In this research, we investigated the digital/analog-operation utilizing ferroelectric nondoped HfO2 (FeND-HfO2) as a blocking layer (BL) in the Hf-based metal/oxide/nitride/oxide/Si (MONOS) nonvolatile memory (NVM), so called FeNOS NVM. The Al/HfN0.5/HfN1.1/HfO2/p-Si(100) FeNOS diodes realized small equivalent oxide thickness (EOT) of 4.5 nm with the density of interface states (Dit) of 5.3 × 1010 eV-1cm-2 which were suitable for high-speed and low-voltage operation. The flat-band voltage (VFB) was well controlled as 80-100 mV with the input pulses of ±3 V/100 ms controlled by the partial polarization of FeND-HfO2 BL at each 2-bit state operated by the charge injection with the input pulses of +8 V/1-100 ms.

Quadrature phase-shift keying (QPSK) and 16-quadrature amplitude modulation (16QAM) formats are deployed in inter-data center networks where high transmission capacity and spectral efficiency are required. However, in intra-data center networks, a four-level pulse amplitude modulation (PAM4) format is deployed to satisfy the requirements for a simple and low-cost transceiver configuration. For the seamless and effective connection of such heterogeneous networks without an optical-electrical-optical conversion, an all-optical modulation format conversion technique is required. In this paper, we propose all-optical PAM4 to QPSK and 16QAM modulation format conversions using silicon-rich nitride waveguides. The successful conversions from 50-Gbps-class PAM4 signals to 50-Gbps-class QPSK and 100-Gbps-class 16QAM signals are demonstrated via numerical simulations.

The low temperature deposition of AlN at 160 °C is examined by using trimethyl aluminum (TMA) and NH radicals from plasma excited Ar diluted ammonia. For the deposition, a plasma tube separated from the reaction chamber is used to introduce the neutral NH radicals on the growing surface without the direct impacts of high-speed species and UV photons, which might be effective in suppressing the plasma damage to the sample surfaces. To maximize the NH radical generation, the NH3 and Ar mixing ratio is optimized by plasma optical emission spectroscopy. To determine the saturated condition of TMA and NH radical irradiations, an in-situ surface observation of IR absorption spectroscopy (IRAS) with a multiple internal reflection geometry is utilized. The low temperature AlN deposition is performed with the TMA and NH radical exposures whose conditions are determined by the IRAS experiment. The spectroscopic ellipsometry indicates the all-round surface deposition in which the growth per cycles measured from front and backside surfaces of the Si sample are of the same range from 0.39∼0.41nm/cycle. It is confirmed that the deposited film contains impurities of C, O, N although we discuss the method to decrease them. X-ray diffraction suggests the AlN polycrystal deposition with crystal phases of AlN (100), (002) and (101). From the saturation curves of TMA adsorption and its nitridation, their chemical reactions are discussed in this paper. In the present paper, we discuss the possibility of the low temperature AlN deposition.

This paper reports on X-band Gallium Nitride (GaN) chipsets for cost-effective 20W transmit-receive (T/R) modules. The chipset components include a GaN-on-Si monolithic microwave integrated circuit (MMIC) driver amplifier (DA), a GaN-on-SiC high power amplifier (HPA) with GaAs matching circuits, a high-gain GaN-on-Si HPA with a GaAs output matching circuit, and a GaN-on-Si MMIC switch (SW). By utilizing either combination of the DA or single high-gain HPA, the configurations of two T/R module types can be realized. The GaN-on-Si MMIC DA demonstrates an output power of 6.4-7.4W, an associate gain of 22.3-24.6dB and a power added efficiency (PAE) of 32-36% over 9.0-11.0GHz. A GaN-on-SiC HPA with GaAs matching circuits exhibited an output power of 20-28W, associate gain of 7.8-10.7dB, and a PAE of 40-56% over 9.0-11.0GHz. The high-gain GaN-on-Si HPA with a GaAs output matching circuit exhibits an output power of 15-30W, associate gain of 27-30dB, and PAE of 26-33% over 9.0-11.0GHz. The GaN-on-Si MMIC switch demonstrates insertion losses of 1.1-1.3dB and isolation of 10.1-14.7dB over 8.0-11.5GHz. By employing cost-effective circuit configurations, the costs of these chipsets are estimated to be about half that of conventional chipsets.

A methodology for obtaining semi-custom high-power amplifiers (HPAs) is described. The semi-custom concept pertains to the notion that a selectable output power is attainable by replacing only transistors. To compensate for the mismatch loss, a new output matching network that can be easily tuned by wiring is proposed. Design equations were derived to determine the circuit parameters and specify the bandwidth limitations. To verify this methodology, a semi-custom HPA with GaN HEMTs was fabricated in the S-band. A selectable output power from 240 to 150 W was successfully achieved while maintaining a PAE of over 50% in a 19% relative bandwidth.

The growth mechanisms of three-dimensionally (3D) faceted InGaN quantum wells (QWs) on (=1=12=2) GaN substrates are discussed. The structure is composed of (=1=12=2), {=110=1}, and {=1100} planes, and the cross sectional shape is similar to that of 3D QWs on (0001). However, the 3D QWs on (=1=12=2) and (0001) show quite different inter-facet variation of In compositions. To clarify this observation, the local thicknesses of constituent InN and GaN on the 3D GaN are fitted with a formula derived from the diffusion equation. It is suggested that the difference in the In incorporation efficiency of each crystallographic plane strongly affects the surface In adatom migration.

The electron retention characteristics of memory capacitors with blocking oxide-silicon carbonitride (SiCN)-tunnel oxide stacked films were investigated for application in embedded charge trapping nonvolatile memories (NVMs). Long-term data retention in the SiCN memory capacitors was estimated to be more than 10 years at 85 °C. We presented an improved method to analyze the energy distribution of electron trap states numerically. Using the presented analytical method, electron trap states in the SiCN film were revealed to be distributed from 0.8 to 1.3 eV below the conduction band edge in the SiCN band gap. The presence of energetically deep trap states leads us to suggest that the SiCN dielectric films can be employed as the charge trapping film of embedded NVMs.

In this work, the bias polarity dependent resistive switching behaviors in Cu/Si3N4/p+ Si RRAM memory cell have been closely studied. Different switching characteristics in both unipolar and bipolar modes after the positive forming are investigated. The bipolar switching did not need a forming process and showed better characteristics including endurance cycling, uniformity of switching parameters, and on/off resistance ratio. Also, the resistive switching characteristics by both positive and negative forming switching are compared. It has been confirmed that both unipolar and bipolar modes after the negative forming exhibits inferior resistive switching performances due to high forming voltage and current.

The copper nitride surface characteristics according to atmospheric pressure plasma (APP) and excimer ultraviolet (EUV) treatment were compared using XPS and AFM. As the result of XPS analysis result, in C1s, the organic material removal effect was greater for EUV treatment than for APP, and the oxygen content was found to be low. In Cu (933 eV) area, the shoulder peak of Cu compound was detected, and the reduction was greater for EUV processing than for APP. In the AFM phase image which could be analyzed using the superficial viscoelasticity, the same trend was observed. On the copper nitride surface, the weak boundary O layer is formed according to the clean processing, and such phenomenon was interpreted as a factor for lowering the affinity with polymer.

In this paper, the design and fabrication of a miniaturized class-F 2.5 GHz 8 W power amplifier using a commercially available GaN HEMT bare chip from TriQuint and a Selectively Anodized Aluminum Oxide (SAAO) substrate are presented. The SAAO process was recently proposed and patented by Wavenics Inc., Daejeon, Korea, which provides the fabrication of small size circuit comparable to conventional MMIC and at drastically low cost due to the use of aluminum as a wafer. The advantage of low cost is especially promising for RF components fabrication in commercial applications like mobile communications. The fabricated power amplifier has a compact size of 4.4 4.4 mm2 and shows power added efficiency (PAE) of about 35% and harmonic suppression of above 30 dBc for second and third harmonics at an output power of 39 dBm.

The design, fabrication and characterization of GaN based varactor diodes are presented. MOCVD was used for layer growth and the DC characteristic of 4 µm diameter diodes showed a turn-on voltage of 0.5 V, a breakdown voltage of 21 V and a modulation ratio of 1.63. High frequency characterization allowed obtaining the diode equivalent circuit and observed the bias dependence of the series resistance. The diode cutoff frequency was 900 GHz. A large-signal model was developed for the diode and the device power performance was evaluated. A power of 7.2 dBm with an efficiency of 16.6% was predicted for 47 GHz to 94 GHz doubling.

A complete analysis of GaN-based structures with very promising characteristics for future optical waveguide devices, such as modulators, is presented. First the material growth was optimized for low dislocation density and surface roughness. Optical measurements demonstrate excellent waveguide properties in terms of index and temperature dependence while planar propagation losses are below 1 dB/cm. Bias was applied on both sides of the epitaxially grown films to evaluate the refractive index dependence on reverse voltage and a variation of 2.10-3 was found for 30 V. These results support the possibility of using structures of this type for the fabrication of modulator devices such as Mach-Zehnder interferometers.

This work addresses the enormous efficiency and linearity potential of optimized AlGaN/GaN high-electron mobility transistors (HEMT) in conventional Doherty linear base-station amplifiers at 2.7 GHz. Supported by physical device simulation, the work further elaborates on the use of AlGaN/GaN HEMTs in high-speed current-switch-mode class-D (CMCD)/class-S MMICs for data rates of up to 8 Gbit/s equivalent to 2 GHz RF-operation. The device needs for switch-mode operation are derived and verified by MMIC results in class-S and class-D operation. To the authors' knowledge, this is the first time 2 GHz-equivalent digital-switch-mode RF-operation is demonstrated with GaN HEMTs with high efficiency.

The programming characteristics of polysilicon-aluminum oxide-nitride-oxide-silicon (SANOS) nonvolatile memory devices with Al2O3 and SiO2 stacked tunneling layers were investigated. The electron and hole drifts in the Si3N4 layer were calculated to determine the program speed of the proposed SANOS devices. Simulation results showed that enhancement of the programming speed in SANOS was achieved by utilizing SiO2 and Al2O3 stacked tunneling layers.

Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface state density was the order of 1012 cm-2eV-1, and was same order to the value for the sample carefully prepared by oxidation and post oxidation annealing. The interface state density determined from n was consistent to the value calculated from the capacitance voltage curve of SiO2/nitride/SiC MIS diode by Terman method. High temperature nitridation was effective to reduce the interface state density.

This paper presents a detailed study of the retention characteristics in scaled multi-bit SONOS flash memories. By calculating the oxide field and tunneling currents, we evaluate the charge trapping mechanism. We calculate transient retention dynamics with the ONO fields, trapped charge, and tunneling currents. All the parameters were obtained by physics-based equations and without any fitting parameters or optimization steps. The results can be used with nanoscale nonvolatile memory. This modeling accounts for the VT shift as a function of trapped charge density, time, silicon fin thickness and type of trapped charge, and can be used for optimizing the ONO geometry and parameters for maximum performance.

In this paper we review our recent work developing the growth of AlGaN/GaN high-electron mobility transistors (HEMTs) grown on SiC (0001) by plasma-assisted molecular beam epitaxy (PA-MBE). State-of-the-art AlGaN/GaN HEMTs have been achieved using MBE-grown material. Buffer leakage was an important limiting factor for early devices. We have shown that by appropriately controlling the Al/N flux ratio during growth of the nucleation layer on SiC(0001), low-leakage GaN buffers can be subsequently grown. In addition, a "modulated growth" technique was developed to achieve large area uniformity and surface morphology control. High-performance HEMTs were fabricated utilizing these two techniques. On 200 nm gate-length devices, at 4 GHz an output power density of 8.4 W/mm was obtained with a power-added efficiency (PAE) of 67% at a drain bias of 30 V. At a higher drain bias (42 V), 13.7 W/mm with a PAE of 55% was achieved.

White-light emitting diode lamps for general illumination can be realized by a combination of a blue light-emitting diode semiconductor die and phosphors. Newly developed oxynitride and nitride phosphors are promising candidates for this application because they have suitable excitation and emission wavelengths and stable optical properties in a high temperature environment. High brightness warm-white LED lamps have been realized using a yellowish-orange α-SiAlON oxynitride phosphor. High color-rendering index white LED lamps have been also realized using three color oxynitride/nitride phosphors.

The problems with the CV characterization on very leaky (thin) nitrided oxide are mainly due to the measurement precision and MOS gate dielectric model accuracy. By doing S-parameter measurement at RF frequency and using simple but reasonably accurate model, we can obtain proper CV curves for very thin nitrided gate dielectrics. Regarding the measurement frequency we propose a systematic method to find a frequency range in which we can select measurement frequencies for all biases to obtain a full CV curve. Moreover, we formulated the first order relationship between the measurement frequency range and the test structure design for CV characterization. With the established formulae, we redesigned the test structures and verified that the formulae can be used as a guideline for the test structure design for RFCV measurements.

Using various rare earth sesquioxides as additives, silicon nitride (Si3N4) samples were sintered at 1700 for 4 h by millimeter-wave heating performed in an applicator fed by a 28 GHz Gyrotron source under a nitrogen pressure of 0.1 MPa. A comparative study of densification, grain growth behavior and mechanical properties of silicon nitride fabricated by millimeter-wave and conventional sintering was carried out. Bulk densities were measured by Archimedes' technique. Except for the Eu2O3 containing sample, all samples were densified to relative densities of above 97.0%. Microstructure of the specimens was analyzed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). To investigate quantitatively the effect of millimeter-wave heating on grain growth, image analysis was carried out for grains in the specimens. Fracture toughness was determined by the indentation-fracture method (IF method) in accordance with Japan Industrial Standards (JIS). Fully dense millimeter-wave sintered silicon nitride presenting a bimodal microstructure exhibited higher values of fracture toughness than materials processed by conventional heating techniques. Results indicate that millimeter-wave sintering is more effective in enhancing the grain growth and in producing the bimodal microstructure than conventional heating. It was also confirmed that localized runaway in temperature, depending upon the sintering additives, can occur under millimeter-wave heating.