTs (c-Si TFTs). This study reports the behavior of p-channel single-crystalline Si TFTs fabricated inside a location-controlled grain by µ-Czochralski method. Self-aligned p-channel single-crystalline Si TFTs is fabricated with a top gate structure having ECR-PECVD SiO2 as gate insulator. The field effect hole mobility of 250 cm2/Vs and subthreshold swing of 0.29 V/dec. are obtained successfully. Effects of active Si thickness and boron channel doping on the characteristics of the c-Si TFTs were studied.

The buried oxide nonintegrities, represented as the equivalent fixed oxide charge and interface trap densities at both the upper and lower interface of buried oxide, are evaluated for low-dose and high-dose SIMOX wafers, and their effects on device characteristics are investigated. The equivalent fixied oxide charge and trap densities at the lower interface, which are measured with buried oxide capacitors, are negligibly small in as-fabricated SIMOX wafers. This result enables us to make an analytical model of the parasitic drain/source-to-substrate capacitance in an SOI MOSFET, in which the effect of the depletion layer under the buried oxide is considered. The influence of thinner buried oxide and process-induced fixed oxide charge on the parasitic capacitance is explored with this model. The equivalent fixed oxide charge and trap densities at the upper interface are evaluated by the threshold voltage measurement in an SOI NMOSFET. The principle of this evaluation as well as the experimental technique are described in detail. The oxide charge and trap densities at the upper interface are higher than those at the lower interface for both SIMOX wafers. With a new model of the subthreshold slope based on a two-dimensional potential analysis the influence of the trap at the upper interface is discussed.