We demonstrate heteroepitaxial growth of GaAs/Ge buffer layers for fabricating 1.3-µm range metamorphic InGaAs-based multiple quantum well (MQW) lasers in which the Ge buffer layer is grown using a metal-organic Ge precursor, iso-butyl germane, in a conventional metal-organic vapor phase epitaxy reactor. This enables us to grow Ge and GaAs buffer layers in the same reactor seamlessly. Transmission electron microscopy and X-ray diffraction analyses indicate that dislocations are well confined at the Ge/Si interface. Furthermore, thermal-cycle annealing significantly improves crystalline quality at the GaAs/Ge interface, resulting in higher photoluminescence intensity from the MQWs on the buffer layers.

We have developed membrane distributed Bragg reflector (DBR) lasers on thermally oxidized Si substrate (SiO2/Si substrate) to evaluate the parameters of the on-Si lasers we have been developing. The lasers have InGaAsP-based multi-quantum wells (MQWs) grown on InP substrate. We used direct bonding to transfer this active epitaxial layer to SiO2/Si substrate, followed by epitaxial growth of InP to fabricate a buried-heterostructure (BH) on Si. The lateral p-i-n structure was formed by thermal diffusion of Zn and ion implantation of Si. For the purpose of evaluating laser parameters such as internal quantum efficiency and internal loss, we fabricated long-cavity lasers that have 200- to 600-µm-long active regions. The fabricated DBR lasers exhibit threshold currents of 1.7, 2.1, 2.8, and 3.7mA for active-region lengths of 200, 300, 400, and 600µm, respectively. The differential quantum efficiency also depends on active-region length. In addition, the laser characteristics depend on the distance between active region and p-doped region. We evaluated the internal loss to be 10.2cm-1 and internal quantum efficiency to be 32.4% with appropriate doping profile.

Effect of the post-growth annealing on the morphology of a Ge mesa selectively grown on Si was studied from the viewpoint of near-infrared photodiode applications. By ultrahigh-vacuum chemical vapor deposition, Ge mesas were selectively grown at 600 on Si (001) substrates partially covered with SiO2 masks. The as-grown Ge mesas showed trapezoidal cross-sections having a top (001) surface and {311} sidewall facets, as similar to previous reports. However, after the subsequent post-growth annealing at ~800 in the ultrahigh-vacuum chamber, the mesas were deformed into rounded shapes having a depression at the center and mounds near the edges. Such a deformation cannot be observed for the samples annealed once after cooled and exposed to the air. The residual hydrogen atoms on the Ge surface from the germane (GeH4) decomposition is regarded as a trigger to the observed morphological instability, while the final mesa shape is determined in order to minimize a sum of the surface and/or strain energies.

The effect of a nonmagnetic hcp-underlayer on the epitaxial growth of CoCr19Pt10 magnetic layers on substrates of Al2O3(0001) single-crystal has been investigated. Thin films of (0001)-oriented single-crystal CoCr19Pt10 were obtained by employing non-magnetic underlayers of CoCr25Ru25 and CoCr25Ru25/Ti, while thin films of polycrystalline CoCr19Pt10 were grown after the deposition of underlayers of TiCr10 and CoCr40. The growth of thin film CoCr19Pt10 on a Ti(0001) underlayer was interpreted as quasi-hetero-epitaxial where the continuity of the lattice across the interface is disturbed while the overall crystallographic relationship between the two layers is maintained. A thin film of epitaxially grown CoCr19Pt10 has a compositional variation of a few percent across the film plane in terms of elements that forms the alloy.

A uniform raised-salicide technology has been investigated using both uniform selective-epitaxial-growth (SEG) silicon and salicide films, to reduce a junction leakage current of shallow source/drain (S/D) regions for high-performance CMOS devices. The uniform SEG-Si film without pits is formed by using a wet process, which is a carbon-free oxide removal only using a dilute hydrofluoric acid (DHF) dipping, prior to the Si-SEG process. After a titanium-salicide formation using a conventional two-step salicide process, this uniform SEG-Si film achieves good S/D junction characteristics. The uniform titanium-salicide film without bowing into a silicon is formed by a smaller Ti/SEG-Si thickness ratio, which results in a low sheet resistance of 5 Ω/sq. without a narrow-line effect. Furthermore, the drive current is maximized by this raised-salicide film using a Ti/SEG-Si thickness ratio of 1.0.

Microstructures of CoCr-alloy thin film media were investigated by cross-sectional transmission electron microscopy focussing on the initial growth region of the magnetic layer grown on nonmagnetic underlayers. An introduction of nonmagnetic hcp-CoCrRu layer between an hcp-CoCrPt recording layer and an hcp- or a bcc-underlayer improved the crystallographic quality of the initial growth region. Sharp compositional distributions of alloying elements at the interfaces of a CoCrPt/CoCrRu/CrTi perpendicular medium and a CoCrPt/CoCrRu/CrTi longitudinal medium were respectively confirmed by electron energy loss spectroscopy employing a finely focussed electron beam. Coercivity and squareness of the thin film media increased by realizing good hetero-epitaxy between the nonmagnetic and the magnetic hcp-layers.

A 2-step deposition technique was introduced in the heteroepitaxial growth of barium titanate (BaTiO3) thin films. Heteroepitaxial BaTiO3 films were prepared on a SrRuO3/SrTiO3 substrate by radio frequency (RF) magnetron sputtering with three kinds of deposition method: low RF-power deposition, 2-step deposition, and high power deposition. The crystallographic and ferroelectric properties were evaluated for the heteroepitaxial films. When the epitaxial capacitor was prepared by the 2-step deposition technique, the ferroelectric remanent polarization, 2Pr, was maximized. The optimized deposition condition to improve the crystal quality is discussed in terms of damage and diffusion, which could be introduced into the oxide films during the epitaxial growth, and controlled by the RF-power and deposition time, respectively.

Epitaxial SrTiO3(STO) film on epitaxial (Ti,Al)N/Si(100) was successfully obtained using a Ti-buffer layer. The SrTiO3 film was (100) oriented and grew in parallel epitaxial relationship (cube-on-cube), i.e., (100)SrTiO3//(100)(Ti,Al)N//(100)Si, <110> SrTiO3//<110> (Ti,Al)N//<110> Si. The Ti-buffer layer was grown on (Ti,Al)N by magnetron sputtering, and the thickness of the buffer layer was 2-10 nm. After the STO film was sputtered, the Ti-buffer layer was changed to polycrystalline anatase-TiO2.

In this paper, the recent development of GaN bulk substrates is reviewed. Among various works on HVPE thick epitaxial growth, the largest free-standing GaN substrates upto 34 cm2 has been first obtained by the HVPE method using NGO substrates, whose lattice constant has a good matching with that of GaN. For developing larger GaN substrates with lower production cost, the ultra-high pressure solution growth method is being developed not only in Poland but also in Japan under "The Light for the 21st Century" national project.

A selectively grown Si1-xGex base heterojunction bipolar transistor (HBT) was fabricated, and effects of Ge and B profiles on the device performance were investigated. Since no obvious leakage current was observed, it is shown that good crystallinity of Si1-xGex was achieved by using a UHV/CVD system with high-pressure H2 pre-cleaning of the substrate. Very high current gain of 29,000 was obtained in an HBT with a uniform Ge profile by both increasing electron injection from the emitter to the base and reducing band gap energy in the base. Since the Early voltage is affected by the grading of Ge content in the base, the HBT with the graded Ge profile provides very high Early voltage. However, the breakdown voltage is degraded by increasing Ge content because of reducing bandgap energy and changing dopant profile. To increase the cutoff frequency, dopant diffusion must be suppressed, and carrier acceleration by the internal drift field with the graded Ge profile has an additional effect. By doing them, an extremely high cutoff frequency of 130 GHz was obtained in HBT with graded Ge profiles.

To investigate the possibility of their application to both high density dynamic and nonvolatile ferroelectric random access memories, heteroepitaxial BaxSr1-xTiO3 (BSTO) thin films with various Ba content from x=0 to 1. 0 were prepared on conductive SrRuO3 electrode films, and the crystallographic, dielectric and ferroelectric properties were investigated. The compositional phase boundary between paraelectric and ferroelectric phase at room temperature was located at about x = 0. 12 in the heteroepitaxial films, indicating a quite different composition to that of the bulk (x = 0. 70). At this composition of x = 0. 12, the dielectric constant attained the maximum value of 740 for the BSTO film with a thickness of 77 nm. The composition with a lager Ba content (x 0. 32) showed ferroelectricity at room temperature. The maximum value of remanent polarization of 2Pr = 0. 38 C/m2 was obtained at the composition of x = 0. 70 in this study.

A 7-mask self-aligned SiGe base bipolar transistor has been newly developed. This transistor offers several advancements to a super self-aligned selectively grown SiGe base (SSSB) transistor which has a selectively grown SiGe-base layer formed by a cold-wall ultra high vacuum (UHV)/CVD system. The advancements are as follows: (1) a BPSG-filled arbitrarywidth trench isolation on a SOI is formed by a high-uniformity CMP with a hydro-chuck for reducing the number of isolation fabrication steps, (2) polysilicon-plug emitter and collector electrodes are made simultaneously using an in-situ phosphorusdoped polysilicon film to decrease the distance between emitter and collector electrodes and also to reduce the fabrication steps of the elecrodes, (3) a n+-buried collector layer is made by a high-energy phosphorus ion-implantation technique to eliminate collector epitaxial growth, and (4) a germanium profile in the neutral base region is optimized to increase the fT value without increasing leakage current at the base-cellector junction. In the developed transistor, a high performance of 80-GHz fT and mask-steps reduction are simultaneously achieved.