This investigation of the temperature and illumination effects on the AlGaN/GaN HFET threshold voltage shows that it shifts about -1 V under incandescent lamp or blue LED illumination, while almost no shift takes place under red LED illumination. The temperature coefficient for the threshold voltage shift is +3.44 mV/deg under the illuminations and +0.28 mV/deg in darkness. The threshold voltage variation can be attributed to a virtual back-gate effect caused by light-generated buffer layer potential variations. The expressions for the potential variation are derived using Shockley-Read-Hall (SRH) statistics and the Maxwell-Boltzmann distribution for the carriers and deep traps in the buffer layer. The expressions indicate that large photoresponses will occur when the electron concentration in the buffer layer is extremely small, that is, highly resistive. In semi-insulating substrates, the substrate potential varies so as to keep the trap occupation function constant. The sign and the magnitude of the threshold voltage variation are explained by the shift of the pinning energy calculated from the Fermi-Dirac distribution function.

Accumulation of non-equilibrium longitudinal optical (LO) phonons (termed hot phonons) is considered as a possible cause for limitation of frequency of operation of GaN-based high-electron-mobility transistors (HEMTs). The experimental data on noise temperature of hot electrons at a microwave frequency as a function of supplied electric power is used to extract information on hot phonons: the hot-phonon lifetime, the equivalent hot-phonon temperature, the effective occupancy of hot-phonon states involved into electron-LO-phonon interaction. The possible ways for controlling the hot-phonon effect on electron drift velocity through variation of electron density, channel composition, and hot-phonon lifetime are discussed. The expected dependence of hot-electron drift velocity on hot-phonon lifetime is confirmed experimentally. A self-consistent explanation of different frequency behaviour of InP-based and GaN-based HEMTs is obtained from a comparative study of hot-phonon effects.

Based on fluoride-based plasma treatment of the gate region in AlGaN/GaN HEMTs and post-gate rapid thermal annealing (RTA), enhancement mode (E-mode) AlGaN/GaN HEMTs with low on-resistance and low knee-voltage were fabricated. The fabricated E-mode AlGaN/GaN HEMT with 1 µm-long gate exhibits a threshold voltage of 0.9 V, a knee-voltage of 2.2 V, a maximum drain current density of 310 mA/mm, a peak gm of 148 mS/mm, a current gain cutoff frequency fT of 10.1 GHz and a maximum oscillation frequency fmax of 34.3 GHz. In addition, the fluoride-based plasma treatment was also found to be effective in lowering the gate leakage current, in both forward and reverse bias. Two orders of magnitude reducation in gate leakage current was observed in the fabricated E-mode HEMTs compared to the conventional D-mode HEMTs without fluoride-based plasma treatment.

The correlation between ohmic contact resistivity (ρc) and transconductance (gm) in AlGaN/GaN high-electron-mobility transistors (HEMTs) was investigated. To characterize ρc precisely, we fabricated a circular transmission line model (c-TLM) pattern adjoined to a field-effect transistor (FET) pattern on an HEMT. By measuring ohmic contact resistance and sheet resistance using the adjoined c-TLM, intrinsic transconductance (gm0), which is not influenced by the source resistance, can be estimated. The gm0 thus obtained is between 179 and 206 mS/mm. Then, it became possible to calculate the correlation between gm and (ρc. We found that ρc should be below 10-5 Ωcm2 for the improvement of gm in AlGaN/GaN HEMT when Rsh 400 Ω/.

A model for the enhancement-mode operation of an AlGaN/GaN metal-insulator-semiconductor heterostructure field-effect transistor (MIS-HFET) under DC and AC conditions is proposed. In DC operation at positive gate voltages, the MIS-HFET can be divided into a transistor area and a resistor area due to the diode nature of the insulator/AlGaN interface. The transistor area shrinks with the increases in gate voltage. The intrinsic-transistor gate-length reduction causes a drain current increase. The I-V characteristics based on the gradual channel approximation are derived. The ID hysteresis of the MIS-HFET is investigated by a circuit simulation using SPICE. We have confirmed that the hysteresis was caused by the phase difference between the potential variation of the gate insulator/AlGaN interface and that of the gate electrode due to CR components in the gate structure.

We analyzed passivation film and the AlGaN surface states using open-gated structures of AlGaN/GaN HFETs by numerical simulation and experiments. From the analyses, we confirmed that insulating film conductivity plays the prominent roles in device performances of the wide bandgap semiconductor device. Device simulation confirmed that the difference in ID-VG characteristics is due to the trapping type of the surface states; electron-trap type or hole-trap type. For electron-trap type surface states, the surface potential pinned at electron quasi-Fermi level, which is the same as the channel potential in the open-gated FETs. As a result, surface potential of ungated region is equal to the channel electric potential resulting in the uncontrollability of the channel current by the edge placed gate electrode. For hole-trap type surface states, the surface potential is pinned at hole quasi-Fermi level, which must be the same as the edge placed gate electrode potential. Then, the AlGaN surface potential varies with the electrode potential variation allowing the control of channel current as if the whole channel is covered with a metal electrode. Experiments for open-gated FET with unpassivated surface show no current variation. This corresponds to electron-trap type surface states from the simulation. On the other hand, SiOX evaporated open-gated FET show current control by the gate electrode. The ID-VG characteristics resembles in simulated ID-VG characteristics with hole-trap surface states. However, the estimated time constants for the trap reactions are incredibly long due to the deep energy level for the surface states in wide bandgap semiconductors. In addition, the open-gated FET showed reverse threshold shift to the value expected from the hole-trap pinning levels. So, we concluded that the no current variation for the unpassivated open-gated FET can be attributed to electron traps in the surface states, but the control of the drain current for SiOX deposited open-gated FET is not by surface hole-traps, but by slightly conductive passivation film of SiOX.

We propose a novel Schottky barrier diode with a dual Schottky structure combined with an AlGaN/GaN heterostructure. The purpose of this diode was to lower the on-state voltage and to maintain the high reverse breakdown voltage. An AlGaN/GaN heterostructure was grown using a metalorganic chemical vapor deposition (MOCVD). The Schottky barrier diode with a dual Schottky structure was fabricated on the AlGaN/GaN heterostructure. As a result, the on-voltage of the diode was below 0.1 V and the reverse breakdown voltage was over 350 V.

High-frequency characterization and delay-time analysis have been performed for a short channel AlGaN/GaN heterojunction FET. The fabricated device with a short gate length (Lg) of 0.07 µm exhibited an extrinsic current gain cutoff frequency of 81 GHz and a maximum frequency of oscillation of 190 GHz with a maximum stable gain (MSG) of 8.2 dB at 60 GHz. A new scheme for the delay-time analysis was proposed, in which the effects of rather large series resistance RS + RD are properly taken into account. By applying the new scheme to a device with Lg=0.25 µm, we obtained an effective high-field electron velocity of 1.75107 cm/s, which is consistent with our previous results calculated using Monte Carlo simulation.

In order to clarify the mechanism of gate leakage in AlGaN/GaN heterostructure field effect transistors (HFETs), temperature (T)-dependent current-voltage (I-V) characteristics of Ni/n-AlGaN Schottky contact were measured in detail. Large deviations from the thermionic emission transport were observed in I-V-T behavior with anomalously large reverse leakage currents. An analysis based on the thin surface barrier (TSB) model showed that the nitrogen-vacancy-related near-surface donors play a dominant role in the leakage through the AlGaN Schottky interface. As a practical scheme for suppressing the leakage currents, use of an insulated gate (IG) structure was investigated. As the insulator, Al2O3 was selected, and an Al2O3 IG structure was formed on the AlGaN/GaN heterostructure surface after an ECR-N2 plasma treatment. An in-situ XPS analysis exhibited successful formation of an ultrathin stoichiometric Al2O3 layer which has a large conduction band offset of 2.1 eV at the Al2O3/Al0.3Ga0.7N interface. The fabricated Al2O3 IG HFET achieved pronounced reduction of gate leakage, resulting in the good gate control of drain currents up to VGS = +3 V. The maximum drain saturation current and transconductance were 0.8 A/mm and 120 mS/mm, respectively. No current collapse was observed in the Al2O3 IG-HFETs, indicating a remarkable advantage of the present Al2O3-based insulated gate and passivation structure.

We present ultra low noise- and wide dynamic range performances of an AlGaN/GaN heterostructure FET (HFET). An HFET fabricated on a high quality epitaxial layers grown on a semi-insulating SiC substrate exhibited impressively low minimum noise figure (NF min ) of 0.4 dB with 16 dB associated gain at 2 GHz. The low NF (near NF min ) operation was possible in a wide drain bias voltage range, i.e. from 3 V to 15 V. At the same time, the device showed low distortion character as indicated by the high third order input intercept point (IIP3), +13 dBm. The excellent characteristics are attributed to three major factors: (1) high quality epitaxial layers that realized a high transconductance and very low buffer leakage current; (2) excellent device isolation made by selective thermal oxidation; (3) ultra low gate leakage current realized by Pd based gate. The results demonstrate that the AlGaN/GaN HFET is a strong candidate for front-end LNAs in various mobile communication systems where both the low noise and the wide dynamic range are required.

DC and RF performances of AlGaN/GaN HEMTs are simulated using a two-dimensional device simulator with the material parameters of GaN and AlGaN. The cut-off frequency is estimated as 205 GHz at the gate length of 0.05 µm and the drain breakdown voltage at this gate length is over 10 V. The values are satisfactory for millimeter wavelength power applications. The use of thin AlGaN layers has key importance to alleviate gate parasitic capacitance effects at this gate length.

Schottky gas sensors of CO were fabricated using high quality AlGaN/GaN/Si heterostructures. The CO sensors show good sensitivity in the temperature range of 250 to 300 (530%, at 160 ppm CO in N2) and fast response comparable with SnO2 sensors. A two-region linear regime was observed for the dependence of sensitivity on CO concentration. GaN sensors on Si substrate offer the possibility of integration with Si based electronics. The gas sensors show slow response with time, the change of material properties possibly in the presence of large thermal stress.

For the mass production of GaN-based electronic devices, growth of AlGaN/GaN heterostructures on substrates larger than 100 mm in diameter is indispensable. In this study, we demonstrate the growth of 100-mm-diameter Al0.26Ga0.74N/GaN heterostructures on sapphire substrates by metalorganic vapor phase epitaxy (MOVPE). The obtained films have specular surfaces, good crystal quality and good uniformity of alloy composition across the entire 100-mm-diameter epitaxial wafer. The bowing value of the 100-mm-diameter epitaxial wafer on c-face sapphire substrates is about 40 µm. This bowing value seems to be preferable for electronic device fabrication processes. These epitaxial wafers show good electrical properties.

High-temperature stability of copper (Cu) gate AlGaN/GaN high electron mobility transistors (HEMTs) was investigated. Samples were annealed at various temperatures to monitor the changes on device performances. Current-voltage performance such as drain-source current, transconductance, threshold voltage and gate leakage current has no obvious degradation up to annealing temperature of 500 and time of 5 minutes. Also up to this temperature, no copper diffusion was found at the Cu and AlGaN interface by secondary ion mass spectrometry determination. At annealing temperature of 700 and time of 5 minutes, device performance was found to have degraded. Gate voltage swing increased and threshold voltage shifted due to Cu diffusion into AlGaN. These results indicate that the Schottky contact and device performance of Cu-gate AlGaN/GaN HEMT is stable up to annealing temperature of 500. Cu is a promising candidate as gate metallization for high-performance power AlGaN/GaN HEMTs.

We have demonstrated AlGaN/GaN high electron mobility transistors (HEMTs) grown on epitaxial AlN/sapphire templates. The crystal qualities and fabricated device performances between AlGaN/GaN HEMTs on epitaxial AlN/sapphire templates and conventional AlGaN/GaN HEMTs on sapphire substrates with low-temperature buffer layer (LT-BLs) are compared with each other. By using epitaxial AlN/sapphire templates instead of LT-BLs, higher mobility was exhibited and superior crystal qualities were observed, as confirmed by X-ray diffraction (XRD), atomic force microscopy (AFM) images and capacitance-voltage measurements. In addition, the dc characteristics of the fabricated devices on epitaxial AlN/sapphire templates were enhanced. AlGaN/GaN HEMTs on epitaxial AlN/sapphire templates are promising candidates for practical applications of nitride-based electronic devices.

We report in this paper, the performance of AlGaN/GaN HFETs in the context of high power, low noise and high temperature operations, along with a comparison of their characteristics with other conventional technologies. Finally, a single stage modulator driver for long haul optical communications is presented as an example of application of the GaN-based devices high power handling capabilities.

We report the investigation of major dispersion mechanisms such as self-heating, trapping, current collapse, and floating-body effects present in AlGaN/GaN HFETs. These effects are analyzed using DC/Pulsed IV, load-pull, low-frequency noise systems, and a cryogenic probe station. This study leads to a better understanding of the device physics, which is critical for accurate large-signal modeling and device optimization.

The first implementations of X-band AlGaN/GaN HEMT single-ended frequency doublers are presented in this paper. Two types of fundamental frequency signal reflector schemes have been demonstrated for the frequency doubler application. Open-circuited quarter-wavelength microstrip line at the fundamental frequency is utilized for the reflector in a conventional way. In the other architecture a printed antenna is employed as a radiator as well as a novel fundamental frequency reflector. A microstrip rectangular patch antenna operating at the second harmonic frequency of the doubler was designed and integrated with AlGaN/GaN HEMT based on active integrated antenna design concept. Using AlGaN/GaN HEMT with 1 mm gate periphery, two 4 to 8 GHz frequency doublers were designed by the described design methodologies, fabricated, and tested. For the conventional frequency doubler, a conversion gain of 0.6 dB and with an output power of 15 dBm was observed. A conversion gain of 5 dB and an output power of 25 dBm with embedded antenna gain were achieved at a drain voltage of 12 V for the doubler integrated with the patch antenna.

In this paper we summarize the actual status of the GaN/AlGaN HFET power technology at DaimlerChrysler using high quality structures grown by MOCVD on sapphire or semi-insulating SiC supplied by Epitronics. High mobilites and record extrinsic transconductance and current values were achieved on devices with sapphire and SiC substrate. Small area devices with 0.3 µm gate length yield fT=43 GHz and fmax=78 GHz (s.i. SiC substrate). Load-pull characterisation have been performed on multifinger HFETs up to 20 GHz with e.g. output power levels above 3 Watt cw at 15 GHz for a single 1.6 mm device. Though the achieved results are very promising, the performance of these devices is still hampered by transient effects on different time scales. We will show in this paper that passivation of the devices by SiN could considerably improve the RF power performance as well as reduce long time constant effects present before passivation.

Investigations were carried out on metalorganic-chemical-vapor-deposition (MOCVD)-grown strained AlGaN/ GaN/sapphire structures using X-ray diffratometry. While AlGaN with lower AlN molar fraction (< 0.1) is under the in-plane compressive stress, it is under the in-plane tensile stress with high AlN molar fraction (> 0.1). Though tensile stress caused the cracks in AlGaN layer with high AlN molar fraction, we found that the cracks dramatically reduced when the GaN layer quality was not good. Using this technique, we fabricated a GaInN multi-quantum-well (MQW) surface emitting diodes were fabricated on 15 pairs of AlGaN/GaN distributed Bragg reflector (DBR) structures. The reflectivity of 15 pairs of AlGaN/GaN DBR structure has been shown as 75% at 435 nm. Considerably higher output power (1.5 times) has been observed for DBR based GaInN MQW LED when compared with non-DBR based MQW structures.