A bi-directional and multi-channel wireless telemetry capsule, 11 mm in diameter, is presented that can transmit video images from inside the human body and receive a control signal from an external control unit. The proposed telemetry capsule includes transmitting and receiving antennas, a demodulator, decoder, four LEDs, and CMOS image sensor, along with their driving circuits. The receiver demodulates the received signal radiated from the external control unit. Next, the decoder receives the stream of control signals and interprets five of the binary digits as an address code. Thereafter, the remaining signal is interpreted as four bits of binary data. Consequently, the proposed telemetry module can demodulate external signals so as to control the behavior of the camera and four LEDs during the transmission of video images. The proposed telemetry capsule can simultaneously transmit a video signal and receive a control signal determining the behavior of the capsule itself. As a result, the total power consumption of the telemetry capsule can be reduced by turning off the camera power during dead time and separately controlling the LEDs for proper illumination of the intestine.

A large-signal simulation program for multi-stage power amplifier modules by using a novel interpolation is presented. This simulation program has the function to make the Load-Pull and Source-Pull (LP/SP) data required for the simulation. By using the interpolation, a lot of LP/SP data can be made from a small number of measured LP/SP data. The interpolation is based on the calculation method using a two-dimensional function. By using the simulation program, we can calculate the large-signal characteristics depended on frequency and temperature of the multi-stage amplifier module. We apply the simulation program to the design of the amplifier. The calculated and measured results agree well. The accuracy of the presented interpolation is confirmed. It is considered that the presented program is useful to calculate large-signal characteristics of the amplifier module.

We have developed a new planar lightwave circuit (PLC) platform eliminating Si terraces for hybrid integrated optical modules. This PLC platform has the advantage of a lower fabrication cost than the conventional PLC platform with an Si terrace, because it does not require fabrication processes such as Si terrace forming and mechanical polishing. Using our new PLC platform structure, we fabricated a transceiver for optical access networks and an 8-channel multi-channel photoreceiver for wavelength division multiplexing (WDM) interconnection systems.

We have developed a new planar lightwave circuit (PLC) platform eliminating Si terraces for hybrid integrated optical modules. This PLC platform has the advantage of a lower fabrication cost than the conventional PLC platform with an Si terrace, because it does not require fabrication processes such as Si terrace forming and mechanical polishing. Using our new PLC platform structure, we fabricated a transceiver for optical access networks and an 8-channel multi-channel photoreceiver for wavelength division multiplexing (WDM) interconnection systems.

A 50-Gbit/s demultiplexer IC module that uses 0.1-µm InAlAs/InGaAs/InP HEMTs is reported. The maximum error-free operation bit-rate of a fabricated module is 50 Gbit/s, and a wide phase margin of 170 degrees is obtained at 43 Gbit/s. 50-Gbit/s demultiplexing is the fastest performance of all packaged demultiplexer ICs yet reported.

Aiming at lower cost and further miniaturization, we developed a new optical coupling system for use as an optical interface of a parallel optical interconnect module, called ParaBIT-1. It consists of a new-structure 24-fiber bare fiber (BF) connector whose main parts are made of molded plastic and a 24-channel optical coupling component using new polymeric optical waveguide film. To prevent bare fibers from breaking, the BF connector plug has a fiber protector. This BF connector can be joined by direct physical contact between bare fibers in fiber guide holes with a 250-µm pitch. The buckling forces of the fibers themselves secure the physical contacts. The average measured insertion loss of the 24-fiber BF connector was 0.05 dB, and the return losses were over 35 dB. The optical coupling components are composed of a 24-ch polymeric optical waveguide film with 45 mirrors and the 24-fiber BF connector interface, and can be assembled by passive alignment. The high thermal stability of the film allows soldering, and the film is fabricated by direct photo patterning. The average insertion losses of the components for transmitter and receiver modules were 1.28 and 1.35 dB, respectively.

The authors report ultra-high-speed digital IC modules that use 0.1-µm InAlAs/InGaAs/InP HEMTs for broadband optical fiber communication systems. The multiplexer IC module operated at up to 70 Gbit/s, and error-free operation of the decision IC module was confirmed at 50 Gbit/s. The speed of each module is the fastest yet reported for its kind.

An experimental 640-Gbit/s ATM switching system is described. The switching system is scalable and quasi-non-blocking and uses hardware self-rearrangement in a three-stage network. Hardware implementation results for the switching system are presented. The switching system is fabricated using advanced 0.25-µm CMOS devices, high-density multi-chip-module (MCM) technology, and optical wavelength-division-multiplexing (WDM) interconnection technology. A scalable 80-Gbit/s switching module is fabricated in combination with a developed scalable-distributed-arbitration technique, and a WDM interconnection system that connects multiple 80-Gbit/s switching modules is developed. Using these components, an experimental 640-Gbit/s switching system is partially constructed. The 640-Gbit/s switching system will be applied to future broadband ATM networks.

Attempts have been made to evaluate and investigate the radiated emissions from fiber optical modules that are currently available in the market. Far electric field strength measurements show that the radiated emission has a peak at a high-order harmonic wave of the fundamental pulse frequency and reaches a level exceeding the limiting values of the CISPR noise specifications. Near magnetic field distribution measurements show that the source of the interference noise lies between a light emitting diode (LED) module and an LED driver. These measurements are compared with those of electromagnetic field calculations based on a high-frequency equivalent circuit. As a result, it was established that both the peaking effects of deformed pulse waves transmitted between an LED module and an LED driver and the radiation characteristics of the optical transmitter circuit act as factors for increasing the radiation level of the peak frequencies in the radiated emission from fiber optical modules.

This paper describes a monolithic microwave integrated circuit (MMIC) active module with small phase variation and low insertion loss for beamforming network in S-band. The MMIC active module composed of a digital phase shifter, a digital attenuator and a buffer amplifier, has characteristic to control amplitudes and phase shifts by using digital control signals. By using the digital attenuator, the MMIC active module has obtained the excellent performances. This paper also describes the exact on-state resistance of FET switch for designing the digital attenuator.

Miniaturized opto and microwave receiver module using DCCPWs (Double Conductor Coplanar Waveguides) have been developed for active phased array antennas. The module comprised by a microstrip-to-slot transition, two chips of low-noise MMIC amplifiers, and a laser diode module is fabricated on an ultra-thin package with 10301.5 mm3 in size and 2 g in weight to achieve an ultra-thin structure of active phased array antenna panels. The ultra-thin structure is attributed to the design of low-noise MMIC amplifiers using DCCPWs and laser diode modules using silicon V-groove technology and fiber alignment method.

This paper reports on the development of an eyeglass-type infrared-controlled telephone communication interface for the disabled. This system is comprised of four major components: A) a headset; B) an infrared transmitting module; C) an infrared receiving/signal-processing module; and D) a main controller, the Intel-8951 microprocessor. The headset with a tongue-touch panel, a wireless earphone, and a wireless microphone. The infrared transmitting module utilizes a tongue touch panel via tongue-touch circuitry which is converted to an infrared beam and a low power laser (<0.1 mW) beam. The infrared receiving/signal-processing module, receives the infrared beam and fine tunes the unstable infrared beam into standard pulses which are used as control signals. The main controller is responsible for detecting the input signals from the infrared receiving/signal-processing module and verifying these signals with the mapping table in its memory. After the signal is verified, it is released to control the keys of the telephone interface. This design concept was mainly based on the idea that the use of an infrared remote module fastened to the eyeglasses could allow the convenient control of the dialing motion on the keys of a telephone's dialing-pad which are all modified with infrared receiving/signal-processing modules. The disabled are competent for some of work, such as a telephone operator. The increase of opportunity to do a job for the disabled would help them live independently.

This paper describes design techniques for suppressing crosstalk in an optical transceiver module using PLC-hybrid-integration technologies and for achieving burst-mode operation with high sensitivity and wide dynamic range using CMOS-IC technologies. An arrangement that reduces the electrical crosstalk to less than -100 dB was designed using three-dimensional electromagnetic field analysis. The configurations of a newly developed instantaneous-response CMOS LD driver circuit is also described and instantaneous-response CMOS receiver circuit techniques are reviewed. With these techniques, we have succeeded in building optical transceiver modules for ATM-PON systems using PLC-hybrid-integration and inexpensive standard CMOS-IC fabrication processes. Under full-duplex operation at 156 Mb/s, fabricated transceiver modules showed receiver sensitivity of better than -34 dBm and dynamic range of over 28 dB, which satisfy both the class-B and class-C specifications recommended by ITU-T (International Telecommunication Union-Telecommunication standardization sector) G983.1 for the optical transceiver module for an ONU (optical network unit).

This paper describes design techniques for suppressing crosstalk in an optical transceiver module using PLC-hybrid-integration technologies and for achieving burst-mode operation with high sensitivity and wide dynamic range using CMOS-IC technologies. An arrangement that reduces the electrical crosstalk to less than -100 dB was designed using three-dimensional electromagnetic field analysis. The configurations of a newly developed instantaneous-response CMOS LD driver circuit is also described and instantaneous-response CMOS receiver circuit techniques are reviewed. With these techniques, we have succeeded in building optical transceiver modules for ATM-PON systems using PLC-hybrid-integration and inexpensive standard CMOS-IC fabrication processes. Under full-duplex operation at 156 Mb/s, fabricated transceiver modules showed receiver sensitivity of better than -34 dBm and dynamic range of over 28 dB, which satisfy both the class-B and class-C specifications recommended by ITU-T (International Telecommunication Union-Telecommunication standardization sector) G983.1 for the optical transceiver module for an ONU (optical network unit).

Operation of fiber-grating semiconductor laser (FGL) has been stabilized by using the semiconductor optical amplifier which has a simple slant-waveguide structure. The emission wavelength, which depends on a temperature, shows hysteresis. Employing the directly modulated FGL at 2.5 Gb/s, transmission over 400 km in standard optical fiber has been successfully achieved.

Operation of fiber-grating semiconductor laser (FGL) has been stabilized by using the semiconductor optical amplifier which has a simple slant-waveguide structure. The emission wavelength, which depends on a temperature, shows hysteresis. Employing the directly modulated FGL at 2.5 Gb/s, transmission over 400 km in standard optical fiber has been successfully achieved.

A high-density multi-port optical connector that exploits the flexibility of bare optical fibers has been developed for use as an optical interface of a parallel optical interconnection module. In the BF (Bare-Fiber) connector, 24 multimode-fibers are mated by direct physical contact in micro-glass-capillaries with a 250-µm pitch. The buckling forces of the optical fibers themselves secure the physical contact. Optical fiber buckling is investigated theoretically and experimentally. A new design method to optimize the span length l and the longitudinal displacement ΔL for the buckling is also proposed based on the requirements afor optical characteristics, mechanical reliability, and dimensional tolerances, etc. A prototype BF connector with l 10 mm and ΔL of 50 µm was designed and fabricated for multimode fiber connections. This connector provides high optical performance: an average insertion loss of 0.05 dB and a return loss of over 35 dB at 850 nm. The optical performance remained stable after a durability test with ten connection-repetitions.

This paper proposes a method to reduce the context switching time using a register bank to store contexts of working tasks. Hardware cost and performance were measured by modeling the register bank and controller in VHDL. Following results were obtained: (1) The controller can be implemented with a much smaller amount of hardware cost compared to that of the register bank, which is realized by SRAM module. (2) Context switching time can be reduced to less than 50% compared to that by software implementation. (3) Combination of the proposed architecture with our previous work (RTOS implemented in HW) gives us much higher performance of a hard real-time system.

This paper proposes a new flexible hardware model for pipelined design optimization. Using together with an RTL floorplanner, the flexible hardware model makes accurate and fine design space exploration possible. It is quite effective for deep submicron technology since estimation at high level has become a difficult problem and the design tuning at lower level of abstraction makes up the full design optimization task. The experimental results show that our approach reduces the slack time in the pipeline stages then achieves higher performance with a smaller area.

Since manufacturing processes inherently fluctuate, LSI chips which are produced from the same design have different propagation delays. However, the difference in delays caused by the process fluctuation has rarely been considered in most of existing high-level synthesis systems. This paper presents a new approach to module selection in high-level synthesis, which exploits the difference in functional unit delays. First, a module library model which assumes the probabilistic nature of functional unit delays is presented. Then, we propose a module selection problem and an algorithm which minimizes the cost per faultless chip. Experimental results demonstrate that the proposed algorithm finds optimal module selections which would not have been explored without manufacturing information.