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[Keyword] system LSI(13hit)

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  • Digital Calibration and Correction Methods for CMOS Analog-to-Digital Converters Open Access

    Shiro DOSHO  

     
    INVITED PAPER

      Vol:
    E95-C No:4
      Page(s):
    421-431

    Along with the miniaturization of CMOS-LSIs, control methods for LSIs have been extensively developed. The most predominant method is to digitize observed values as early as possible and to use digital control. Thus, many types of analog-to-digital converters (ADCs) have been developed such as temperature, time, delay, and frequency converters. ADCs are the easiest circuits into which digital correction methods can be introduced because their outputs are digital. Various types of calibration method have been developed, which has markedly improved the figure of merits by alleviating margins for device variations. The above calibration and correction methods not only overcome a circuit's weak points but also give us the chance to develop quite new circuit topologies and systems. In this paper, several digital calibration and correction methods for major analog-to-digital converters are described, such as pipelined ADCs, delta-sigma ADCs, and successive approximation ADCs.

  • An Integrated Platform for Digital Consumer Electronics Open Access

    Junji MICHIYAMA  

     
    INVITED PAPER

      Vol:
    E92-C No:10
      Page(s):
    1240-1248

    This paper describes the architecture of an integrated platform developed for improving the development efficiency of system LSIs built into digital consumer electronics equipment such as flat-panel TVs and optical disc recorders. The reason for developing an integrated platform is to improve the development efficiency of system LSIs that serve the principal functions of the said equipment. The key is to build a common interface between each software layer, with the system LSI located at the lowest layer. To make this possible, the hardware architecture of the system LSI is divided into five blocks according to its main functionality. In addition, a middleware layer is placed over the operating system to improve the ease of porting old applications and developing new applications in the higher layer. Based on this platform, a system LSI called UniPhierTM has been developed and used in 156 product families of digital consumer electronics equipment (as of December 2008).

  • Shared Write-Selection Transistor Cell and Leakage-Replication Read Scheme for Large Capacity MRAM Macros

    Ryusuke NEBASHI  Noboru SAKIMURA  Tadahiko SUGIBAYASHI  Naoki KASAI  

     
    PAPER

      Vol:
    E92-C No:4
      Page(s):
    417-422

    We propose an MRAM macro architecture for SoCs to reduce their area size. The shared write-selection transistor (SWST) architecture is based on 2T1MTJ MRAM cell technology, which enables the same fast access time with a smaller cell area than that of 6T SRAMs. We designed a 4-Mb macro using the SWST architecture with a 0.15-µm CMOS process and a 0.24-µm MRAM process. The macro cell array consists of 81T64MTJ cell array elements, each storing 64 bits of data. The area size is reduced by more than 30%. By introducing a leakage-replication (LR) read scheme, a wide read margin on a test chip is accomplished and 50-ns access time is achieved with SPICE simulation. The 2T1MTJ macro and 81T64MTJ macro can be integrated into a single SoC.

  • Module-Wise Dynamic Voltage and Frequency Scaling for a 90 nm H.264/MPEG-4 Codec LSI

    Yukihito OOWAKI  Shinichiro SHIRATAKE  Toshihide FUJIYOSHI  Mototsugu HAMADA  Fumitoshi HATORI  Masami MURAKATA  Masafumi TAKAHASHI  

     
    INVITED PAPER

      Vol:
    E89-C No:3
      Page(s):
    263-270

    The module-wise dynamic voltage and frequency scaling (MDVFS) scheme is applied to a single-chip H.264/MPEG-4 audio/visual codec LSI. The power consumption of the target module with controlled supply voltage and frequency is reduced by 40% in comparison with the operation without voltage or frequency scaling. The consumed power of the chip is 63 mW in decoding QVGA H.264 video at 15 fps and MPEG-4 AAC LC audio simultaneously. This LSI keep operating continuously even during the voltage transition of the target module by introducing the newly developed dynamic de-skewing system (DDS) which watches and control the clock edge of the target module.

  • Extraction of Transformation Rules from UML Diagrams to SpecC

    Tetsuro KATAYAMA  

     
    PAPER

      Vol:
    E88-D No:6
      Page(s):
    1126-1133

    Embedded systems are used in broad fields. They are one of the indispensable and fundamental technologies in a highly informative society in recent years. As embedded systems are large-scale and complicated, it is prosperous to design and develop a system LSI (Large Scale Integration). The structure of the system LSI has been increasing complexity every year. The degree of improvement of its design productivity has not caught up with the degree of its complexity by conventional methods or techniques. Hence, an idea for the design of a system LSI which has the flow of describing specifications of a system in UML (Unified Modeling Language) and then designing the system in a system level language has already proposed. It is important to establish how to convert from UML to a system level language in specification description or design with the idea. This paper proposes, extracts and verifies transformation rules from UML to SpecC which is one of system level languages. SpecC code has been generated actually from elements in diagrams in UML based on the rules. As an example to verify the rules, "headlights control system of a car" is adopted. SpecC code has been generated actually from elements in diagrams in UML based on the rules. It has been confirmed that the example is executed correctly in simulations. By using the transformation rules proposed in this paper, specification and implementation of a system can be connected seamlessly. Hence, it can improve the design productivity of a system LSI and the productivity of embedded systems.

  • Mixed Signal SoC Era

    Akira MATSUZAWA  

     
    INVITED PAPER

      Vol:
    E87-C No:6
      Page(s):
    867-877

    Application area of mixed signal technology is currently expanded to digital communication, networking, and digital storage systems from conventional digital audio and video systems. Digital consumer electronics are emerged and their markets are extremely increased. Rapid progress of integrated circuit technology has enabled a system level integration on a SoC. Thus mixed signal SoC becomes a majority in LSI industry. Almost all the analog functions should be realized by CMOS technology on SoC, yet some difficulties such as a low transconductance, a large mismatch voltage, and a large 1/f noise should be solved. CMOS device has been considered as a poor device for the analog use, however in reality, it has attained a remarkable progress for analog applications. CMOS device has a variety of circuit techniques to address its own issues and also has an analog performance that increases rapidly with technology scaling. The mixed signal SoC needs a new development strategy and design methodology that covers from system level to device level for addressing tough needs for a shorter development time, a lower cost, and a higher design quality. The optimizations over analog and digital and over system to device must be established for the development success. Difficulty of low voltage operation of further scaled CMOS in analog circuits will be the most serious issue. This results in the saturation of performance and increase of cost. The system level optimization over analog and digital, digital calibration and compensation, and the use of sigma-delta modulation method will give us the solution.

  • A Single-Chip JPEG2000 Encode Processor Capable of Compressing D1-Images at 30 frames/s without Tile Division

    Hideki YAMAUCHI  Shigeyuki OKADA  Kazuhiko TAKETA  Tatsushi OHYAMA  

     
    PAPER

      Vol:
    E87-C No:4
      Page(s):
    448-456

    A VLSI-specific wavelet processing technique has been developed and implemented as a processor in accordance with the JPEG2000 specification. This proposed procedure of discrete wavelet transforms uses an altered calculation equations and makes use of intermediate results through wavelet calculation. The implementation of the proposed procedure is capable of realizing a highly efficient DWT for large size images in spite of using low hardware costs and a small size buffering memory. In order to obtain fast EBCOT processing, three types of parallel processing are introduced in the EBCOT architecture. The processor performs compression of 720480 pixels images with the speed of 30 frames per second (fps) at a required operating frequency as low as 32 MHz or lower. Furthermore, it need not divide an image into tiles so that the problem of deterioration of image quality due to tile division does not occur. A prototype of this processor has been fabricated in a 0.25-µm 5-layer CMOS process. The chip is 10.210.4 mm2 in size and consumes 2.0 W when supplied with 2.5 V and 32 MHz.

  • On-Chip Multimedia Real-Time OS and Its MPEG-2 Applications

    Hiroe IWASAKI  Jiro NAGANUMA  Makoto ENDO  Takeshi OGURA  

     
    PAPER-VLSI Systems

      Vol:
    E84-D No:4
      Page(s):
    448-455

    This paper proposes a very small on-chip multimedia real-time OS for embedded system LSIs, and demonstrates its usefulness on MPEG-2 multimedia applications. The real-time OS, which has a conditional cyclic task with suspend and resume for interacting hardware (HW) / software (SW) of embedded system LSIs, implements the minimum set of task, interrupt, and semaphore managements on the basis of an analysis of embedded software requirements. It requires only about 2.5 Kbytes memory on run-time, reduces redundant conventional cyclic task execution steps to about 1/2 for HW/SW interactions, and provides sufficient performance in real-time through implementing two typical embedded softwares for practical multimedia system LSIs: an MPEG-2 system protocol LSI and an MPEG-2 video encoder LSI. This on-chip multimedia real-time OS with 2.5 Kbyte memory will be acceptable for future multimedia embedded system LSIs.

  • Towards the System LSI Design Technology

    Hiroto YASUURA  

     
    INVITED PAPER

      Vol:
    E84-A No:1
      Page(s):
    91-97

    System LSI is a new principal product of semiconductor industry and also a key component of Information Technology (IT). Design of a system LSI contains two different characteristics, system design and LSI design. It is keen issue to establish a design methodology of system LSIs in which designers have much freedom on their design from system level to device level and also can control various design parameters to optimize their design. In this paper, considerations on markets of system LSIs and requirements from each application are summarized. Some proposals on new directions of design methodology are also surveyed.

  • Three-Layer Cooperative Architecture for MPEG-2 Video Encoder LSI

    Mitsuo IKEDA  Toshio KONDO  Koyo NITTA  Kazuhito SUGURI  Takeshi YOSHITOME  Toshihiro MINAMI  Jiro NAGANUMA  Takeshi OGURA  

     
    PAPER

      Vol:
    E83-C No:2
      Page(s):
    170-178

    This paper presents an architecture for a single-chip MPEG-2 video encoder and demonstrates its flexibility and usefulness. The architecture based on three-layer cooperation provides flexible data-transfer that improves the encoder from the standpoints of versatility, scalability, and video quality. The LSI was successfully fabricated in the 0.25-µm four-metal CMOS process. Its small size and its low power consumption make it ideal for a wide range of applications, such as DVD recorders, PC-card encoders and HDTV encoders.

  • A Test Methodology for Core-Based System LSIs

    Makoto SUGIHARA  Hiroshi DATE  Hiroto YASUURA  

     
    PAPER-Test

      Vol:
    E81-A No:12
      Page(s):
    2640-2645

    In this paper, we propose a test methodology for core-based system LSIs. Our test methodology aims to decrease testing time for core-based system LSIs. In our method, every core is supplied with several sets of test vectors. Every set of test vectors guarantees sufficient fault coverage. Each set of test vectors consists of two parts. One is based on built-in self-test (BIST) and the other is based on external testing. These sets of test vectors are designed to have different ratio of BIST to external testing each other for every core. We can minimize testing time for core-based system LSIs by selecting from the given sets of test vectors for each core. The main contributions of this paper are summarized as follows. (i) BIST is efficiently combined with external testing to relax the limitation of the external primary inputs and outputs. (ii) External testing for one of cores and BISTs for the others are performed in parallel to reduce the total testing time. (iii) The testing time minimization problem for core-based system LSIs is formulated as a combinatorial optimization problem to select the optimal set of test vectors from given sets of test vectors for each core.

  • Evaluating DRAM Refresh Architectures for Merged DRAM/Logic LSIs

    Taku OHSAWA  Koji KAI  Kazuaki MURAKAMI  

     
    PAPER

      Vol:
    E81-C No:9
      Page(s):
    1455-1462

    In merged DRAM/logic LSIs, it is necessary to reduce the number of DRAM refreshes because of higher heat dissipation caused by the logic portion on the same chip. In order to overcome this problem, we propose several DRAM refresh architectures. The basic is to eliminate unnecessary DRAM refreshes. In addition to this, we propose a method for reducing the number of DRAM refreshes by relocating data. In order to evaluate these architectures and method, we have estimated the DRAM refresh count in executing benchmark programs under several models which simulate each combination of them. As a result, in the most effective combination, we have obtained more than 80% reduction against a conventional DRAM refresh architecture for most of benchmark programs. In addition to it, we have taken normal DRAM access into account, even then we have obtained more than 50% reduction for several benchmarks.

  • Large Scale Embedded DRAM Technology

    Akira YAMAZAKI  Tadato YAMAGATA  Yutaka ARITA  Makoto TANIGUCHI  Michihiro YAMADA  

     
    INVITED PAPER-DRAM

      Vol:
    E81-C No:5
      Page(s):
    750-758

    The features for the integration of 1Tr/1C DRAM and logic for graphic and multimedia applications are surveyed. The key circuit/process technology for large scale embedded DRAM cores is described. The methods to improve transistor performance and gate density are shown. Noise immunity design and easy customization techniques are also introduced.