Hang Liu Fei Wu
Keiji GOTO Toru KAWANO Ryohei NAKAMURA
Takahiro SASAKI Yukihiro KAMIYA
Xiang XIONG Wen LI Xiaohua TAN Yusheng HU
Anton WIDARTA
Hiroshi OKADA Mao FUKINAKA Yoshiki AKIRA
Shun-ichiro Ohmi
Tohgo HOSODA Kazuyuki SAITO
Shohei Matsuhara Kazuyuki Saito Tomoyuki Tajima Aditya Rakhmadi Yoshiki Watanabe Nobuyoshi Takeshita
Koji Abe Mikiya Kuzutani Satoki Furuya Jose A. Piedra-Lorenzana Takeshi Hizawa Yasuhiko Ishikawa
Yihan ZHU Takashi OHSAWA
Shengbao YU Fanze MENG Yihan SHEN Yuzhu HAO Haigen ZHOU
Ryo KUMAGAI Ryosuke SUGA Tomoki UWANO
Jun SONODA Kazusa NAKAMICHI
Kaiji Owaki Yusuke Kanda Hideaki Kimura
Takuya FUJIMOTO
Yuji Wada
Fuyuki Kihara Chihiro Matsui Ken Takeuchi
Keito YUASA Michihiro IDE Sena KATO Kenichi OKADA Atsushi SHIRANE
Tomoo Ushio Yuuki Wada Syo Yoshida
Futoshi KUROKI
Jun FURUTA Shotaro SUGITANI Ryuichi NAKAJIMA Takafumi ITO Kazutoshi KOBAYASHI
Yuya Ichikawa Ayumu Yamada Naoko Misawa Chihiro Matsui Ken Takeuchi
Ayumu Yamada Zhiyuan Huang Naoko Misawa Chihiro Matsui Ken Takeuchi
Yoshinori ITOTAGAWA Koma ATSUMI Hikaru SEBE Daisuke KANEMOTO Tetsuya HIROSE
Hikaru SEBE Daisuke KANEMOTO Tetsuya HIROSE
Zhibo CAO Pengfei HAN Hongming LYU
Takuya SAKAMOTO Itsuki IWATA Toshiki MINAMI Takuya MATSUMOTO
Koji YAMANAKA Kazuhiro IYOMASA Takumi SUGITANI Eigo KUWATA Shintaro SHINJO
Minoru MIZUTANI Takashi OHIRA
Katsumi KAWAI Naoki SHINOHARA Tomohiko MITANI
Baku TAKAHARA Tomohiko MITANI Naoki SHINOHARA
Akihiko ISHIWATA Yasumasa NAKA Masaya TAMURA
Atsushi Fukuda Hiroto Yamamoto Junya Matsudaira Sumire Aoki Yasunori Suzuki
Ting DING Jiandong ZHU Jing YANG Xingmeng JIANG Chengcheng LIU
Fan Liu Zhewang Ma Masataka Ohira Dongchun Qiao Guosheng Pu Masaru Ichikawa
Ludovico MINATI
Minoru Fujishima
Hyunuk AHN Akito IGUCHI Keita MORIMOTO Yasuhide TSUJI
Kensei ITAYA Ryosuke OZAKI Tsuneki YAMASAKI
Akira KAWAHARA Jun SHIBAYAMA Kazuhiro FUJITA Junji YAMAUCHI Hisamatsu NAKANO
Seiya Kishimoto Ryoya Ogino Kenta Arase Shinichiro Ohnuki
Yasuo OHTERA
Tomohiro Kumaki Akihiko Hirata Tubasa Saijo Yuma Kawamoto Tadao Nagatsuma Osamu Kagaya
Haonan CHEN Akito IGUCHI Yasuhide TSUJI
Keiji GOTO Toru KAWANO Munetoshi IWAKIRI Tsubasa KAWAKAMI Kazuki NAKAZAWA
Wen-Teng CHANG Shih-Wei LIN Min-Cheng CHEN Wen-Kuan YEH
The electric properties of a field-effect transistor not only depend on gate surface sidewall but also on channel orientation when applying channel stain engineering. The change of the gate surface and channel orientation through the rotated FinFETs provides the capability to compare the orientation dependence of performance and reliability. This study characterized the <100> and <110> channels of FinFETs on the same wafer under tensile and compressive stresses by cutting the wafer into rectangular silicon pieces and evaluated their piezoresistance coefficients. The piezoresistance coefficients of the <100> and <110> silicon under tensile and compressive stresses were first evaluated based on the current setup. Tensile stresses enhance the mobilities of both <100> and <110> channels, whereas compressive stresses degrade them. Electrical characterization revealed that the threshold voltage variation and drive current degradation of the {100} surface were significantly higher than those of {110} for positive bias temperature instability and hot carrier injection with equal gate and drain voltage (VG=VD). By contrast, insignificant difference is noted for the subthreshold slope degradation. These findings imply that a higher ratio of bulk defect trapping is generated by gate voltage on the <100> surface than that on the <110> surface.
We have investigated post-metallization annealing (PMA) utilizing TiN gate electrode on the thin ferroelectric undoped HfO2 directly deposited on p-Si(100) by RF magnetron sputtering. By post-deposition annealing (PDA) process at 600°C/30 s in N2, the memory window (MW) in the C-V characteristics was observed in the Al/HfO2/p-Si(100) diodes with 15 to 24-nm-thick HfO2. However, it was not obtained when the thickness of HfO2 was 10 nm. On the other hand, the MW was observed for Pt/TiN/HfO2 (10 nm)/p-Si(100) diodes utilizing PMA process at 600°C/30 s. The MW was 0.5 V when the bias voltage was applied from -3 to 3 V.
Binjian ZENG Jiajia LIAO Qiangxiang PENG Min LIAO Yichun ZHOU Shun-ichiro OHMI
For the further scaling and lower voltage applications of nonvolatile ferroelectric memory, the effect of Kr/O2 sputtering for SrBi2Ta2O9 (SBT) thin film formation was investigated utilizing a SrBi2Ta2O9 target. The 80-nm-thick SBT films were deposited by radio-frequency (RF) magnetron sputtering on Pt/Ti/SiO2/Si(100). Compared with Ar/O2 sputtering, the ferroelectric properties such as larger remnant polarization (Pr) of 3.2 μC/cm2 were observed with decrease of leakage current in case of Kr/O2 sputtering. X-ray diffraction (XRD) patterns indicated that improvement of the crystallinity with suppressing pyrochlore phases and enhancing ferroelectric phases was realized by Kr/O2 sputtering.
Rengie Mark D. MAILIG Shun-ichiro OHMI
We investigated the low temperature formation of Pd2Si on Si(100) with TiN encapsulating layer formed at 500°C/1 min. Furthermore, the dopant segregation process was performed with ion dose of 1x1015 cm-2 for B+. The uniform Pd2Si was successfully formed with low sheet resistance of 10.4 Ω/sq. Meanwhile, the PtSi formed on Si(100) showed rough surface morphology if the silicidation temperature was 500°C. The estimated Schottky barrier height to hole of 0.20 eV (qφBp) was realized for n-Si(100).
Shun-ichiro OHMI Yuya TSUKAMOTO Rengie Mark D. MAILIG
In this paper, we have investigated the etching selectivity of HfN encapsulating layer for high quality PtHf-alloy silicide (PtHfSi) formation with low contact resistivity on Si(100). The HfN(10 nm)/PtHf(20 nm)/p-Si(100) stacked layer was in-situ deposited by RF-magnetron sputtering at room temperature. Then, silicidation was carried out at 500°C/20 min in N2/4.9%H2 ambient. Next, the HfN encapsulating layer was etched for 1-10 min by buffered-HF (BHF) followed by the unreacted PtHf metal etching. We have found that the etching duration of the 10-nm-thick HfN encapsulating layer should be shorter than 6 min to maintain the PtHfSi crystallinity. This is probably because the PtHf-alloy silicide was gradually etched by BHF especially for the Hf atoms after the HfN was completely removed. The optimized etching process realized the ultra-low contact resistivity of PtHfSi to p+/n-Si(100) and n+/p-Si(100) such as 9.4×10-9Ωcm2 and 4.8×10-9Ωcm2, respectively, utilizing the dopant segregation process. The control of etching duration of HfN encapsulating layer is important to realize the high quality PtHfSi formation with low contact resistivity.
Yuto FUTAMURA Katsunori MAKIHARA Akio OHTA Mitsuhisa IKEDA Seiichi MIYAZAKI
We have fabricated multiple-stacked Si quantum dots (QDs) with and without Ge core embedded in a SiO2 network on n-Si(100) and studied their field electron emission characteristics under DC bias application. For the case of pure Si-QD stacks with different dot-stack numbers, the average electric field in dot-stacked structures at which electron emission current appeared reached minimum value at a stack number of 11. This can be attributed to optimization of the electron emission due to enhanced electric field concentration in the upper layers of the dot-stacked structures and reduction of the electron injection current from the n-Si substrate, with an increased stack number. We also found that, by introducing Ge core into Si-QDs, the average electric field for the electron emission can be reduced below that from pure Si-QDs-stacked structures. This result implies that the electric field is more concentrated in the upper Si-QDs with Ge core layers due to deep potential well for holes in the Ge core.
Shinpei YAMASHITA Michihiko SUHARA Kenichi KAWAGUCHI Tsuyoshi TAKAHASHI Masaru SATO Naoya OKAMOTO Kiyoto ASAKAWA
We fabricate and characterize a GaAsSb/InGaAs backward diode (BWD) toward a realization of high sensitivity zero bias microwave rectification for RF wave energy harvest. Lattice-matched p-GaAsSb/n-InGaAs BWDs were fabricated and their current-voltage (I-V) characteristics and S-parameters up to 67 GHz were measured with respect to several sorts of mesa diameters in μm order. Our theoretical model and analysis are well fitted to the measured I-Vs on the basis of WKB approximation of the transmittance. It is confirmed that the interband tunneling due to the heterojunction is a dominant transport mechanism to exhibit the nonlinear I-V around zero bias regime unlike recombination or diffusion current components on p-n junction contribute in large current regime. An equivalent circuit model of the BWD is clarified by confirming theoretical fitting for frequency dependent admittance up to 67 GHz. From the circuit model, eliminating the parasitic inductance component, the frequency dependence of voltage sensitivity of the BWD rectifier is derived with respect to several size of mesa diameter. It quantitatively suggests an effectiveness of mesa size reduction to enhance the intrinsic matched voltage sensitivity with increasing junction resistance and keeping the magnitude of I-V curvature coefficient.
Masataka NAKANISHI Michihiko SUHARA Kiyoto ASAKAWA
We numerically demonstrate a possibility on-off keying (OOK) type of modulation over tens gigabits per second for sub-terahertz radiation in our proposed wireless transmitter device structure towards radio over fiber (RoF) technology. The integrated device consists of an InP-based compound semiconductor resonant tunneling diode (RTD) adjacent to an InP-based photo diode (PD), a self-complementary type of bow-tie antenna (BTA), external microstrip lines. These integration structures are carefully designed to obtain robust relaxation oscillation (RO) due to the negative differential conductance (NDC) characteristic of the RTD and the nonlinearity of the NDC. Moreover, the device is designed to exhibit OOK modulation of RO due to photo current from the PD inject into the RTD. Electromagnetic simulations and nonlinear equivalent circuit model of the whole device structure are established to perform large signal analysis numerically with considerations of previously measured characteristics of the triple-barrier RTD.
Naoki MATSUDA Hirotaka OKABE Ayako OMURA Miki NAKANO Koji MIYAKE Toshihiko NAGAMURA Hideki KAWAI
Hydrophobic DNA (H-DNA) nano-film was formed as the surface modifier on a thin glass plate working as a slab optical waveguide (SOWF). Cytochrom c (cytc) molecules were immobilized from aqueous solution with direct contacting to the H-DNA nano-film for 30 minutes. From SOWG absorption spectral changes during automated solution exchange (SE) processes, it was found that about 28.1% of cytc molecules was immobilized in the H-DNA nano-film with keeping their reduction functionality by reducing reagent.
Khotimatul FAUZIAH Yuhei SUZUKI Yuki NARITA Yoshinari KAMAKURA Takanobu WATANABE Faiz SALLEH Hiroya IKEDA
In order to optimize the performance of thermoelectric devices, we have fabricated and characterized the micrometer-scaled Si thermopile preserving the phonon-drag effect, where the Si thermopile consists of p- and n-type Si wire pairs. The measured Seebeck coefficient of the p-type Si wire was found to be higher than the theoretical value calculated only from the carrier transport, which indicates the contribution of phonon-drag part. Moreover, the measured Seebeck coefficient increased with increasing the width of Si wire. This fact is considered due to dependency of phonon-drag part on the wire width originating from the reduction of phonon-boundary scattering. These contributions were observed also in measured output voltage of Si-wire thermopile. Hence, the output voltage of Si-wire thermopile is expected can be enhanced by utilizing the phonon-drag effect in Si wire by optimizing its size and carrier concentration.
Ryosuke OZAKI Tsuneki YAMASAKI
In this paper, we propose a new technique for the transient scattering problem of periodically arrayed dispersion media for the TE case by using a combination of the Fourier series expansion method (FSEM) and the fast inversion Laplace transform (FILT) method, and analyze the pulse response for various widths of the dispersion media. As a result, we clarified the influence of the dispersion media with an air region on the resulting waveform.
Arnab MUKHOPADHYAY Tapas Kumar MAITI Sandip BHATTACHARYA Takahiro IIZUKA Hideyuki KIKUCHIHARA Mitiko MIURA-MATTAUSCH Hafizur RAHAMAN Sadayuki YOSHITOMI Dondee NAVARRO Hans Jürgen MATTAUSCH
This report focuses on an optimization scheme of advanced MOSFETs for designing CMOS circuits with high power efficiency. For this purpose the physics-based compact model HiSIM2 is applied so that the relationship between device and circuit characteristics can be investigated properly. It is demonstrated that the short-channel effect, which is usually measured by the threshold-voltage shift relative to long-channel MOSFETs, provides a consistent measure for device-performance degradation with reduced channel length. However, performance degradations of CMOS circuits such as the power loss cannot be predicted by the threshold-voltage shift alone. Here, the subthreshold swing is identified as an additional important measure for power-efficient CMOS circuit design. The increase of the subthreshold swing is verified to become obvious when the threshold-voltage shift is larger than 0.15V.
A multi-carrier and blind shift-frequency jamming(MCBSFJ) against the pulsed compression radar with order-statistic (OS) constant false alarm rate (CFAR) detector is proposed. Firstly, according to the detection principle of the OS-CFAR detector, the design requirements for jamming signals are proposed. Then, some key parameters of the jamming are derived based on the characteristics of the OS-CFAR detector. As a result, multiple false targets around the real target with the quantity, amplitude and space distribution which can be controlled are produced. The simulation results show that the jamming method can reduce the detection probability of the target effectively.