In this research, we investigated the metal-ferroelectric-semiconductor field-effect transistors (MFSFETs) with 5nm thick nondoped HfO2 gate insulator by decreasing the sputtering power for Pt gate electrode deposition. The leakage current was effectively reduced to 2.6×10-8A/cm2 at the voltage of -1.5V by the sputtering power of 40W for Pt electrode deposition. Furthermore, the memory window (MW) of 0.53V and retention time over 10 years were realized.

In this research, we investigated the effect of Hf inter layer and chemical oxide on Si(100) substrate on the ferroelectric undoped HfO2 deposition. In case with 1 nm-thick Hf inter layer, equivalent oxide thickness (EOT) was decreased from 6.0 to 4.8 nm for 10 nm-thick HfO2 with decreasing annealing temperature. In case with 0.5 nm-thick chemical oxide, EOT was decreased from 3.9 to 3.6 nm in MFS diodes for 5 nm-thick HfO2. The MFSFET was fabricated with 10 nm-thick HfO2 utilizing Hf inter layer. The subthreshold swing was improved from 240 mV/dec. to 120 mV/dec. and saturation mobility was increased from 70 cm2/(Vs) to 140 cm2/(Vs) by inserting Hf inter layer.

In this paper, we have investigated the etching selectivity of HfN encapsulating layer for high quality PtHf-alloy silicide (PtHfSi) formation with low contact resistivity on Si(100). The HfN(10 nm)/PtHf(20 nm)/p-Si(100) stacked layer was in-situ deposited by RF-magnetron sputtering at room temperature. Then, silicidation was carried out at 500°C/20 min in N2/4.9%H2 ambient. Next, the HfN encapsulating layer was etched for 1-10 min by buffered-HF (BHF) followed by the unreacted PtHf metal etching. We have found that the etching duration of the 10-nm-thick HfN encapsulating layer should be shorter than 6 min to maintain the PtHfSi crystallinity. This is probably because the PtHf-alloy silicide was gradually etched by BHF especially for the Hf atoms after the HfN was completely removed. The optimized etching process realized the ultra-low contact resistivity of PtHfSi to p+/n-Si(100) and n+/p-Si(100) such as 9.4×10-9Ωcm2 and 4.8×10-9Ωcm2, respectively, utilizing the dopant segregation process. The control of etching duration of HfN encapsulating layer is important to realize the high quality PtHfSi formation with low contact resistivity.

In this paper, we have investigated the PdEr-silicide formation utilizing a developed PdEr-alloy target for sputtering, and evaluated the contact resistivity of PdEr-silicide layer formed on n-Si(100) by dopant segregation process for the first time. Pd2Si and ErSi2 have same hexagonal structure, while the Schottky barrier height for electron (Φbn) is different as 0.75 eV and 0.28 eV, respectively. A 20 nm-thick PdEr-alloy layer was deposited on the n-Si(100) substrates utilizing a developed PdEr-alloy target by the RF magnetron sputtering at room temperature. Then, 10 nm-thick TiN encapsulating layer was in-situ deposited at room temperature. Next, silicidation was carried out by the RTA at 500 for 5 min in N2/4.9%H2 followed by the selective etching. From the J-V characteristics of fabricated Schottky diode, qΦbn was reduced from 0.75 eV of Pd2Si to 0.43 eV of PdEr-silicide. Furthermore, 4.0x10-8Ωcm2 was extracted for the PdEr-silicide to n-Si(100) by the dopant segregation process.

In this paper, we have investigated the characteristics of PdYb-silicide layer formed by the silicidation of Pd/Yb/n-Si(100) stacked structures for the first time. Pd (12-20 nm)/Yb (0-8 nm) stacked layers were deposited on n-Si(100) substrates by the RF magnetron sputtering at room temperature. Then, 10 nm-thick HfN encapsulating layer was deposited at room temperature. Next, silicidation was carried out by the RTA at 500°C/1 min in N2 followed by the selective etching. From the J-V characteristics of fabricated Schottky diode, Schottky barrier height (SBH) for electron was reduced from 0.73 eV of Pd2Si to 0.4 eV of PdYb-silicide in case the Pd/Yb thicknesses were 14/6 nm, respectively.

We have investigated PtHf silicide formation utilizing a developed PtHf-alloy target to realize low contact resistivity for the first time. A 20 nm-thick PtHf-alloy thin film was deposited on the n-Si(100) by RF magnetron sputtering at room temperature. Then, silicidation was carried out by rapid thermal annealing (RTA) system at 450-600°C/5 min in N2/4.9%H2 ambient. The PtHf-alloy silcide, PtHfSi, layers were successfully formed, and the Schottky barrier height (SBH) for electron of 0.45 eV was obtained by 450°C silicidation. Furthermore, low contact resistivity was achieved for fabricated PtHSi such as 8.4x10-8 Ωcm2 evaluated by cross-bridge Kelvin resistor (CBKR) method.

Ga-doped ZnO thin films were prepared by RF magnetron sputtering. The effects of adding H2 to pure Ar sputtering gas were investigated. In the case of pure Ar at 2 Pa, the resistivity is 7.4510-3 Ωcm, whereas for Ar+1%H2 at 0.3 Pa, it markedly decreases to 2.5210-4 Ωcm. In this case, the carrier density and Hall mobility are 1.121021 cm-3 and 23.4 cm2/Vs, respectively. This conductive film also exhibits a transmittance of 90% within the visible-wavelength range. The addition of H2 and the decrease in the pressure results in the fabrication of a significantly more transparent and conductive film.

Rugate thin film optical filters are useful for designing arbitrary-shaped spectra, such as multistep or triangular spectra. A technique for synthesizing the refractive index distribution of rugate filters was used to suppress unwanted ripples on the spectrum. The refractive index of an amorphous hydrogenated silicon oxide (a-SiOx:H) rugate thin film was minutely controlled with a resolution of 0.001 using radio-frequency (RF) magnetron sputtering. The fabricated rugate filters had multistep bands over a wavelength range of 1260-1670 nm or good linearity over 1290-1650 nm.

A new technique incorporating combinatorial deposition to develop thin-film phosphors by r.f. magnetron sputtering is demonstrated using subdivided powder targets. In comparison with development using conventional r.f. magnetron sputtering, the atomic ratios of Si and Ge as well as the Mn content in Zn2Si1-XGeXO4:Mn thin film phosphors could be more efficiently optimized in order to obtain the highest intensity in electroluminescent and photoluminescent emissions. High luminances of 11800 and 1536 cd/m2 were obtained in Zn2Si0.6Ge0.4O4:Mn thin-film electroluminescent devices fabricated under optimized conditions and driven at 1 kHz and 60 Hz, respectively.

In order to improve the critical current density (Jc) of c-axis-oriented EuBa2Cu3O7 (c-EBCO) thin films deposited on R-plane sapphires (R-Al2O3) with a CeO2 buffer layer, insertion of an Sm2O3 buffer layer and optimization of its deposition condition were attempted. The effects of substrate temperature and film thickness of an Sm2O3 buffer layer on the orientation, crystallinity, surface morphology and superconducting properties of EBCO thin films were examined. As a result, EBCO thin films with Jc = 5.7 MA/cm2 at 77.3 K were obtained on a sapphire with a CeO2(80 )Sm2O3(200 ) buffer layer. Epitaxial relations of sputter-deposited films were clarified.

The sputter-deposition process of TiO2 thin films was investigated. When an oxide target is used, high-rate deposition above 57 nm/min can be realized by sputtering under a condition of low oxygen gas content. Under this sputtering condition, a Ti rich surface layer is formed by selective sputtering of oxygen atoms, and a large amount of Ti atoms are sputtered from this layer. The deposition rate, however, decreases steeply as the oxygen gas content increases. This decrease can be explained as follows. When a sufficient amount of oxygen gas is supplied into the chamber during sputtering, the oxygen atoms which are missing from the target surface by selective sputtering are filled up immediately. This leads to a very low deposition rate of the film, because only oxygen atoms are sputtered from the target. Therefore, the suppression of the incidence of oxygen gas to the target surface and a sufficient of oxygen supply to the substrate are necessary to realize the high-rate deposition of stoichiometric TiO2 films. From this point of view, using an oxide target instead of a metal target is useful for realizing a stable high-rate deposition of the film, since the amount of oxygen gas introduced in to the sputtering chamber can be reduced significantly. In addition, it was confirmed that pulse sputtering method is a useful technique for the deposition of TiO2 thin films. Meanwhile, low-voltage sputtering technique was difficult to use for the film deposition because of its low deposition rate.

By depositing insulating layers on oxide superconducting films, the films generally deteriorate. When an insulating multilayer of CeO2(50 )SrTiO3(200 ) was grown on 800--thick EuBa2Cu3O 7-δ (EBCO) films with Tce's (Tc endpoint) above 90 K, the films exhibited Tce's of about 40 K. Recovery of the deteriorated films was carried out by two treatment methods. A pure oxygen treatment, where the deteriorated films were annealed at a temperature (Tsa) of 550C and an oxygen pressure (PO2) of 100 kPa for 60 min, and then naturally cooled, restored the films with Tce's of about 60 K. An activated oxygen plasma (AOP) treatment, where the deteriorated films were exposed to oxygen plasma at a Tsa=550C for 40 min and subsequently oxygen gas was introduced into the chamber up to 2 kPa and then naturally cooled, restored the films with Tce's of about 84 K. The AOP-treated film was recovered with a cooling rate of less than 6.8C/min, and exhibited Tce of 90 K. The AOP-treated film took in oxygen more effectively than the pure oxygen-treated film with the cooling process at less than PO2=100 kPa.