In this paper, the high-power high-efficiency asymmetric Doherty power amplifiers based on high-voltage GaN HEMT devices with internal input matching for base station applications are proposed and described. For a three-way 1:2 asymmetric Doherty structures, an exceptionally high output power of 1 kW with a peak efficiency of 83% and a linear flat power gain of about 15 dB was achieved in a frequency band of 2.11-2.17 GHz, whereas an output power of 59.5 dBm with a peak efficiency of 78% and linear power gain of 12 dB and an output power of 59.2 dBm with a peak efficiency of 65% and a linear power gain of 13 dB were obtained across 1.8-2.2 GHz. To provide a high-efficiency broadband operation, the concept of inverted Doherty structure is applied and described in detail. By using a high-power broadband inverted Doherty amplifier architecture with a 2×120-W GaN HEMT transistor, a saturated power of greater than 54 dBm, a linear power gain of greater than 13 dB and a drain efficiency of greater than 50% at 7-dB power backoff in a frequency bandwidth of 1.8-2.7 GHz were obtained.

This paper presents recent progress on high frequency and wide bandwidth GaN high power amplifiers (PAs) that are usable for high-data-rate wireless communications and modern radar systems. The key devices and design techniques for PA are described in this paper. The results of the state-of-the art GaN PAs for microwave to millimeter-wave applications and design methodology for ultra-wideband GaN PAs are shown. In order to realize high output power density, InAlGaN/GaN HEMTs were employed. An output power density of 14.8 W/mm in S-band was achieved which is 1.5 times higher than that of the conventional AlGaN/GaN HEMTs. This technique was applied to the millimeter-wave GaN PAs, and a measured power density at 96 GHz was 3 W/mm. The modified Angelov model was employed for a millimeter-wave design. W-band GaN MMIC achieved the maximum Pout of 1.15 W under CW operation. The PA with Lange coupler achieved 2.6 W at 94 GHz. The authors also developed a wideband PA. A power combiner with an impedance transformation function based on the transmission line transformer (TLT) technique was adopted for the wideband PA design. The fabricated PA exhibited an average Pout of 233 W, an average PAE of 42 %, in the frequency range of 0.5 GHz to 2.1 GHz.

A practical Doherty amplifier design method has been developed based on an asymmetric configuration scheme. By embedding a load modulation function into matching circuits of a carrier amplifier (CA) and a peaking amplifier (PA) in the Doherty amplifier, an issue of the Doherty amplifier design is boiled down to the CA and PA matching circuit design. The method can be applied to transistors with unknown parasitic elements if optimum termination impedance conditions for the transistor are obtained from a source-/load-pull technique in simulation or measurement. The design method was applied to GaN HEMT Doherty amplifier MMICs. The fabricated 4.5-GHz-band GaN HEMT Doherty amplifier MMIC exhibited a maximum drain efficiency of 66% and a maximum power-added efficiency (PAE) of 62% at 4.1GHz, with a saturation output power of 36dBm. In addition, PAE of 50% was achieved at 4.1GHz on a 7.2-dB output back-off (OBO) condition. The fabricated 8.5-GHz-band GaN HEMT Doherty amplifier MMIC exhibited a maximum drain efficiency of 53% and a maximum PAE of 44% at 8.6GHz, with a saturation output power of 36dBm. In addition, PAE of 35% was achieved at 8.6GHz on a 6.7-dB (OBO). And, the fabricated 12-GHz-band GaN HEMT Doherty amplifier MMIC exhibited a maximum drain efficiency of 57% and a maximum PAE of 52% at 12.4GHz, with a saturation output power of 34dBm. In addition, PAE of 32% was achieved at 12.4GHz on a 9.5-dB (OBO) condition.

In this study, simulations are performed to design an optimal device for thinning the GaN channel layer on the semi-insulating layer in HEMT. When the gate length is 50nm, the thickness of the undoped channel must be thinner than 300nm to observe the off state. When the GaN channel layer is an Fe-doped, an on/off ratio of ~300 can be achieved even with a gate length of 25nm, although the transconductance is slightly reduced.

A new design approach of broadband RF power amplifier (PA) is introduced in this work with combination of large signal X-parameter and Real-Frequency Technique (RFT). A theoretical analysis of large signal X-parameter is revisited, and a simplification method is introduced to determine the optimum large signal impedances of a Gallium Nitride HEMT (GaN HEMT) device. With the optimum impedance extraction over the wide frequency range (0.3 to 2.0 GHz), a wideband matching network is constructed employing RFT and the final design is implemented with practical mixed-lumped elements. The prototype broadband RF PA demonstrates an output power of 40 dBm. The average drain efficiency of the PA is found to be more than 60%; while exhibiting acceptable flat gain performance (12±0.25 dB) over the frequency band of (0.3-2.0 GHz). The PA designed using the proposed approach yields in small form factor and relatively lower production cost over those of similar PAs designed with the classical methods. It is expected that the newly proposed design method will be utilized to construct power amplifiers for radio communications applications.

A 4.5-/4.9-GHz band-selective GaN HEMT high-efficiency power amplifier has been designed and evaluated for next-generation wireless communication systems. An optimum termination impedance for each high-efficiency operation band was changed by using PIN diodes inserted into a harmonic treatment circuit at the output side. In order to minimize the influence of the insertion loss of the PIN diodes, an additional line is arranged in parallel with the open-ended stub used for second harmonic treatment, and the line and stub are connected with the PIN diodes to change the effective characteristic impedance. The fabricated GaN HEMT amplifier achieved a maximum power-added efficiency of 57% and 66% and a maximum drain efficiency of 62% and 70% at 4.6 and 5.0GHz, respectively, with a saturated output power of 38dBm, for each switched condition.

We report on robust and low-power-consumption InP- and GaN-HEMT Low-Noise-Amplifiers (LNAs) operating in Q-band frequency range. A multi-stage common-gate (CG) amplifier with current reuse topology was used. To improve the survivability of the CG amplifier, we introduced a feedback resistor at the gate bias feed. The design technique was adapted to InP- and GaN-HEMT LNAs. The 75nm gate length InP HEMT LNA exhibited a gain of 18dB and a noise figure (NF) of 3dB from 33 to 50GHz. The DC power consumption was 16mW. The Robustness of the InP HEMT LNA was tested by injecting a millimeter-wave input power of 13dBm for 10 minutes. No degradation in a small signal gain was observed. The fabricated 0.12µm gate length GaN HEMT LNA exhibited a gain of 15dB and an NF of 3.2dB from 35 to 42GHz. The DC power consumption was 280mW. The LNA survived until an input power of 28dBm.

The high performance GaN power amplifier circuit operating at 7.1 GHz was demonstrated for potential use such as in a space ground station. First, the GaN HEMT chips were investigated for the high power amplifier circuit design. And next, the designed amplifier circuits matching with the load and source impedance of the non-linear models were fabricated. From measurement, the AB-class power amplifier circuit with the four-cell chip showed the power added efficiency (PAE) of 42.6% and output power with 41.7dBm at -3dB gain compression. Finally, the good performance of the power amplifier was confirmed in a 20-way radial power combiner with the PAE of 17.4% and output power of 52.6 dBm at -3dB gain compression.

Gallium nitride high electron mobility transistors (GaN HEMTs) were developed for millimeter-wave high power amplifier applications. The device with a gate length of 80 nm and an InAlN barrier layer exhibited high drain current of more than 1.2 A/mm and high breakdown voltage of 73,V. A cut-off frequency $ extrm{f}_{ extrm{T}}$ of 113,GHz and maximum oscillation frequency $ extrm{f}_{ extrm{max}}$ of 230,GHz were achieved. The output power density reached 1 W/mm with a linear gain of 6.4,dB at load-pull measurements at 90,GHz. And we extracted equivalent circuit model parameters of the millimeter-wave InAlN/GaN HEMT and showed that the model was useful in simulating the millimeter-wave power performance. Also, we report a preliminary constant bias stress test result.

This paper presents an experimental investigation on the RF characteristics of a 3W-class cryogenically-cooled receiver amplifier employing a gallium-nitride high electron mobility transistor (GaN HEMT) with a blue light for mobile base stations. In general, a cryogenically-cooled receiver amplifier using a GaN HEMT exhibits unstable DC characteristics similar to those found in the current collapse phenomenon because the GaN HEMT loses thermal energy at cryogenic temperatures. The fabricated cryogenically-cooled receiver amplifier achieves stable DC characteristics by injecting blue light into the GaN HEMT instead of thermal energy. Experimental results show that the amplifier achieves fine stable DC characteristics for deviation in the drain-source current from 42% to 5% and RF characteristics for a maximum power added efficiency from 58% to 68% without and with the blue light at 60,K. The fabricated amplifier is effective in reducing the power consumption at cryogenic temperatures. To the best of our knowledge, this paper is the first report regarding RF characteristics of a cryogenically-cooled receiver amplifier using a blue light for mobile base stations.

In this paper, a systematic design of X-band (9–10 GHz) 40 W pulse-driven GaN HEMT power amplifier is presented. The design includes device evaluation, verification of designed matching circuits, and measurements of the designed power amplifier. Firstly, the optimum input and output impedances for the selected GaN HEMT chip from TriQuint Semiconductor Inc. are evaluated using load-pull measurement. The selected GaN HEMT shows extremely low optimum impedances, which are obtained using a pre-match load-pull method due to the limitation of the tuning impedance range of conventional impedance tuners. We propose a novel extraction of the optimum impedances with general pre-match circuits. The extracted optimum impedances are found to be close to those computed, using the large signal model supplied from TriQuint Semiconductor. Using the optimum impedances, the matching circuits of the power amplifier are designed employing the combined impedance transformer type based on EM co-simulation. The fabricated power amplifier has a size of 1517.8 mm2, an efficiency above 45%, power gain of 7.7–9.9 dB and output power of 47–44.8 dBm at 9–10 GHz with pulse width of 10 µsec and duty of 10%.

High-power T/R switch with GaN HEMT technology is successfully developed, and the design theory is formulated. The proposed switch employs an asymmetric series-shunt/shunt configuration. Because the power handling capability of the proposed switch is mainly dependent of the breakdown voltage of FETs, the proposed circuit can make full use of the characteristics of the GaN HEMT technology. The switch has a high degree of freedom for the FET gate widths, so the low insertion loss can be obtained while keeping high-power performances. To verify this methodology, T/R switch has been fabricated in X-band. The fabricated switch has demonstrated an insertion loss of 1.8 dB in Rx-mode, 1.2 dB in Tx-mode and power handling capability of 20 W in 53% bandwidth.

A novel predistortion technique using an automatic average-power bias controlled diode is proposed to compensate the complicated nonlinear characteristics of a microwave class-F power amplifier using an AlGaN/GaN HEMT. The optimum value for diode bias voltage is automatically set according to detected input average RF power level. A high-efficiency 1.9 GHz class-F GaN HEMT power amplifier with the automatic average-power bias control (ABC) diode linearizer achieves an improved third order inter-modulation distortion (IMD3) of better than -45 dBc at a smaller than 6 dB output power back-off from a saturated output power of 27 dBm, without changing drain efficiency. The adjacent channel leakage power ratio (ACPR) for 1.9 GHz W-CDMA signals is below -40 dBc at output power levels of smaller than 20 dBm for the class-F power amplifier.

Current collapse phenomenon is a well known obstacle in the AlGaN/GaN HEMTs. In order to improve the surface stability of HEMTs, we have investigated the SiN passivation film deposited by T-CVD, and we found that it improves both gate leakage current and current collapse phenomenon [1]. Moreover, we compared the T-CVD and PE-CVD passivation films, on high electric field DC and RF characteristics. We found that T-CVD SiN passivation film improves BVds-off by 30% because of the reduction of gate leakage current. It also improved ηd in the output power characteristics by load-pull measurement, which indicates the decrease of the current collapse phenomenon. Also we fabricated a multi-fingered 50 W-class AlGaN/GaN HEMT with T-CVD SiN passivation film and achieved 61.2% of high drain efficiency at frequency of 2.14 GHz, which was 3.6 points higher than that with PE-CVD SiN passivation film.

In AlGaN/GaN high electron mobility transistors (HEMTs), drain current reduction by current collapse phenomenon is a big obstacle for a high efficient operation of power amplifier application. In this study, we investigated the effects of SiN passivation film quality on the electrical characteristics of AlGaN/GaN HEMTs. First, we conducted some experiments to investigate the relationship between electrical characteristics of AlGaN/GaN HEMTs and various conditions of SiN passivation film by plasma enhanced chemical vapor deposition (PE-CVD). We found that both gate current leakage and current collapse were improved simultaneously by SiN passivation film deposited by optimized condition of NH3 and SiH4 gas flow. It is found that the critical parameter in the optimization is a IN-H/ ISi-H ratio measured by Fourier transforms infrared spectroscopy (FT-IR) spectra. Next, a thermal CVD SiN was applied to the passivation film to be investigated from the same point of view, because a thermal CVD SiN is well known to have good quality with low hydrogen content and high IN-H/ISi-H ratio. We confirmed that the thermal CVD SiN passivation could improve much further both of the gate leakage current and the current collapse in AlGaN/GaN-HEMTs. Furthermore, we tried to apply the thermal CVD SiN to the gate insulator in MIS (Metal Insulator Semiconductor) structure of AlGaN/GaN HEMTs. The thermal CVD SiN passivation was more suitable for the gate insulator than PE-CVD SiN passivation in a view of reducing current collapse phenomena. It could be believed that the thermal CVD SiN film is superior to the PE-CVD SiN film to achieve good passivation and gate insulator film for AlGaN/GaN HEMTs due to the low hydrogen content and the high IN-H/ISi-H ratio.

To reduce the gate leakage current of AlGaN/GaN HEMTs, we selected ITO/Ni/Au for Schottky electrodes and Schottky characteristics were compared with those of Ni/Au electrodes. ITO/Ni/Au and Ni/Au electrodes were deposited by vacuum evaporation and annealed at 350 in nitrogen atmosphere. From the I-V evaluation results of ITO/Ni/Au electrodes, forward and reverse leakage currents were reduced. Schottky characteristics of ITO/Ni/Au electrodes were also improved compared to these of Ni/Au electrodes. In addition, substantial decrease of leakage currents was confirmed after the annealing of HEMTs with ITO/Ni/Au electrodes. This may be explained that ITO/AlGaN interface state became lower by the annealing. By the temperature dependence of I-V curves, clear dependence was confirmed for the gates with ITO/Ni/Au electrodes. On the other hand, small dependence was observed for those with Ni/Au electrodes. From these results, tunnel leakage currents were dominant for the gates with Ni/Au electrode. Thermal emission current was dominant for the gates with ITO/Ni/Au electrode. The larger temperature dependence was caused that ITO/AlGaN interface states were smaller than those for Ni/Au electrode. It was suggested that suppressed AlGaN Schottky barrier thinning was caused by the surface defect donors, then tunneling leakage currents were decreased. We evaluated HEMT characteristics with ITO/Ni/Au electrode and Ni/Au electrode. Id max and Gm max were similar characteristics, but Vth with ITO/Ni/Au electrode was shifted +0.4 V than that with Ni/Au electrode due to the higher Schottky barrier. It was confirmed to have a good pinch-off currents and low gate leakage currents by ITO/Ni/Au electrodes.

Phase pure cubic (c-) GaN/AlGaN heterostructures on 3C-SiC free standing (001) substrates have successfully been developed. Almost complete (100%) phase pure c-GaN films are achieved with 2-nm surface roughness on 3C-SiC substrate and stoichiometric growth conditions. The polarization effect in c-GaN/AlGaN has been evaluated, based on measuring the transition energy of GaN/AlGaN quantum wells (QWs). It is demonstrated that the polarization electric fields are negligible small in c-GaN/AlGaN/3C-SiC compared with those of hexagonal (h-)GaN/AlGaN, 710 kV/cm for Al content x of 0.15, and 1.4 MV/cm for x of 0.25. A sheet carrier concentration of c-GaN/AlGaN heterojunction interface is estimated to 1.61012 cm-2, one order of magnitude smaller than that of h-GaN/AlGaN. The band diagrams of c-GaN/AlGaN HEMTs have been simulated to demonstrate the normally-off mode operation. The blocking voltage capability of GaN films was demonstrated with C-V measurement of Schottky diode test vehicle, and extrapolated higher than 600 V in c-GaN films at a doping level below 51015 cm-3, to show the possibility for high power electronics applications.

The correlation between ohmic contact resistivity (ρc) and transconductance (gm) in AlGaN/GaN high-electron-mobility transistors (HEMTs) was investigated. To characterize ρc precisely, we fabricated a circular transmission line model (c-TLM) pattern adjoined to a field-effect transistor (FET) pattern on an HEMT. By measuring ohmic contact resistance and sheet resistance using the adjoined c-TLM, intrinsic transconductance (gm0), which is not influenced by the source resistance, can be estimated. The gm0 thus obtained is between 179 and 206 mS/mm. Then, it became possible to calculate the correlation between gm and (ρc. We found that ρc should be below 10-5 Ωcm2 for the improvement of gm in AlGaN/GaN HEMT when Rsh 400 Ω/.

DC and RF performances of AlGaN/GaN HEMTs are simulated using a two-dimensional device simulator with the material parameters of GaN and AlGaN. The cut-off frequency is estimated as 205 GHz at the gate length of 0.05 µm and the drain breakdown voltage at this gate length is over 10 V. The values are satisfactory for millimeter wavelength power applications. The use of thin AlGaN layers has key importance to alleviate gate parasitic capacitance effects at this gate length.

The first implementations of X-band AlGaN/GaN HEMT single-ended frequency doublers are presented in this paper. Two types of fundamental frequency signal reflector schemes have been demonstrated for the frequency doubler application. Open-circuited quarter-wavelength microstrip line at the fundamental frequency is utilized for the reflector in a conventional way. In the other architecture a printed antenna is employed as a radiator as well as a novel fundamental frequency reflector. A microstrip rectangular patch antenna operating at the second harmonic frequency of the doubler was designed and integrated with AlGaN/GaN HEMT based on active integrated antenna design concept. Using AlGaN/GaN HEMT with 1 mm gate periphery, two 4 to 8 GHz frequency doublers were designed by the described design methodologies, fabricated, and tested. For the conventional frequency doubler, a conversion gain of 0.6 dB and with an output power of 15 dBm was observed. A conversion gain of 5 dB and an output power of 25 dBm with embedded antenna gain were achieved at a drain voltage of 12 V for the doubler integrated with the patch antenna.