A TlGaAs/GaAs multiple quantum-well (MQW) structure having four identical well layers was grown on a GaAs (001) substrate by low-temperature molecular-beam epitaxy (MBE) at 190. The (004) X-ray diffraction (XRD) curve of this sample showed satellite peaks up to the 3rd order at least. The measured XRD curve agreed well with the theoretically simulated one with a Tl content of x=7% and a width of 57 for the TlxGa1-xAs well layers. This result indicates that the grown MQW structure has good single-crystalline quality as well as flat and sharp interfaces.

We propose an analysis method for Franz-Keldysh (FK) oscillations appearing in photoreflectance (PR) spectra of heterojunction device structures, which enables precise and simultaneous evaluation of the built-in electric field strength and band-gap energy. Samples for PR measurements were n+-GaAs/n-Al0.3 Ga0.7 As/i-GaAs heterostructures with different Al0.3Ga0.7As-layer thickness. We have found that the phase of the FK oscillations originating from the i-GaAs buffer layer depends on the Al0.3 Ga0.7 As-layer thickness. We have derived a calculation model for FK oscillations that includes the interference of probe light. From the comparison of the calculated spectra with the measured spectra, we conclude that mixing of the real and imaginary parts of a modulated dielectric function, which is caused by the probe-light interference, gives rise to the phase shift of the FK oscillations. Our FK-oscillation analysis method reduces ambiguity in the estimation of band-gap energy that is considerable in a conventional analysis.

DC and RF performances of AlGaN/GaN HEMTs are simulated using a two-dimensional device simulator with the material parameters of GaN and AlGaN. The cut-off frequency is estimated as 205 GHz at the gate length of 0.05 µm and the drain breakdown voltage at this gate length is over 10 V. The values are satisfactory for millimeter wavelength power applications. The use of thin AlGaN layers has key importance to alleviate gate parasitic capacitance effects at this gate length.

Schottky gas sensors of CO were fabricated using high quality AlGaN/GaN/Si heterostructures. The CO sensors show good sensitivity in the temperature range of 250 to 300 (530%, at 160 ppm CO in N2) and fast response comparable with SnO2 sensors. A two-region linear regime was observed for the dependence of sensitivity on CO concentration. GaN sensors on Si substrate offer the possibility of integration with Si based electronics. The gas sensors show slow response with time, the change of material properties possibly in the presence of large thermal stress.

For the mass production of GaN-based electronic devices, growth of AlGaN/GaN heterostructures on substrates larger than 100 mm in diameter is indispensable. In this study, we demonstrate the growth of 100-mm-diameter Al0.26Ga0.74N/GaN heterostructures on sapphire substrates by metalorganic vapor phase epitaxy (MOVPE). The obtained films have specular surfaces, good crystal quality and good uniformity of alloy composition across the entire 100-mm-diameter epitaxial wafer. The bowing value of the 100-mm-diameter epitaxial wafer on c-face sapphire substrates is about 40 µm. This bowing value seems to be preferable for electronic device fabrication processes. These epitaxial wafers show good electrical properties.

High-temperature stability of copper (Cu) gate AlGaN/GaN high electron mobility transistors (HEMTs) was investigated. Samples were annealed at various temperatures to monitor the changes on device performances. Current-voltage performance such as drain-source current, transconductance, threshold voltage and gate leakage current has no obvious degradation up to annealing temperature of 500 and time of 5 minutes. Also up to this temperature, no copper diffusion was found at the Cu and AlGaN interface by secondary ion mass spectrometry determination. At annealing temperature of 700 and time of 5 minutes, device performance was found to have degraded. Gate voltage swing increased and threshold voltage shifted due to Cu diffusion into AlGaN. These results indicate that the Schottky contact and device performance of Cu-gate AlGaN/GaN HEMT is stable up to annealing temperature of 500. Cu is a promising candidate as gate metallization for high-performance power AlGaN/GaN HEMTs.

We have demonstrated AlGaN/GaN high electron mobility transistors (HEMTs) grown on epitaxial AlN/sapphire templates. The crystal qualities and fabricated device performances between AlGaN/GaN HEMTs on epitaxial AlN/sapphire templates and conventional AlGaN/GaN HEMTs on sapphire substrates with low-temperature buffer layer (LT-BLs) are compared with each other. By using epitaxial AlN/sapphire templates instead of LT-BLs, higher mobility was exhibited and superior crystal qualities were observed, as confirmed by X-ray diffraction (XRD), atomic force microscopy (AFM) images and capacitance-voltage measurements. In addition, the dc characteristics of the fabricated devices on epitaxial AlN/sapphire templates were enhanced. AlGaN/GaN HEMTs on epitaxial AlN/sapphire templates are promising candidates for practical applications of nitride-based electronic devices.

We report in this paper, the performance of AlGaN/GaN HFETs in the context of high power, low noise and high temperature operations, along with a comparison of their characteristics with other conventional technologies. Finally, a single stage modulator driver for long haul optical communications is presented as an example of application of the GaN-based devices high power handling capabilities.

We report the investigation of major dispersion mechanisms such as self-heating, trapping, current collapse, and floating-body effects present in AlGaN/GaN HFETs. These effects are analyzed using DC/Pulsed IV, load-pull, low-frequency noise systems, and a cryogenic probe station. This study leads to a better understanding of the device physics, which is critical for accurate large-signal modeling and device optimization.

The first implementations of X-band AlGaN/GaN HEMT single-ended frequency doublers are presented in this paper. Two types of fundamental frequency signal reflector schemes have been demonstrated for the frequency doubler application. Open-circuited quarter-wavelength microstrip line at the fundamental frequency is utilized for the reflector in a conventional way. In the other architecture a printed antenna is employed as a radiator as well as a novel fundamental frequency reflector. A microstrip rectangular patch antenna operating at the second harmonic frequency of the doubler was designed and integrated with AlGaN/GaN HEMT based on active integrated antenna design concept. Using AlGaN/GaN HEMT with 1 mm gate periphery, two 4 to 8 GHz frequency doublers were designed by the described design methodologies, fabricated, and tested. For the conventional frequency doubler, a conversion gain of 0.6 dB and with an output power of 15 dBm was observed. A conversion gain of 5 dB and an output power of 25 dBm with embedded antenna gain were achieved at a drain voltage of 12 V for the doubler integrated with the patch antenna.

We fabricated 1.3µm AlGaInAs inner-stripe laser diodes (LDs), employing a GaInAsP waveguide layer and an n-InP current blocking layer. We compared the effects of the thickness of n-InP current blocking layer. A blocking layer with 500nm thick restricts the leakage current significantly. The inner-stripe LD was compared with the conventional ridge LD. I-L characteristics of both types of LDs were measured. Threshold currents of the inner-stripe LD and the ridge LD were 8.5 and 10.6mA, respectively. A threshold current of the inner-stripe LD is smaller than that of ridge LD. And the resistance of the inner-stripe LD was a few ohms lower than that of the ridge LD. Output power of 88mW was obtained at 200mA with 300µ m-long cavity. This was twice the power of a conventional ridge laser. The characteristic temperature of the inner-stripe LD was obtained 76 K from 20 to 85. We obtained a good linearity up to 100mA at 85. Therefore the inner-stripe LD has an advantage of high power devices.

We report here on the electrical and structural characteristics of InGaP/GaInAsN DHBTs with up to a 50 mV reduction in turn-on voltage relative to standard InGaP/GaAs HBTs. High p-type doping levels ( 3 1019 cm-3) and dc current gain (βmax up to 100) are achieved in GaInAsN base layer structures ranging in base sheet resistance between 250 and 750 Ω/. The separate effects of a base-emitter conduction band spike and base layer energy-gap on turn-on voltage are ascertained by comparing the collector current characteristics of several different GaAs-based bipolar transistors. Photoluminescence measurements are made on the InGaP/GaInAsN DHBTs to confirm the base layer energy gap, and double crystal x-ray diffraction spectrums are used to assess strain levels in the GaInAsN base layer.

The reduction of the drain current for InGaAs/AlGaAs pseudomorphic high electron mobility transistors (PHEMTs) has been observed due to the RIE-damage induced under the gate region. However, it has been found that the drain current can be recovered after the gate-drain reverse current stress even at room temperature. The recovery rate of the drain current strongly depends on the gate-drain reverse current density. The activation energy of the recovery rate has been confirmed to decrease from 0.531 eV to 0.119 eV under the gate-drain reverse current stress. This phenomenon can be understood as a recombination enhanced defect reaction of holes generated by the avalanche breakdown. The non-radiative recombination of holes at the defect level is believed to enhance the recovery of the RIE-damage.

Photoelectric techniques, such as photoluminescence are commonly used to evaluate and qualify heterostructure materials. These studies provide invaluable information on the energy configuration of these devices. In this paper, we extend photoelectric techniques to the evaluation of fully fabricated HBTs. We describe photoconduction measurements performed on the base/collector junctions in GaAs based HBTs. The devices studied contained a window in the emitter metal and monochromatic, chopped light was focused through a microscope into the window. The measurements are performed on wafer at room temperature. The spectral characteristic of the photocurrent provides information on the material and allows the determination of the source of the measured photocurrent. The dependence of the photocurrent on the junction bias allows the profiling of the junction. Three different collector structures were investigated, containing GaAs, AlGaAs, and InGaP. The effects of electron and hole barriers are evaluated. The information obtained allows for the design of improved HBTs.

In this paper we summarize the actual status of the GaN/AlGaN HFET power technology at DaimlerChrysler using high quality structures grown by MOCVD on sapphire or semi-insulating SiC supplied by Epitronics. High mobilites and record extrinsic transconductance and current values were achieved on devices with sapphire and SiC substrate. Small area devices with 0.3 µm gate length yield fT=43 GHz and fmax=78 GHz (s.i. SiC substrate). Load-pull characterisation have been performed on multifinger HFETs up to 20 GHz with e.g. output power levels above 3 Watt cw at 15 GHz for a single 1.6 mm device. Though the achieved results are very promising, the performance of these devices is still hampered by transient effects on different time scales. We will show in this paper that passivation of the devices by SiN could considerably improve the RF power performance as well as reduce long time constant effects present before passivation.

A broadcast distribution system (BDS) is a system for the distribution of digital contents over broadcast channel where the data supplier broadcasts the contents in encrypted form and gives each subscriber a decoder containing a secret decryption key. A traitor is a subscriber who offers the information which allows to decrypt the broadcast. When a pirate decoder is captured, if at least one traitor can be identified from it, a BDS is said to be traitor-tracing. If the data supplier can prevent subscribers from obtaining the contents without recalling their decoders, a BDS is said to be subscriber-excluding. In this paper, we propose an efficient BDS which is both subscriber-excluding and traitor-tracing. We use similar mathematics to a threshold cryptosystem. In the proposed BDS, the maximum number of excluded subscribers reaches the maximum number of traitors in a coalition for which at least one traitor can be identified. We prove that the proposed BDS is secure against ciphertext-only attack if and only if ElGamal cryptosystem is secure against the attack and the discrete logarithm problem is hard. The proposed BDS is the first one which satisfies all the following features: Both subscriber-excluding and traitor-tracing, identifying all the traitors, black box tracing and public key system.

There are many public key cryptosystems that require random inputs to encrypt messages and their security is always discussed assuming that random objects are ideally generated. Since cryptosystems run on computers, it is quite natural that these random objects are computationally generated. One theoretical solution is the use of pseudorandom generators in the Yao's sense. Informally saying, the pseudorandom generators are polynomial-time algorithms whose outputs are computationally indistinguishable from the uniform distribution. Since if we use the Yao's generators then it takes much more time to generate pseudorandom objects than to encrypt messages in public key cryptosystems, we relax the conditions of pseudorandom generators to fit public key cryptosystems and give a minimal requirement for pseudorandom generators within public key cryptosystems. As an example, we discuss the security of the ElGamal cryptosystem with some well-known generators (e. g. , the linear congruential generator). We also propose a new pseudorandom number generator, for random inputs to the ElGamal cryptosystem, that satisfies the minimal requirement. The newly proposed generator is based on the linear congruential generator. We show some evidence that the ElGamal cryptosystem with the proposed generator is secure.

Investigations were carried out on metalorganic-chemical-vapor-deposition (MOCVD)-grown strained AlGaN/ GaN/sapphire structures using X-ray diffratometry. While AlGaN with lower AlN molar fraction (< 0.1) is under the in-plane compressive stress, it is under the in-plane tensile stress with high AlN molar fraction (> 0.1). Though tensile stress caused the cracks in AlGaN layer with high AlN molar fraction, we found that the cracks dramatically reduced when the GaN layer quality was not good. Using this technique, we fabricated a GaInN multi-quantum-well (MQW) surface emitting diodes were fabricated on 15 pairs of AlGaN/GaN distributed Bragg reflector (DBR) structures. The reflectivity of 15 pairs of AlGaN/GaN DBR structure has been shown as 75% at 435 nm. Considerably higher output power (1.5 times) has been observed for DBR based GaInN MQW LED when compared with non-DBR based MQW structures.

Heterojunction bipolar transistors (HBTs) are key devices for a variety of applications including L-band power amplifiers, high speed A/D converters, broadband amplifiers, laser drivers, and low phase noise oscillators. AlGaAs emitter HBTs have demonstrated sufficient reliability for L-band mobile phone applications. For applications which require extended reliability performance at high junction temperatures (>250) and large current densities (>50 kA/cm2), InGaP emitter HBTs are the preferred devices. The excellent reliability of InGaP/GaAs HBTs has been confirmed at various laboratories. At a moderate current density and junction temperature, Jc = 25 kA/cm2 and Tj = 264, no device failures were reported out to 10,000 hours in a sample of 10 devices. Reliability testing performed up to a junction temperature of 360 and at a higher current density (Jc = 60 kA/cm2) showed an extrapolated MTTF of 5 105 hours at Tj = 150. The activation energy for AlGaAs/GaAs HBTs was 0.57 eV, while the activation energy for InGaP/GaAs HBTs was 0.68 eV, which indicated a similar failure mechanism for both devices.

We propose a query processing method for amalgamated knowledge bases. Our query processing method is an extension of the magic sets technique for query processing in amalgamated knowledge bases, augmented with the capabilities of handling amalgamated atoms. Through rewriting rules in a given amalgamated knowledge base, our method offers the advantages associated with top-down as well as bottom-up evaluation. We discuss how to handle amalgamated atoms, consider how to check whether an amalgamated atom is satisfiable in a fact set and how to extend a fact set by inserting an amalgamated atom. We also give the transformation procedures for amalgamated knowledge databases and show the correctness of our method.