A novel fabrication process and materials of LC layers have been developed for three layer LCDs. It is based on LC/resist composite that can be applied to patterning LC layers with high resolution by conventional photolithography processes. Using this process, we fabricated a 2" matrix panel of three GH-LC layers stacked on a substrate for the fist time.

Micropatterning of organosilane self-assembled monolayers (SAMs) was demonstrated on the basis of photolithography using an excimer lamp radiating vacuum ultra-violet (VUV) light of 172 nm in wavelength. This lithography is generally applicable to micropatterning of organic thin films including alkyl and fluoroalkyl SAMs, since its patterning mechanism involves cleavage of C-C bonds in organic molecules and subsequent decomposition of the molecules. In this study, SAMs were prepared on Si substrates covered with native oxide by chemical vapor deposition in which an alkylsilane, that is, octadecyltrimethoxysilane [CH3(CH2)17Si(OCH3)3, ODS] or a fluoroalkylsilane, that is, 1H, 1H, 2H, 2H-perfluorodecyltrimethoxy-silane [CF3(CF2)7CH2CH2Si(OCH3)3, FAS] were used as precursors. Each of these SAMs was photoirradiated through a photomask placed on its surface. As confirmed by atomic force microscopy and x-ray photoelectron spectroscopy, the SAMs were decomposed and removed in the photoirradiated area while the masked areas remained undecomposed. A micropattern of 2 µm in width was successfully fabricated. Furthermore, microstructures composed of two different SAMs, that is, ODS and FAS, were fabricated as follows. For example, an ODS-SAM was first micropatterned by the VUV-lithography. Since, the VUV-exposed region on the ODS-SAM showed an affinity to the chemisorption of organosilane molecules, the second SAM, i. e. , FAS, confined to the photolithographically defined pattern was successfully fabricated. Due to the electron negativity of F atoms, the FAS covered region showed a more negative surface potential than that of the ODS surface: its potential difference was ca. 120 mV as observed by Kelvin probe force microscopy.

This paper reports on the use of microelectronic test structures to characterise a novel fabrication technique for thin-film electronic circuit boards. In this technology circuit tracks are formed on paper-like substrates by depositing films of a metal-loaded ink via a standard lithographic printing process. Sheet resistance and linewidth for both horizontal and vertical lines are electrically evaluated and these compared with optical and surface profiling measurements.

Different-wavelength distributed feedback laser diodes with integrated modulators (DFB/MODs) are fabricated on a single wafer operate at wavelengths from 1. 52 µm to 1. 59 µm, a range comparable to the expanded Er-doped fiber amplifier gain band. A newly developed field-size-variation electron-beam lithography enables grating pitch to be controlled to within 0. 0012 nm, and narrow-stripe selective metal-organic vapor-phase epitaxy is used to control the bandgap wavelength of laser active layers and modulator absorption layers for each channel. The channel spacing of fabricated 40-channel DFB/MODs is 214 GHz in average with a standard deviation of 0. 39 nm. Very uniform lasing and modulating performances are achieved, such as threshold currents about 10 mA and extinction ratios about 20 dB at -2 V in average. These devices have been used to demonstrate 2. 5-Gb/s transmission over 600 km of a normal fiber with a power penalty of less than 1 dB.

Well-defined wavelength distributed feedback laser diodes (DFB-LDs) are required in WDM network systems. Since the EDFA gain bands have been expanded, even more wavelengths are needed for large-capacity dense-WDM transmission systems. A precisely pitch-controlled Bragg grating fabricated by electron beam (EB) lithography is very attractive for realizing these DFB-LDs. This paper describes this precise pitch- and phase-controlled grating delineated by a novel method called weighted-dose allocation variable-pitch EB-lithography (WAVE). In this method, an EB-dose profile for the grating is precisely controlled by a combination of the allocation and weighting of multiple exposures. This enables us to fabricate a precise fixed-pitch grating as well as a flexible grating with a continuously chirped structure. The stitching error at the exposure field boundary, the grating pitch, and the phase shift were evaluated by using a moire pattern generated by superimposing the microscope raster scan and the grating on a wafer. We also estimated amounts of the stitching errors from fabricated and calculated lasing characteristics, and clarified that the affect of the errors on the single-mode stability of LDs is negligible. Precise wavelength controlled λ/4 phase shifted DFB-LDs were successfully demonstrated as a result of both the WAVE method and the highly uniform MOVPE crystal growth.

A series of transparent photochemical acid-generators (PAGs) has been successfully prepared and investigated to apply ArF excimer-laser lithography. These PAGs were synthesized as new alkylsulfonium salts that have cycloalkyl groups but no aromatic ones. They were almost transparent at 193. 4 nm and have high acid-generation efficiency enough to use for ArF excimer-laser resists. The photochemical reaction of these alkylsulfonium salts occurs mainly due to the S-C bond fission. A resist utilizing the PAGs was capable to resolve a 0. 2µm L/S pattern at a 50-mJ/cm2 dose with an aqueous alkaline developer. These PAGs are promising materials for use in ArF excimer-laser lithography.

A new yield prediction model has been developed, which can successfully describe the actual chip fabrication yield. It basically consists of modeling of particles deposited on wafer surface, considering the change in their size and spatial distribution due to the subsequent processing steps and a new concept of virtual line width in pattern layouts. It is confirmed that this yield prediction model serves as an effective navigator for improvement/optimization of fabrication lines such as pointing out the process step/equipments to be modified for yield improvements.

0.15 µm CMOS transistors have been fabricated. TiSi2 salicide was used for the gate electrode and source/drain to reduce parasitic resistance. Electron beam (EB) lithography was used for the gate patterning. Since the channel impurity was implanted only around the gate to reduce the junction capacitance, a reasonably short ring oscillator delay of 33 ps was obtained at 1.9 V supply voltage. The parasitic resistance and capacitance contribution on the delay time was analyzed by SPICE simulation. It was shown that the localized channel implant is effective for scaling the delay time and power consumption, because the source/drain size difficult to scale down to as small as the gate length.

The progress of LSI technologies makes it possible to fabricate 256 MDRAM. However, it depends on the cost effectiveness of device fabrication that LSI memory can continue to be the technology driver or not. It is indispensable to make the device, process, and equipment as simple as possible for next generation LSI. For example, wavefront technologies in lithography, high energy ion implantation, and simple DRAM cell with SOI structure or high dielectric constant capacitor, are under development to satisfy both device performance improvement and process simplicity.

An electron beam cell projection system has been developed that can effectively expose the fine, demagnified resultant pattern of repeated and non-repeated patterns such as the 256 Mb DRAM on a semiconductor wafer. Particular attention was given to the beam shaping and deflecting optics, which has two stage deflectors for the cell projection beam selection as well as the beam sizing, and three stage deflectors for objective deflection. The cell mask with a rectangular aperture and multiple figure apertures is fabricated by modified Si wafer processes. A new exposure control data for the cell projection is proposed. This data is fitted for the combination of pattern data for the cell mask projection and pattern data for the variable rectangular shape beam within the divided units of the objective deflection. On this exposure system, selective exposure of the desired pattern becomes possible on the semiconductor wafer while a mounting stage of the wafer is being moved, even if the pattern exposure of the repeated and non-repeated patterns is to be carried out. The total overhead time for selecting a subset of multiple figures and a rectangular aperture of the cell mask is less than 5 seconds/wafer. The estimated throughput of this system is approximately 20 wafers/hour.

A modified illumination technique recently developed is known to improve the resolution and DOF (depth of focus) dramatically. But, it requires substantial modification in optical projection system and has some problems such as low throughput caused by low intensity and poor uniformity. And it is very difficult to adjust illumination source according to pattern changes. To solve these problems, we developed a new illumination technique, named ATOM (Advanced Tilted illumination On Mask) which applies the same concept as quadrupole illumination technique but gives many advantages over conventional techniques. This newly inserted mask gives drastic improvements in many areas such as DOF, resolution, low illumination intensity loss, and uniformity. In our experiments, we obtained best resolution of 0.28µm and 2.0µm DOF for 0.36µm feature sizes with i-line stepper, which is two times as wide as that of conventional illumination technique. We also obtained 0.22µm resolution and 2.0µm DOF for 0.28µm with 0.45NA KrF excimer laser stepper. For complex device patterns, more than 1.5 times wider DOF could be obtained compared to conventional illumination technique. From these results, we can conclude that 2nd generation of 64M DRAM with 0.3µm design rule can be printed with this technology combined with high NA (0.5) i-line steppers. With KrF excimer laser stepper, 256M DRAM can be printed with wide DOF.

New critical-dimension controlling technique of off-axis illumination for aperiodic patterns has been developed. By means of arranging not-imaging additional pattern near 0.25 micron isolated patterns, the depth of focus of an isolated pattern was improved as well as the periodic patterns. Simulation and experimental results were verified on a 0.48 numerical-aperture, KrF excimer laser stepper. Using new deep-ultra-violet hardening technique for chemically amplified positive resist, the critical dimension loss of resist pattern was prevented. 0.25 micron design rule pattern was obtained with excellent mask linearity without critical-dimension-loss. The combination techniques are achieved quarter micron design rule complex circuit pattern layouts.

A 0.25-µm BiCMOS technology has been developed using three sophisticated technologies; the HSST/BiCMOS device, synchrotron orbital radiation (SOR) X-ray lithography, and an advanced two-level metallization. The HSST/BiCMOS provides a 25.4-ps double-poly bipolar device using High-performance Super Self-Aligned Process Technology (HSST), and a 42 ps/2 V CMOS inverter. SOR lithography allows a 0.18 µm gate and 0.2 µm via-hole patternings by using single-level resists. The metallization process features a new planarization technique of the 0.3-µm first wire, and a selective CVD aluminum plug for a 0.25 µm via-hole with contact resistance lower than 1Ω. These 0.25-µm technologies are used to successfully fabricate a 4 KG 0.25 µm CMOS gate-array LSI on a BiCMOS test chip of 12 mm square, which operates at 58 ps/G at 2 V. This result demonstrates that SOR lithography will pave the way for the fabrication of sub-0.25-µm BiCMOS ULSIs.

Material representations and algorithms are presented for simulation of nanometer lithography. Organic polymer resists are modeled as collections of overlapping spheres, with each sphere representing a polymer chain. Exposure and post-exposure bake steps are modeled at the nanometer scale for both positive and negative resists. The development algorithm is based on the Poisson removal probability for each sphere in contact with developer. The Poisson removal rate for a given sphere is derived from a mass balance relationship with a macroscopic development rate model. Simulations of electron beam lithography with (poly) methyl methacrylate and Shipley SAL-601 reveal edge roughness standard deviations from 2 to 3 nm, leading to linewidth peak-to-peak 3σ variation of 15 to 22 nm. Typical simulations require about 2 MBytes and under 5 minutes on a Sun Sparc 10/41 engineering workstation.

256 MbDRAM chips have been fabricated by mix-and-match method using high NA KrF excimer laser stepper and i-line stepper. In the case of KrF stepper, the negative siloxane resist is used for rectangular and wiring patterns and the positive novolak-resin resist is used for hole patterns. Both of these two kinds of resist produce accurate pattern shape, allow-able pattern profile, satisfactory depth of focus and sufficient overlay accuracy for device fabrication in 0.25 µm design rule.

This paper describes the potential of KrF excimer laser lithography for the development and production of 64 M and 256 Mbit DRAMs on the basis of our recent developed results. Quarter micron KrF excimer laser lithography has been developed. A new chemically amplified positive resist realizes high stability and process compatibility for 0.25 micron line and space patterns and 0.35 micron contact hole patterns. This developed resist is characterized as the increase of dissolution characteristics in exposed areas, and hence means the high resolution is obtained. A multiple interference effect was greatly reduced by using our over coat film or anti-reflective coating. This over coat film has no intermixing to the resist and it is simultaneously removed when the resist is developed. This anti-reflective coating has low etch selectivity to the resist, and hence the over coat film is etched away when etching the substrate. The two major results indicate that the KrF excimer laser lithography is promising for the development of 256 MDRAMs.

The minimum transferable linewidth by X-ray is derived using waveguide analysis. The minimum width is determined by the refractive index of the absorber and does not depend on the X-ray wavelength. Therefore there is an optimum mask aperture size which provides the minimum linewidth. By using Au as the absorber, 8 nm linewidth is attainable.

Reduction in the illumination wavelength for exposure leads to higher resolution while keeping the depth of focus. Thus, KrF excimer laser lithography has been positioned as the next generation lithography tool behind g/i-line optical lithography, and many studies have been investigated. In the early days, the excimer laser lithography had many inherent problems, such as inadequate reliability, difficult maintainability, high operating cost, and low resolution and sensitivity of resist materials. However, the performance of the excimer laser stepper has been improved and chemical amplification resists have been developed for the past decade. At present, KrF excimer lithography has reached the level of trial manufacturing of lower submicron ULSI devices beyond 64 Mbit DRAMs.

Fabrication of 0.2 to 0.3 µm features is vital for future ultralarge scale integration devices. An area of particular concern is whether optical lithography can delineate such feature sizes, i.e., less than the exposure wavelength. The use of a phase shift mask is one of the most effective means of improving resolution in optical lithography. This technology basically makes use of the interference between light transmitting through adjacent apertures of the mask. Various types of phase shift masks and their imaging characteristics are discussed and compared with conventional normal transmission masks. To apply these masks effectively to practical patterns, a phase shifter pattern design tool and mask repair method must be established. The phase shifting technology offers a potential to fabricate 0.3 µm features by using the current i-line stepper, and 0.2 µm features by using excimer laser stepper.

New illumination principle for photolithography is investigated. As the optical microlithography approaches its own limit, it becomes apparent that the simple extrapolation of the present technology is not sufficient for the future demands. This paper introduces the new imaging technology that overcomes such a boundary. First, the basic imaging formulae are analyzed and the illumination light is classified into 4 cases. 3-beam case and 2-beam case carry the object information, and the comparison of these 2 cases is carried out theoretically. It can be shown that the 2-beam case has greater depth of focus than that of the 3-beam case, though it has inferior contrast at the best focus. Since this degradation, however, has little effect, the enlargement of the depth of focus can be achieved. In reality, 2-dimensional imaging must be considered. Quadrupole effect can be deduced by the results of the analysis. It shows great improvement in the depth of focus near resolution limit. As it can be applied to the conventional masks, it can be a promising candidate for fhe future lithography. Experimental results are also shown to demonstrate the analysis.