This paper presents highly reliable multiple-valued one-phase signalling for an asynchronous on-chip communication link under process, supply-voltage and temperature variations. New multiple-valued dual-rail encoding, where each code is represented by the minimum set of three values, makes it possible to perform asynchronous communication between modules with just two wires. Since an appropriate current level is individually assigned to the logic value, a sufficient dynamic range between adjacent current signals can be maintained in the proposed multiple-valued current-mode (MVCM) circuit, which improves the robustness against the process variation. Moreover, as the supply-voltage and the temperature variations in smaller dimensions of circuit elements are dominated as the common-mode variation, a local reference voltage signal according to the variations can be adaptively generated to compensate characteristic change of the MVCM-circuit component. As a result, the proposed asynchronous on-chip communication link is correctly operated in the operation range from 1.1 V to 1.4 V of the supply voltage and that from -50 to 75 under the process variation of 3σ. In fact, it is demonstrated by HSPICE simulation in a 0.13-µm CMOS process that the throughput of the proposed circuit is enhanced to 435% in comparison with that of the conventional 4-phase asynchronous communication circuit under a comparable energy dissipation.

A monolithic modulator driver IC based on InP HBTs with a new circuit topology -- called a functional distributed circuit (FDC) -- for over 80-Gb/s optical transmission systems has been developed. The FDC topology includes a wide-band amplifier designed using a distributed circuit, a digital function designed using a lumped circuit, and broadband impedance matching between the lumped circuit and distributed circuit to enable both wider bandwidth and digital functions. The driver IC integrated with a 2:1 multiplexing function produces 2.6-Vp-p (differential output: 5.2 Vp-p) and 2.4- Vp-p (differential output: 4.8 Vp-p) output-voltage swings with less than 450-fs and 530-fs rms jitter at 80 Gb/s and 90 Gb/s, respectively. To the best of our knowledge, this is equivalent to the highest data rate operation yet reported for monolithic modulator drivers. When it was mounted in a module, the driver IC successfully achieved electro-optical modulation using a dual-drive LiNbO3 Mach-Zehnder modulator up to 90 Gb/s. These results indicate that the FDC has the potential to realize high-speed and functional ICs for over-80-Gb/s transmission systems.

Dynamically Programmable Gate Arrays (DPGAs) provide more area-efficient implementations than conventional Field Programmable Gate Arrays (FPGAs). One of typical DPGA architectures is multi-context architecture. An DPGA based on multi-context architecture is Multi-Context FPGA (MC-FPGA) which achieves fast switching between contexts. The problem of the conventional SRAM-based MC-FPGA is its large area and standby power dissipation because of the large number of configuration memory bits. Moreover, since SRAM is volatile, the SRAM-based multi-context FPGA is difficult to implement power-gating for standby power reduction. This paper presents an area-efficient and nonvolatile multi-context switch block architecture for MC-FPGAs based on a ferroelectric-capacitor functional pass-gate which merges a multiple-valued threshold function and a nonvolatile multiple-valued storage. The test chip for four contexts is fabricated in a 0.35 µm-CMOS/0.60 µm-ferroelectric-capacitor process. The transistor count of the proposed multi-context switch block is reduced to 63% in comparison with that of the SRAM-based one.

A fine-grain bit-serial multiple-valued reconfigurable VLSI based on logic-in-control architecture is proposed for effective use of the hardware resources. In logic-in-control architecture, the control circuits can be merged with the arithmetic/logic circuits, where the control and arithmetic/logic circuits are constructed by using one or multiple logic blocks. To implement the control circuit, only one state in a state transition diagram is allocated to one logic block, which leads to reduction of the complexity of interconnections between logic blocks. The fine-grain logic block is implemented based on multiple-valued current-mode circuit technology. In the fine-grain logic block, an arbitrary 3-variable binary function can be programmed by using one multiplexer and two universal literal circuits. Three-variable binary functions are used to implement the control circuit. Moreover, the hardware resources can be utilized to construct a bit-serial adder, because full-adder sum and carry can be realized by programming in the universal literal circuit. Therefore, the logic block can be effectively reconfigured for arithmetic/logic and control circuits. It is made clear that the hardware complexity of the control circuit in the proposed reconfigurable VLSI can be reduced in comparison with that of the control circuit based on a typically sequential circuit in the conventional FPGA and the fine-grain field-programmable VLSI reported until now.

Delay models for binary logic circuits have been proposed and clarified their mathematical properties. Kleene's ternary logic is one of the simplest delay models to express transient behavior of binary logic circuits. Goto first applied Kleene's ternary logic to hazard detection of binary logic circuits in 1948. Besides Kleene's ternary logic, there are many delay models of binary logic circuits, Lewis's 5-valued logic etc. On the other hand, multiple-valued logic circuits recently play an important role for realizing digital circuits. This is because, for example, they can reduce the size of a chip dramatically. Though multiple-valued logic circuits become more important, there are few discussions on delay models of multiple-valued logic circuits. Then, in this paper, we introduce a delay model of multiple-valued logic circuits, which are constructed by Min, Max, and Literal operations. We then show some of the mathematical properties of our delay model.

This paper presents the new switching converter model used for analyzing the generation mechanism of ringing ground leakage (GL) current, generated during the transient, at switch on/off of any switching converter. By applying the Norton model, the proposed new model of switching converter can be formulated. The ringing GL current is evaluated at the switching on/off of the unbalanced (half-bridge converter) and the balanced converter (full-bridge converter) for bidirectional D.C. motor drive used as an example. It is concluded that the measured and simulated results of the generated GL current agree well with the numerical analysis results, analyzed by the proposed new model of switching converter, in terms of the minimum or maximum peak currents and the ringing frequency.

A new pipeline controller based on the Early Acknowledgement (EA) protocol is proposed for bundled-data asynchronous circuits. The EA protocol indicates acknowledgement by the falling edge of the acknowledgement signal in contrast to the 4-phase protocol, which indicates it on the rising edge. Thus, it can hide the overhead caused by the resetting period of the handshake cycle. Since we have designed our controller assuming several timing constraints, we first analyze the timing constraints under which our controller correctly works and then discuss their appropriateness. The performance of the controller is compared both analytically and experimentally with those of two other pipeline controllers, namely, a very high-speed 2-phase controller and an ordinary 4-phase controller. Our controller performs better than a 4-phase controller when pipeline has processing elements. We have obtained interesting results in the case of a non-linear pipeline with a Conditional Branch (CB) operation. Our controller has slightly better performance even compared to 2-phase controller in the case of a pipeline with processing elements. Its superiority lies in the EA protocol, which employs return-to-zero control signals like the 4-phase protocol. Hence, our controller for CB operation is simple in construction just like the 4-phase controller. A 2-phase controller for the same operation needs to have a slightly complicated mechanism to handle the 2-phase operation because of the non-return-to-zero control signals, and this results in a performance overhead.

In this paper, optimization and verification of the current-mode multiple-valued digit ORNS arithmetic circuits are presented. The multiple-valued digit ORNS is the redundant number system using digit values in the multiple-valued logic and it realizes the full-parallel calculation without any ripple carry propagation. First, the 4-bit addition and multiplication algorithms employing the multiple-valued digit ORNS are optimized through logic-level analyses. In the multiplier, the maximum digit value and the number of modulo operations in series are successfully reduced from 49 to 29 and from 3 to 2, respectively, by the arrangement of addition lines. Next, circuit components such as a current mirror are verified using HSPICE. The proposed switched current mirror which has functions of a current mirror and an analog switch is effective to reduce the minimum operation voltage by about 0.13 volt. Besides an ordinary strong-inversion region, the circuit components operated under the weak-inversion region show good simulation results with the unit current of 10 nanoamperes, and it brings both of the lower power dissipation and the stable operation under the lower supply voltage.

A multiple-valued current-mode (MVCM) circuit using current-flow control is proposed for a power-greedy sequential linear-array system. Whenever operation is completed in processing element (PE) at the present stage, every possible current source in the PE at the previous stage is cut off, which greatly reduces the wasted power dissipation due to steady current flows during standby states. The completion of the operation can be easily detected using "operation monitor" that observes input and output signals at latches, and that generates control signal immediately at the time completed. Since the wires of data and control signals are shared in the proposed MVCM circuit, no additional wires are required for current-flow control. In fact, it is demonstrated that the power consumption of the MVCM circuit using the proposed method is reduced to 53 percent in comparison with that without current-source control.

This paper introduces a new technique for electromagnetic immunity modeling of integrated circuits (ICs), compliant with industrial requirements and valid up to 3 GHz. A specific modeling flow is introduced, which makes it possible to predict the conducted immunity of an IC according to a given criterion, whatever its external environment. This methodology was validated through measurements performed on several devices.

This paper provides an investigation of power distribution network (PDN) performance by a full-wave prediction tool and by experimental measurements. A set of six real boards characterized by increasing complexity is considered in order to establish a solid base for behaviour understanding of printed circuit boards. How the growing complexity impacts on the board performance is investigated by measurements and by simulations. Strengths and weakness of PDN modeling by the full-wave software tool Microwave Studio are highlighted and discussed.

We propose a novel technique of matching at both ends of the guard trace to suppress resonance. This approach is derived from the viewpoint that the guard trace acts as a transmission line. We examined that matched termination suppresses guard-trace resonance through simulating a circuit and measuring radiation. We found from these results that the proposed method enables guard-trace voltages to remain low and hence avoids increases in radiation. In addition, we demonstrated that "matched termination at the far end of the guard trace" could suppress guard-trace resonance sufficiently at all frequencies. We eventually found that at least two vias at both ends of the guard trace and only one matching resistor at the far end could suppress guard-trace resonance. With respect to fewer vias, the method we propose has the advantage of reducing restrictions in the printed circuit board layout at the design stage.

A novel approach is proposed for miniaturizing the unit cell size of electromagnetic bandgap (EBG) structures that suppress power plane noise. In this approach, open stubs are introduced into the shunt circuits of these EBG structures. Since the stub length determines the resonant frequencies of the shunt circuit, the proposed structures can maintain the bandgaps at lower frequencies without increasing the unit cell size. The bandgap frequencies were estimated by dispersion analysis based on the Bloch theorem and full-wave simulations. Sample boards of the proposed EBG structures were fabricated with a unit cell size of 2.1 mm. Highly suppressed noise propagation over the estimated frequency range of 1.9-3.6 GHz including the 2.4-GHz wireless-LAN band was experimentally demonstrated.

An on-chip process, supply voltage, and temperature (PVT) compensation technique for low-voltage CMOS digital circuits was proposed. Because the degradation of circuit performance originates from the variation of the saturation current in transistors, we developed a compensation circuit consisting of a reference current that is independent of PVT variations. The circuit is operated so that the saturation current in digital circuits is equal to the reference current. The operations of the circuit were confirmed by SPICE simulation with a set of 0.35-µm standard CMOS parameters. Monte Carlo simulations showed that the proposed technique effectively improves circuit performance by 71%. The circuit is useful for on-chip compensation to mitigate the degradation of circuit performance with PVT variation in low-voltage digital circuits.

We propose a CMOS circuit that can be used as an equivalent to resistors. This circuit uses a simple differential pair with diode-connected MOSFETs and operates as a high-resistance resistor when driven in the subthreshold region of MOSFETs. Its resistance can be controlled in a range of 1-1000 MΩ by adjusting a tail current for the differential pair. The results of device fabrication with a 0.35-µm 2P-4M CMOS process technology is described. The resistance was 13 MΩ for a tail current of 10 nA and 135 MΩ for 1 nA. The chip area was 105 µm110 µm. Our resistor circuit is useful to construct many high-resistance resistors in a small chip area.

Chip-to-chip serial data communication is superposed on power supply over common Vdd/Vss connections through chip, package, and board traces. A power line transceiver demonstrates half duplex spiking communication at more than 100 Mbps. A pair of transceivers consumes 1.35 mA from 3.3 V, at 130 Mbps. On-chip power line LC low pass filter attenuates pseudo-differential communication spikes by 30 dB, purifying power supply current for internal circuits. Bi-directional spiking communication was successfully examined in a 90-nm CMOS prototype setup of on-chip waveform capturing. A micro controller forwards clock pulses to and receives data streams from a comparator based waveform capturer formed on a different chip, through a single pair of power and ground traces. The bit error rate is small enough not to degrade waveform acquisition capability, maintaining the spurious free dynamic range of higher than 50 dB.

A direct-conversion receiver integrated with the CMOS subharmonic frequency tripler (SFT) for V-band applications is designed, fabricated and measured using 0.13-µm CMOS technology. The receiver consists of a low-noise amplifier, a down-conversion mixer, an output buffer, and an SFT. A fully differential SFT is introduced to relax the requirements on the design of the frequency synthesizer. Thus, the operational frequency of the frequency synthesizer in the proposed receiver is only 20 GHz. The fabricated receiver has a maximum conversion gain of 19.4 dB, a minimum single-side band noise figure of 10.2 dB, the input-referred 1-dB compression point of -20 dBm and the input third order inter-modulation intercept point of -8.3 dB. It draws only 15.8 mA from a 1.2-V power supply with a total chip area of 0.794 mm0.794 mm. As a result, it is feasible to apply the proposed receiver in low-power wireless transceiver in the V-band applications.

A method of fault diagnosis was proposed for power electronics circuits based on S transforms similarity. At first, the standard module time-frequency matrixes of S transforms for all fault signals were constructed, then the similarity of fault signals' module time-frequency matrixes to standard module time-frequency matrixes were calculated, and according to the principle of maximum similarity, the faults were diagnosed. The simulation result of fault diagnosis of a thyristor in a three-phase full-bridge controlled rectifier shows that the method can accurately diagnose faults and locate the fault element for power electronics circuits, and it has excellent performance for noise robustness and calculation complexity, thus it also has good practical engineering value in the solution to the fault problems for power electronics circuits.

Spin-torque transfer magnetic random access memory (STT-MRAM) is a promising technology for next generation nonvolatile universal memory because it reduces the high write current required by conventional MRAM and enables write current scaling as technology becomes smaller in size. However, the sensing margin is not improved in STT-MRAM and tends to decrease with technology scaling due to the lowered supply voltage and increased process variation. Moreover, read disturbance, which is an unwanted write in a read operation, can occur in STT-MRAM because its read and write operations use the same path. To overcome these problems, we present a load-line analysis method, which is useful for systematically analyzing the impacts of transistor size and gate voltage of MOSFETs on the sensing margin, and also propose an optimization procedure for the commonly applicable MRAM sensing circuits. This methodology constitutes an effective means to optimize the transistor size and gate voltage of MOSFETs and thus maximizes the sensing margin without causing read disturbance.

This paper presents an enhanced dual-path delta-sigma analog-to-digital converter. Compared with other architectures, the enhanced architecture increases the noise shaping order without any instability problems and displays analog complexity equivalent to the multi-stage noise shaping architecture. Our delta-sigma converter is based on this new architecture. It employs not only doubly-differential structure to reduce common-mode errors in the system-level but also delayed-feed-in structure to mitigate the timing constraint of the feedback signal. Regarding the circuit implementation, the first-order enhancement of the quantization noise shaping is achieved via the use of a switched capacitor circuit technique. The circuit is incorporated into the active adder in a low-distortion structure. The supporting clock generation circuit that provides additional phases of clocks with the enhancement block is also implemented in the CMOS logic gates. A digital dynamic element matching circuit (i.e., segmented data-weighted-average circuit) is designed to reduce mismatch errors caused by the feedback DAC of modulator. A test chip, fabricated in a 0.18-µm CMOS process, provides a signal-to-noise+distortion ratio (SNDR) of 75-dB for a 1.0-MHz signal bandwidth clocked at 40-MHz. The 2nd harmonic is -101 dB and the 3rd harmonic is -94 dB when a -4.5-dB 100-kHz input signal is applied.