Electromechanical devices such as relays, switches, connectors and printed wiring boards have shown quick growth along with remarkable progress of electronic products in a recent few decades. For the present, outstanding tasks common to these devices are further downsizing, higher density and broading of bandwidth, on the assumption of keeping high performance and high reliability. These tasks are realized by part production improvement for higher precision and automatic assemblies, development of constituent materials and development of breakthrough structural technologies such as a surface mount technology and an active assembly ferrule technology in optical connectors and so on. In this paper, the technical trends as well as the motive technologies are overviewed for each device.

The electric or electronic circuits have many contact devices such as relay and switch. The contact between two nominally conducting flat surface has a lot of micro contact spots. The constriction resistance of the contact is known to determine the sum of the parallel resistance of the micro contacts and the interaction of them. The constriction resistance of two circular conducting spots was approximately formulated by Greenwood. This formulation shows that the interacted resistance of two circular spots is in inverse proportion to the distance between two conducting spots. It was known that this effect is introduced by the interaction between two conducting spots. However, the condition of interaction in the spots is not clear. Calculating the current density distribution in the spots is important to clarify the condition of interaction. The numerical analysis is very suitable to calculate the current density in the spots. In the fundamental case of the computation of the current density the boundary element method (BEM) is more efficient and accurate than that of the finite element method (FEM) because the boundary condition at the infinite is naturally satisfied and is not required a great number of the element in a wide space. In this paper the current density in the square spots is computed by the BEM. As the distance between two conducting spots becomes small, the current density in the two spots decreases. It becomes clear that the constriction resistance of conducting spots is increased by this effect. The decrease of current density by interaction is not uniformly, that at the near location to the opposite spot is larger than that at the far location in the same spot. In this paper the constriction resistance of two conducting spots is also considered. It was known that the constriction resistance of one conducting spot is not influenced by the form of spot very much. However, that of two conducting spots is not clear. The constriction resistance of two square spots is also computed by the BEM. The computed values of the constriction resistance of two square spots are compared with that of two circular spots by Greenwood's formulation and other results. As the result, it is clear that they have the considerable discrepancy. However, the trend of the variations is almost agree each other.

High-speed pulse propagation, up to several hundred Mbps or higher, will play an important role in telecommunication systems for B-ISDN. High-performance packaging, especially high-speed, high-throughput interconnection, is strongly required. For advanced telecommunication systems, giga-bit signal transmission has been developed at the multi-chip module level, and 300 to 600 Mbps signal transmission has been reached at the printed circuit board level. Electrical inter-cabinet interconnections of 150 to 300 Mbps have been achieved for up to several tens of meters. High-speed, high-throughput connectors are the key to achieving high-performance telecommunication packaging systems. Two technologies are extremely important. One is for high-density, high-pin-count connectors, and the other is for high-speed signal transmission connectors. The requirements for the connectors needed for advanced high-performance telecommunication systems are described. Several high-density, high-bandwidth connectors developed for high-performance packaging system are introduced.

This paper describes a trial coaxial surface mounted connector for PGA-type high-speed multichip modules (MCM). An MCM connector is needed to ensure testability and connection reliability of MCMs mounted on a printed circuit board. Our connector consists of a coaxial elements, a common ground housing made of conductive resin, and a ground contact spring plate. It has 68 signal contacts. We investigated the performance of this connector by experiment and simulation. Its insertion force is only about 53 gf per signal pin. The characteristic impedance is from 45.6 Ω to 61.4 Ω. The average resistance between two contacts is 28 mΩ with a deviation of less than plus or minus 5 mΩ. The insertion is -0.4 dB at 1.0 GHz. Crosstalk noise is less than 1.2%. This prototype connector can transmit pulses of up to 1.2 Gb/s, showing that it is applicable to high-speed MCMs.

We analyze the effect of overlapping technique on differential pulse position modulation (DPPM) in optical direct-detection channel when the pulsewidth and the average power of the channel are constrained. We refer to the modulation scheme employing an overlapping technique in DPPM as differential overlapping PPM (DOPPM). To avoid frame synchronization problems, we analyze the performance of DOPPM under the window scheme that results in lower bounds on the capacity and the cutoff rate of DOPPM but is easy to analyze. Under this scheme, we analyze the lower bounds on the capacity and the cutoff rate of DOPPM. It is shown that DOPPM with the window scheme has higher capacity and cutoff rate than PPM and DPPM, and also than OPPM when the average received number of photons per slot is somewhat large. The overlapping technique is thus shown to be effective on DPPM under the pulsewidth constraint when the average received number of photons per slot is somewhat large.

This paper describes a newly developed 22 liquid crystal optical switch for 1.3µm single-mode fiber use. This switch state can be freely set at either the cross or the bar state. The measured performance of two prototype 22 liquid crystal optical switches is given. Tests confirm that the 3 values are a maximum insertion loss of 1.5dB, a crosstalk attenuation of more than 26.1dB, and a return loss of more than 28.9dB. Requirements for optical switches for fault isolation are theoretically clarified from a LAN system view point.

The sidelobe canceler in radar systems is a highly computational demanding problem. It can be efficiently tackled by resorting to the QR decomposition mapped onto a systolic array processor. The paper reports several mapping strategies by using massive parallel computers available on the market. MIMD as well as SIMD machines have been used, specifically MEIKO Computing Surface, nCUBE2, Connection Machine CM-200, and MasPar MP-1. The achieved data throughput values have been measured for a number of operational situations of practical interest.

We have systematically studied the characteristics of Si doping in GaAs grown on (311)A GaAs substrates by molecular beam epitaxy. The growth temperature dependence of Si doping has been investigated. It is found that the conduction-type sharply changes from p-type to n-type with decreasing growth temperature at a critical temperature of 430-480. The highest hole density obtained for uniformly doped layers was 1.51020 cm-3, while for δ-doped layers the sheet hole density as high as 2.61013 cm-2 was achieved. This is the highest hole density ever reported for δ-doped GaAs.

Kumar and Billinton have presented a new technique for obtaining the steady-state probabilities from a flow graph based on Markov model. By examining the graph and choosing suitable input and output nodes, the steady-state probabilities can be obtained directly by using the flow graph. In this paper this graphical technique is applied for a k-out-of-n: G repairable system. Consequently a new derivation way of the formulae for the steady-state availability and MTBF is obtained.

Mobile telecommunication is a rapidly growing market. Second generation systems such as GSM, DECT and ERMES, which are actually in an evolving status will be replaced by the third generation UMTS from the beginning of the next century on. While UMTS will allow data communication with up to 2Mbit/s, the fourth generation system MBS will provide up to 155Mbit/s. In several European R & D projects of the ESPRIT, DRIVE, COST and RACE programmes investigations concerning network planning, network operation, signalling, access techniques, security, terminal development and image and voice compression are carried out in order to create the scientific and technological bases for future UMTS and MBS. Some of these projects are described in more detail and an outlook toward future R & D activities is given. Finally some considerations are made concerning expectations of future services and questions concerning the development of wide band versus narrow band solutions are put.

An alias free parallel structure for adaptive digital filters (ADF's) is considered. The method utilizes the properties of the Frequency-Sampling Filter (FSF) banks to obtain alias free points in the frequency domain. We propose a new cost function for parallel ADF's. The limiting value analysis of system identification using proposed cost function is given in stochastic sense. It is also shown by simulation examples that we can carry out precise system identification. The cost function is defined in each bin; accordingly, it enables the parallel processing of ADF's.

A new gradient type adaptive algorithm is proposed in this paper. It is formulated based on the least squares criteria while the conventional gradient algorithms are based on the least mean square criteria. The proposed algorithm has two variable parameters and by changing them we can adjust the characteristic of the algorithm from the RLS to the LMS depending on the environment. This capability of adjustment achieves the possibility of providing better solutions. However, not only it provides better solutions than the conventional algorithms under some conditions but also it provides a very interesting theoretical view point. It provides a unified view point of the adaptive algorithms including the conventional ones, i.e., the LMS or the RLS, as limited cases and it enables us to analyze the bounds for those algorithms.

This paper describes an image synthesis method based on an estimation of camera parameters. In order to acquire high quality images using image synthesis, we take some constraints into account, which include angle of view, synchronization of change of scale and change of viewing direction. The proposed method is based on an investigation that any camera operation containing a change of scale and a pure 3D rotation can be represented by a 2D geometric transformation. The transformation can explain all the synthesis procedure consisting of locating, synchronizing, and operating images. The procedure is described based on a virtual camera which is constituted of a virtual viewing point and a virtual image plain. The method can be efficiently implemented in such a way that each image to be synthesized undergoes the transformation only one time. The parameters in the image transformation are estimated from image sequence. The estimation scheme consists of first establishing correspondence and then estimating the parameters by fitting the correspondence data to the transformation model. We present experimental results and show the validity of the proposed method.

A new positioning method for higher track density hard disk using embossed-servo-mark magnetic disks is proposed. An embossed-servo-mark medium with grooved-guard-band data tracks for 208 TPMM was developed using molded plastic substrate. The marks were magnetized so that conventional magnetic head can reproduce position signals. Simple analogy from optical disk track following to magnetic disk track following was taken and examined. A DSP controlled feed-forward servo was introduced to resolve the inherent eccentricity caused by mounting preformed tracks onto an independent spindle axis. The prototype drives with a form factor of 2.5 inches were designed introducing the disks, the servo scheme and the newly developed orthogonal MR head. As a result, an areal density of 650 kbits/mm2 (about 420 Mbits/in2) recording was successfully demonstrated on the media using 2.5-inch form factor prototype drives.

We fabricated and investigated HEMTs with nonalloyed ohmic contacts using highly conductive n+-ln0.5Ga0.5 As contact layers. We optimized the growth condition of n+-In0.5 Ga0.5As contact layers by MOVPE. Using WSi/W nonalloyed ohmic electrodes, we fabricated InGaP/InGaAs/GaAs pseudomorphic HEMTs with thermal stability of 500 for 30 minutes. In order to examine the scalability of HEMT devices, we tried to reduce the total size of HEMT devices to 3.2 µm using nonalloyed ohmic electrodes, which is the smallest value as far as we know. We could reduce the nonalloyed ohmic contact length Loh to 0.4 µm without degrading the device characteristics. Reducing the n+-In0.5Ga0.5As contact length LIGA to l µm however, decreased the transconductance gm by about 20%. We found that the scaling of the conventional nonalloyed HEMT structure is limited by LIGA.

Three-dimensional display technologies that require special glasses are not suitable for telecommunications because wearing glasses is inconvenient and it is defficult to observe facial expressions. Our previous 6.3-inch 3D display was inadequate for presenting images with realistic sensation. In this paper, a direct view 15-inch 3D display is described. The display is made up of a l5-inch TFT LCD and a composite lenticular sheet (LS), and uses the head tracking technique. Quantitative evaluation of the stereoscopic sensation of the display was studied using the 3D display, and better stereoscopic sensation values were obtained compared with a 2D display mode, thus comfirming the display's usefulness.

For a complex object model, a form of range restriction called specialization constraint (SC), has been proposed, which is associated not only with the properties themselves but also with property value paths. The domain and range of an SC, however, were limited to single classes. In this paper, SCs are generalized to have sets of classes as their domains and ranges. Let Σ be a set of SCs, where each SC in Σ has a set of classes as its domain and a non-empty set of classes as its range. It is proved that an SC is a logical consequence of Σ if and only if it is a finite logical consequence of Σ. Then a sound and complete axiomatization for SCs is presented. Finally, a polynomial-time algorithm is given, which decides whether or not an SC is a logical consequence of Σ.

This paper describes small AlGaAs/GaAs HBT's for low-power and high-speed integrated circuits. The device fabrication is based on a new bridged base electrode technology that permits emitter width to be defined down to 1 µm. The new technology features oxygen-ion implantation for emitter-base junction isolation and zinc diffusion for extrinsic base formation. The oxygen-ion implanted emitter-base junction edge has been shown to provide a periphery recombination current much lower than that for the previous proton implanted edgs, the result being a much higher current gain particularly in small devices. The zinc diffusion offers high device yield and good uniformity in device characteristics even for a very thin (0.04 µm) base structure. An HBT with emitter dimensions of 12.4 µm2 yields an fT of 103 GHz and an fmax of 62 GHz, demonstrating that the new technology has a significant advantage in reducing the parasitic elements of small devices. Fabricated one-by-eight static frequency dividers and one-by-four/one-by-five two-modulus prescalers operate at frequencies over 10 GHz. The emitters of HBT's used in the divider are 12.4 µm2 in size, which is the smallest ever reported for AlGaAs/GaAs HBT IC's. These results indicate that the bridged base electrode technology is promising for developing a variety of high-speed HBT IC's.

In this paper, we first discuss on a framework for a 3D image display system which is the combination of passive sensing and active display technologies. The passive sensing enables to capture real scenes under natural condition. The active display enables to present arbitrary views with proper motion parallax following the observer's motion. The requirements of passive sensing technology for 3D image displays are discussed in comparison with those for robot vision. Then, a new stereo algorithm, called SEA (Stereo by Eye Array), which satisfies the requirements is described in detail. The SEA uses nine images captured by a 33 camera array. It has the following features for depth estimation: 1) Pixel-based correspondence search enables to obtain a dense and high-spatial-resolution depth map. 2) Correspondence ambiguity for linear edges with the orientation parallel to a particular baseline is eliminated by using multiple baselines with different orientations. 3) Occlusion can be easily detected and an occlusion-free depth map with sharp object boundaries is generated. The feasibility of the SEA is demonstrated by experiments by using real image data.

A new current-mode dual-input configuration for the generation of a ratio (Y2/Y1) type network function using the second generation current conveyor (CC ) elements has been proposed. With nonideal CC s, a precise compensation of output current can be obtained simply by insertion of a grounded admittance (Yc). The design of precise insensitive current-mode integrator/differentiator type functional circuits follows directly if the Y1,2 admittances are suitably chosen as RC components.