This paper describes a design of energy-efficient Standard Cell Memory (SCM) using Silicon-on-Thin-BOX (SOTB). We present automatic place and routing (P&R) methodology for optimal body-bias separation (BBS) for SCM, which enables to apply different body bias voltages to latches and to other peripheral circuits within SCM. Capability of SOTB to effectively reduce leakage by body biasing is fully exploited in BBS. Simulation results demonstrated that our approach allows us to design SCM with 40% smaller energy dissipation at the energy minimum voltage as compared to the conventional design flow. For the process and temperature variations, Adaptive Body Bias (ABB) for SCM with our BBS provided 70% smaller leakage energy than ABB for the conventional SCM, while achieving the same clock frequency.

The purpose of this study is to investigate the effects of device size on non-visual icon search using a touch interface with voice output. We conducted an experiment in which twelve participants searched for the target icons with four different-sized touchscreen devices. We analyzed the search time, search strategies and subjective evaluations. As a result, mobile devices with a screen size of 4.7 inches had the shortest search time and obtained the highest subjective evaluation among the four devices.

We proposed the simulation method of reconstructed holographic images in considering phase distribution in the small pixels of liquid crystal spatial light modulator (LC-SLM) and clarified zero-order diffraction appeared on the reconstructed images when the phase distribution in a single pixel is non-uniform. These results are useful for design of fine LC-SLM for realizing wide-viewing-angle holographic displays.

Nowadays, semiconductor quantum dots have attracted intense attention as emissive materials for light-emitting diodes, due to their high photoluminescence quantum yield and the controllability of their photoluminescence spectrum by changing the core diameter. In general, semiconductor quantum dots contain large amounts of organic ligands around the core/shell structure to obtain dispersibility in solution, which leads to solution processability of the semiconductor quantum dot. Furthermore, organic ligands, such as straight alkyl chains, are generally insulating materials, which affects the carrier transport in thin-film light-emitting diodes. However, a detailed investigation has not been performed yet. In this paper, we investigated the luminance characteristics of quantum-dot light-emitting diodes containing ZnCuInS2 quantum dots with different carbon chain lengths of alkyl thiol ligands as emitting layers. By evaluating the CH2/CH3 ratio from Fourier-transform infrared spectra and thermal analysis, it was found that approximately half of the oleylamine ligands were converted to alkyl thiol ligands, and the evaporation temperature increased with increasing carbon chain length of the alkyl thiol ligands based on thermogravimetric analysis. However, the photoluminescence quantum yield and the spectral shape were almost the same, even after the ligand-exchange process from the oleylamine ligand to the alkyl thiol ligand. The peak wavelength of the photoluminescence spectra and the photoluminescence quantum yield were approximately 610 nm and 10%, respectively, for all samples. In addition, the surface morphology of spin coated ZnCuInS2 quantum-dot layers did not change after the ligand-exchange process, and the root-mean-square roughness was around 1 nm. Finally, the luminance efficiency of an inverted device structure increased with decreasing carbon chain length of the alkyl thiol ligands, which were connected around the ZnCuInS2 quantum dots. The maximum luminance and current efficiency were 86 cd/m2 and 0.083 cd/A, respectively.

We present dynamic mode switching characteristic by using a 2 × 2 optical mode switch based on silicon waveguide. The configuration of optical mode switch is similar to MZI where the width of input and output ports are designed to permit the combining of the fundamental mode and the first order mode. We designed the symmetrical arms with phase shifter based on p-i-n structure in one arm to generate a π-phase difference between each arm. As a result, mode switching with the injection current of 60mA (5.7V) was successfully achieved with the mode crosstalk of -10dB at λ=1550nm. A minimum of less than 60ns and 40ns mode switching time for the fundamental mode to first order mode and first order mode to fundamental mode, was achieved respectively in this time.

We propose a novel structure that can reduce the power consumption and extend the transmission distance of an electro-absorption modulator integrated with a DFB (EADFB) laser. To overcome the trade-off relationship of the optical loss and chirp parameter of the EA modulator, we integrate a semiconductor optical amplifier (SOA) with an EADFB laser. With the proposed SOA assisted extended reach EADFB laser (AXEL) structure, the LD and SOA sections are operated by an electrically connected input port. We describe a design for AXEL that optimizes the LD and SOA length ratio when their total operation current is 80mA. By using the designed AXEL, the power consumption of a 10-Gbit/s, 1.55-µm EADFB laser is reduced by 1/2 and at the same time the transmission distance is extended from 80 to 100km.

To drastically increase the splitting ratio of extended-reach (40km span) time- and wavelength-division multiplexed passive optical networks (WDM/TDM-PONs), we modify the gain control scheme of our automatic gain controlled semiconductor optical amplifiers (AGC-SOAs) that were developed to support upstream transmission in long-reach systems. While the original AGC-SOAs are located outside the central office (CO) as repeaters, the new AGC-SOAs are located inside the CO and connected to each branch of an optical splitter in the CO. This arrangement has the potential to greatly reduce the costs of CO-sited equipment as they are shared by many more users if the new gain control scheme works properly even when the input optical powers are low. We develop a prototype and experimentally confirm its effectiveness in increasing the splitting ratio of extended-reach systems to 512.

Silicon-on-insulator (SOI) has become one of the most famous materials in recent years, especially in silicon photonics applications. This paper presents a comparative performance of a SOI-based optical interconnect (OI) vs. an electrical interconnect (EI) for high-speed performances at a circuit level. The SOI-based optical waveguide was designed using OptiBPM to obtain a single mode condition (SMC). Then, the optical interconnect (OI) link was simulated in OptiSPICE and was tested as an interconnection in two-stage CS amplifiers. The results showed that the two-stage CS amplifier using OI offered several advantages in terms of electrical performances, such as voltage gain, frequency bandwidth, slew rate, and propagation delay, which makes it superior to the EI.

The electron retention characteristics of memory capacitors with blocking oxide-silicon carbonitride (SiCN)-tunnel oxide stacked films were investigated for application in embedded charge trapping nonvolatile memories (NVMs). Long-term data retention in the SiCN memory capacitors was estimated to be more than 10 years at 85 °C. We presented an improved method to analyze the energy distribution of electron trap states numerically. Using the presented analytical method, electron trap states in the SiCN film were revealed to be distributed from 0.8 to 1.3 eV below the conduction band edge in the SiCN band gap. The presence of energetically deep trap states leads us to suggest that the SiCN dielectric films can be employed as the charge trapping film of embedded NVMs.

Improving robustness in electrostatic discharge (ESD) protection by inserting drain-side isolated silicon-controlled rectifiers (SCRs) in a high-voltage (HV) p-channel lateral-diffused MOSFET (pLDMOS) device was investigated in this paper. Additionally, the effects of anti-ESD reliability in the HV pLDMOS transistors provided by this technique were evaluated. From the experimental data, it was determined that the holding voltage (Vh) values of the pLDMOS with an embedded npn-arranged SCR and discrete thin-oxide (OD) layout on the cathode side increased as the parasitic SCR OD row number decreased. Moreover, the trigger voltage (Vt1) and the Vh values of the pLDMOS with a parasitic pnp-arranged SCR and discrete OD layout on the drain side fluctuated slightly as the SCR OD-row number decreased. Furthermore, the secondary breakdown current (It2) values (i.e., the equivalent ESD-reliability robustness) of all pLDMOS-SCR npn-arranged types increased (>408.4%) to a higher degree than those of the pure pLDMOS, except for npn-DIS_3 and npn-DIS_2, which had low areas of SCRs. All pLDMOS-SCR pnp-arranged types exhibited an increase of up to 2.2A-2.4A, except for the pnp_DIS_3 and pnp_DIS_2 samples; the pnp_DIS_91 increased by approximately 2000.9% (249.1%), exhibiting a higher increase than that of the reference pLDMOS (i.e., the corresponding pnp-stripe type). The ESD robustness of the pLDMOS-SCR pnp-arranged type and npn-arranged type with a discrete OD layout on the SCR cathode side was greater than that of the corresponding pLDMOS-SCR stripe type and a pure pLDMOS, particularly in the pLDMOS-SCR pnp-arranged type.

In this paper, Epitaxial (Epi) Junction Termination Extension (JTE) technique for silicon carbide (SiC) power device is presented. Unlike conventional JTE, the Epi-JTE doesn't require high temperature (about 500°C) implantation process. Thus, it doesn't require high temperature (about 1700°C) process for implanted dose activation and surface defect curing. Therefore, the manufacturing cost will be decreased. Also, the fabrication process is very simple because the dose of the JTE is controlled by epitaxy growth. The blocking characteristic is analyzed through 2D-simulation for the proposed Epi-JTE. In addition, the effect was validated by experiment of fabricated SiC device with the Single-Zone-Epi-JTE. As a result, it has blocking capability of 79.4% compared to ideal parallel-plane junction breakdown.

We have developed membrane distributed Bragg reflector (DBR) lasers on thermally oxidized Si substrate (SiO2/Si substrate) to evaluate the parameters of the on-Si lasers we have been developing. The lasers have InGaAsP-based multi-quantum wells (MQWs) grown on InP substrate. We used direct bonding to transfer this active epitaxial layer to SiO2/Si substrate, followed by epitaxial growth of InP to fabricate a buried-heterostructure (BH) on Si. The lateral p-i-n structure was formed by thermal diffusion of Zn and ion implantation of Si. For the purpose of evaluating laser parameters such as internal quantum efficiency and internal loss, we fabricated long-cavity lasers that have 200- to 600-µm-long active regions. The fabricated DBR lasers exhibit threshold currents of 1.7, 2.1, 2.8, and 3.7mA for active-region lengths of 200, 300, 400, and 600µm, respectively. The differential quantum efficiency also depends on active-region length. In addition, the laser characteristics depend on the distance between active region and p-doped region. We evaluated the internal loss to be 10.2cm-1 and internal quantum efficiency to be 32.4% with appropriate doping profile.

Dry etching is one of the elemental technologies for the fabrication of optical devices. In order to obtain the desired shape using the dry etching process, it is necessary to understand the reactivity of the materials being used to plasma. In particular, III-V compound semiconductors have a multi-layered structure comprising a plurality of elements and thus it is important to first have a full understanding of the basic trends of plasma dry etching, the plasma type and the characteristics of etching plasma sources. In this paper, III-V compound semiconductor etching for use in light sources such as LDs and LEDs, will be described. Glass, LN and LT used in the formation of waveguides and MLA will be introduced as well. And finally, the future prospects of dry etching will be described briefly.

We prepared alumina passivation films for p-type silicon substrates by sol-gel wet process mainly using aluminum isopropoxide (Al(O-i-Pr)3) as a precursor material. The precursor solution was spin-coated onto p-type silicon substrates and then calcined for 1 hour in air. Minority carrier lifetime of the passivated wafers was evaluated for different calcination temperature conditions. We also compared the passivation quality of the alumina passivation films using different alumina precursor, aluminum acetylacetonate (Al(acac)3). Obtained effective minority carrier lifetime indicated that the lifetime is strongly depends on the calcination temperature. The substrate calcined below 400°C shows relatively short lifetime below 100 µsec. On the other hand, the substrate calcined around 500°C to 600°C indicates lifetime from 250 to 300 µsec. Calcination temperature dependence of the lifetime for the samples using Al(O-i-Pr)3 precursors shows almost the same as that using Al(acac)3.

We fabricated silicon solar cells with spin-coated sol-gel alumina passivation layers on the rear side. Spin-coated alumina passivation films have moderate passivation quality and are inferior to atomic layer deposited passivation films. However, low-cost and low temperature process of the sol-gel deposition is still beneficial for the cells using commercially available Cz silicon wafers. Thus, we consider an applicability of the spin-coated alumina passivation layer for rear side passivation. Dependence of cell efficiency on contact spacing and contact diameter of a rear electrode was investigated by both experiments and numerical calculation. The experimental results indicated that conversion efficiency of the cell is enhanced from 9.1% to 11.1% by optimizing an aperture ratio and contact spacing of the rear passivation layers. Numerical calculation indicated that small contact diameter with low aperture ratio of a rear passivation layer is preferable to achieve good cell performance in our experimental condition. We confirmed the effectivity of the spin-coated alumina passivation films for rear surface passivation of the low-cost silicon solar cells.

nMOS-type and pMOS-type silicon avalanche photodiodes (APDs) were fabricated by standard 0.18µm CMOS process, and the current-voltage characteristic and the frequency response of the APDs with and without guard ring structure were measured. The role of the guard ring is cancellation of photo-generated carriers in a deep layer and a substrate. The bandwidth of the APD is enhanced with the guard ring structure at a sacrifice of the responsivity. Based on comparison of nMOS-type and pMOS-type APDs, the nMOS-type APD is more suitable for high-speed operation. The bandwidth is enhanced with decreasing the spacing of interdigital electrodes due to decreased carrier transit time and with decreasing the detection area and the PAD size for RF probing due to decreased device capacitance. The maximum bandwidth was achieved with the avalanche gain of about 10. Finally, we fabricated a nMOS-type APD with the electrode spacing of 0.84µm, the detection area of 10×10µm2, the PAD size for RF probing of 30×30µm2, and with the guard ring structure. The maximum bandwidth of 8.4GHz was achieved along with the gain-bandwidth product of 280GHz.

We have derived the physics-based equivalent circuit model of a semiconductor-integrated bow-tie antenna (BTA) for expressing its impedance and radiation characteristics as a terahertz transmitter. The equivalent circuit branches and components, consisting of 16 RLC parameters are determined based on electromagnetic simulations. All the values of the circuit elements are identified using the particle swarm optimization (PSO) that is one of the modern multi-purpose optimization methods. Moreover, each element value can also be explained by the structure of the semiconductor-integrated BTA, the device size, and the material parameters.

In order to realize high-yield speckle modulation, we developed a novel spatial light modulator using zinc oxide single crystal doped with nitrogen ions. The distribution of dopants was optimized to induce characteristic optical functions by applying an annealing method developed by us. The device is driven by a current in the in-plane direction, which induces magnetic fields. These fields strongly interact with the doped material, and the spatial distribution of the refractive index is correspondingly modulated via external control. Using this device, we experimentally demonstrated speckle modulation, and we discuss the quantitative superiority of our approach.

Abstract The concept, state of the art, and future development directions of hybrid semiconductor integrated circuits (HySICs), which combine RF-CMOS ICs with compound semiconductor monolithic microwave integrated circuits (MMICs) are described in this paper, taking up recent wireless technologies as example applications. It is shown that ICs with superior function can be designed by mixing the optimal characteristics from the different semiconductors. To realize new semiconductor ICs, several component technologies for RF-HySIC are introduced in terms of chip/MMIC design, measurement, and breadboard model fabrication. A prototype RF-HySIC is described for the combination of a GaN Schottky barrier diode with a Si RF-IC matching network developed at 5.8GHz. A GaN diode structure, measurement and characterization of nonlinear devices, a GaN amplifier, and a GaAs MMIC are introduced as component technologies. In addition, the design for using an RF-CMOS matching network circuit with a size of 1.2mm × 2.3mm and room-temperature chip/wafer direct bonding under high-pressure conditions are explained. For advanced and autonomous ICs, HySIC and chip/MMIC topologies combined with a processor are proposed for application of HySIC to wireless sensor systems.

We have proposed and demonstrated the principle of optical mode switch. However, the crosstalk between modes has not yet reported due to the difficulty of mode recognition and distinction. To accomplish this mode crosstalk evaluation, we integrated multimode interference (MMI) mode filter with the optical mode switch in this work. As a result, for the both TE and TM modes, the crosstalk of approximately -10 dB has been evaluated experimentally.