We propose a temperature sensor employing a ring oscillator composed of poly-Si thin-film transistors (TFTs). Particularly in this research, we compare temperature sensors using TFTs with lightly-doped drain structure (LDD TFTs) and TFTs with offset drain structure (offset TFTs). First, temperature dependences of transistor characteristics are compared between the LDD and offset TFTs. It is confirmed that the offset TFTs have larger temperature dependence of the on current. Next, temperature dependences of oscillation frequencies are compared between ring oscillators using the LDD and offset TFTs. It is clarified that the ring oscillator using the offset TFTs is suitable to detect the temperature. We think that this kind of temperature sensor is available as a digital device.

A novel asymmetric MOSFET with no LDD on the source side is simulated on bulk-Si using a device simulator (SILVACO). In order to overcome the problems of the conventional asymmetric process, a novel asymmetric MOSFET using mesa structure and sidewall spacer gate is proposed which provides self-alignment process, aggressive scaling, and uniformity. First of all, we have simulated to compare the characteristics between asymmetric and symmetric MOSFETs. Basically, both asymmetric and symmetric MOSFETs have an n-type channel (25-nm) and the same physical parameters. When we compare this with the 25-nm symmetric MOSFET, the proposed asymmetric MOSFET shows better device performances.

A two-dimensional (2-D) physical model of n-channel poly-Si LDD TFTs in comparison with that of SD TFTs is presented to analyze hot-carrier degradation. The model is based on 2-D device simulator's Gaussian doping profiles for the source and drain junctions fitted to the lateral and vertical impurity profiles in poly-Si obtained from a 2-D process simulator. We have shown that, in the current saturation bias (Vg

A test structure to separately analyze the location where the hot-carrier-induced CMOSFET reliability is determined around the center or the isolation-edge along the channel-width was proposed and fabricated. The test structure has four kinds of MOSFETs; [A] and [D] MOSFETs with a short and a long channel-length all over the channel width, respectively, [B] MOSFET with the short and the long channel-length around the center and the both isolation-edges, respectively, and [C] MOSFET with the channel-length regions vice versa to the [B] MOSFET. The time dependent changes of the threshold voltages VT, the saturation currents IS, the linear currents IL and the maximum transconductances β up to 50,000 s were measured. All data for the wide channel-width MOSFETs were almost categorized into three; [A], [B]/[C] and [D]. The [B]/[C] data were well estimated from simple theoretical discussions by the combination of [A] and [D] data, which mean that the reliabilities are nearly the same around the center or the isolation-edge for the CMOSFETs.

A test structure to separately measure sheet resistances of highly-doped-drain (HDD) and lightly-doped-drain (LDD) in LDD-type CMOSFETs with various gate spaces S having sub-100 nm sidewalls was proposed. From the reciprocal of source/drain-resistance R-1 versus S characteristics, the sheet resistance ρH of the high-conductive-region (HCR) corresponding to HDD and the approximate width WLC of the low-conductive-region (LCR) corresponding to LDD could be estimated. Both of ρH and WLC for p- and n-MOS devices were scarcely dependent on the gate voltage. The sidewall-width difference of 40 nm could be sufficiently detected by using the test structure with the S pitch of about 60 nm. The R-1 versus S characteristics showed the unstable resistance variations in the narrow S region less than 0.3 µm, which corresponded to the minimum S for the process used for the test device fabrication and suggested that various micro-loading effects seriously affected on the characteristics.

A 0.1-µm gate-length GaAs MESFET technology is reported. A 48.3-GHz dynamic-frequency divider, and an amplifier with 20-dB gain and 17.5-GHz bandwidth are successfully fabricated by integrating over-100-GHz-cut-off frequency MESFETs using a new lightly-doped drain structure with a buried p-layer (BP-LDD) device structure.

We have developed a planar devic technology consisting of 0.15-µm Au/WSiN-gate GaAs-heterostructure MESFETs (HMESFETs) fabricated by self-aligned ion-implantation. The gate-drain breakdown voltage has been improved to 10 V by using an asymmetric LDD structure, and the maximum oscillation frequency is 190 GHz. Because asymmetric and symmetric FETs can be fabricated simultaneously, this technology is suitable for use in making multi-functional millimeter-wave MMICs.

This paper proposes a buried-LATID structure featuring a peaked vertical profile around gate edge for the n- drain unlike the reported conventional LATID structure. As compared to the conventional LATID FETs, the deep-submicron buried-LATID FETs achieve improved circuit speed by 7% (50% compared to LDD FETs) due to suppressed gate-to-drain capacitance and improved lifetime by 10 times (300 times compared to LDD FETs). The buried-LATID FETs are very promising for deep-submicron MOSFETs to achieve improved performance and hot-carrier reliability at the same time.

Leakage enhancement after an ESD event has been analyzed for output buffer LDD MOSFETs. The HBM ESD failure threshold for the LDD MOSFETs is only 200-300 V and the failure is the leakage enhancement of the off-state MOSFETs called as "soft breakdown" leakage. This leakage enhancement is supposed to be caused by trapped electrons in the gate oxide and/or creation of interface states at the gate overlapped drain region due to snap-back stress during the ESD event. The mechanism of the lekage can be explained by band-to-band and/or interface state-to-band tunneling of electrons. The improvement of the HBM ESD threshold has been also evaluated by using two types of drain engineering which are additional arsenic implantation for the output LDD MOSFETs and "offset" gate MOSFET as a protection circuit for the output pins. By using these drain engineering, the threshold can be improved to more than 2000 V.

A CMOS design to achieve high drivability is examined for lower power supply voltage in 0.5 µm ULSI. The design consists of two points. (1) A very narrow (50 nm) sidewall is used to achieve high drivability and also to obtain hot-carrier-reliability. (2) A retrograded channel profile with NMOS and PMOS is designed to achieve high drivability and also to reduce short channel effect. It is shown that the propagation delay times (tpd) of a unloaded Inverter and a loaded 2-way NAND gate are improved 30% with the newly designed CMOS, compared with the conventionally designed CMOS. It is also proved that the tpd keeps the scaling trend of the previous-5 V-era even in 3.3 V-era by adapting the newly designed CMOS. Moreover, 7.1 ns multiplication time of 1616-bit multiplier is obtained under 0.5 µm design rule.

Hot-carrier characteristics in ultra-thin SOI MOSFET's (T-SOI MOSFET's) with gate-overlapped LDD have been investigated. The change in transistor static characteristics after hot carrier stress was mainly observed as positive threshold voltage (Vt) shifts due to trapped electrons, while in bulk-Si MOSFET's drain current degradation was dominant. The hot-carrier life time in T-SOI MOSFET's was comparable to that in bulk-Si devices at low drain voltage, but the life time dependence on drain voltage was different from that in bulk-Si MOSFET's, and the Vt degraded rapidly at the condition that parasitic bipolar breakdown began to occur. This implies that the drain supply voltage in T-SOI MOSFET's is determined directly by parasitic bipolar breakdown voltage unlike bulk-Si MOSFET's in which it is determined by hot-carrier reliability. The gate-overlapped LDD structure was compared with single drain structure and proved to provide better hot-carrier endurance by the improvement of the parasitic bipolar breakdown voltage. The hot-carrier reliability in the back channels of T-SOI MOSFET's was also investigated, and it was found that the back channel tends to be degraded more easily than front channel with large positive Vt shifts. These results suggest that the front Vt shifts in T-SOI devices are related with electron injection into the back surface of the T-SOI layer through charge coupling at the condition that the parasitic bipolar breakdown occurs.