The current-voltage characteristics of a single electron transistor (SET) in the resonant transport mode are investigated. In the future when SET devices are applied to integrated electronics, the quantum effect will seriously modify their characteristics in ultra-small geometry. The current will be dominated by the resonant transport through narrow energy levels in the dot. The simple case of a two-level system is analyzed and the transport mechanism is clarified. The transport property at low temperatures (higher than the Kondo temperature) in the low tunneling rate limit is discussed, and a current map where current values are classified in the gate bias-drain bias plane is provided. It was shown that the dynamic aspect of electron flow seriously influences the current value.

An NMOS 4-phase dynamic logic scheme is described, which is intended to achieve low-power consumption in the deep submicron design. In this scheme, the short-circuit current is eliminated, and moreover, the voltage swing of transition signals is reduced, resulting in enhancing power reduction effectively. First, distinctive features of this 4-phase dynamic logic are specified, as compared with the static CMOS logic and dynamic domino CMOS logic. Then, power simulations are attempted for the 4-phase dynamic logic, static CMOS logic, dynamic CMOS logic, and pass-transistor logic, by using a number of logic modules, which demonstrate that the NMOS 4-phase dynamic logic is the most power-efficient. Moreover, through the gate delay simulation, the capability of how many transistors can be packed in a logic block is also discussed.

In this work, a CMOS on-chip current reference circuit for memory, operational amplifiers, comparators, and data converters is proposed. The reference current is nearly insensitive to temperature and supply-voltage variations. In the proposed circuit, the current component with a positive temperature coefficient cancels that with a negative temperature coefficient each other. While conventional current reference circuits are based on bipolar transistors in BiCMOS, bipolar, or CMOS processes, the proposed circuit can be integrated on a single chip with other digital and analog circuits using a standard CMOS process and extra masks are not required. Measured results are demonstrated for two different prototypes. The first is fabricated employing a 1.0 µm p-well double-poly double-metal CMOS process and operates at 5 V nominally. The second, based on a 0.6 µm n-well process, is optimized for 3 V to 5 V operation. The latter prototype achieves the temperature coefficient of 98 ppm/ over a temperature range from -25 to 75 and the output variation of 1.5% with the supply-voltage changes from 2.5 V to 5.5 V. A simple calibration technique for reducing output current variations improves circuit yield.

A GaAs linear power amplifier operating with a single 3-V supply has been developed for 5.8-GHz ISM band applications. Two kinds of refractory WNx/W self-aligned gate MESFETs, a P-pocket MESFET and an asymmetric MESFET with a buried p-layer (BP- MESFET ) have been compared in terms of DC characteristics, small signal characteristics and power performances at 5.8 GHz. To obtain both high gain and high efficiency in the case of single 3-V supply operation at 5.8 GHz, we used a highly efficient and linear P-pocket MESFET for the output-stage power FET and a high-gain asymmetric MESFET with a buried p-layer (BP- MESFET ) for the driver-stage FET. The bias condition for 1-mm output-stage P-pocket MESFET was set near class-AB, so as to obtain sufficient output power with high PAE. The two-stage power amplifier MMIC module which can include all matching and biasing circuits, has been designed and fabricated. The amplifier exhibits a high power gain of 17.9 dB and a high power-added efficiency of 25.7% with a sufficient output power of 18.7 dBm at the 1-dB compression point. This self-aligned gate GaAs MESFET technology is promising for near-future 5.8-GHz applications, because of such good power performance and good mass-producibility.

This paper describes an MOS current-mode, voltage-controlled oscillator (VCO) circuit that potentially operates with a 2 V supply voltage, 500 MHz oscillation frequency, and -90 dBc/Hz phase noise at the 1 MHz offset. It also has an improved oscillation frequency linearity of the control voltage and 11 mW power dissipation. The oscillation frequency reached 920 MHz when the supply voltage was increased to 3 V.

We propose a new inverse modeling method to extract 2D channel dopant profile in an MOSFET. The profile is extracted from threshold voltage (Vth) of MOSFETs with a series of gate lengths. The uniqueness of the extracted channel and drain profile is confirmed through test simulations. The extracted profile of actual 0.1 µm nMOSFETs explains reverse short channel effects (RSCE) of threshold voltage dependent on gate length including substrate bias dependence.

Low-voltage technique for IC is getting one of the most important matters. It is quite difficult to realize a filter which can operate at 1 V or less because the base-emitter voltage of transistors can hardly be reduced. A design of a low-voltage continuous-time filter is presented in this paper. The basic building block of the filter is a pseudo-differential transconductor which has no tail current source. Therefore, the operating voltage is lower than that of an emitter-coupled pair. However, the common-mode (CM) gain of the transconductor is quite high and the CMRR is low. In order to reduce the CM gain, a CM feedback circuit is employed. The transconductance characteristic is expressed as the function of hyperbolic cosine. The designed filter is a fifth-order gyrator-C filter. The transconductor and the filter which has a fifth-order Butterworth lowpass characteristic are demonstrated by PSpice simulation. Transconductance characteristic, CMRR and stability of the transconductor are confirmed through the simulation. In the analysis of the filter, frequency response and offset voltage are examined. It is shown that the filter which has corner frequency of the order of megahertz can operate at a 1 V supply voltage.

In this paper, a four-quadrant analog multiplier consisting of four neuron-MOS transistors and two load resistors is proposed. The proposed multiplier can be operated at only 1 V. Furthermore, the input range of the multiplier is equal to 100% of the supply voltage. The theoretical harmonic distortion caused by mobility degradation and device mismatchs is derived in detail. The performance of the proposed multiplier is characterized through HSPICE simulations with a standard 2.0 µm CMOS process with a double-poly layer. Simulations of the proposed multiplier demonstrate that the linearity error of 0.77% and a total harmonic distortion of 0.62% are obtained with full-scale input conditions. The maximum power consumption and 3 dB bandwidth are 9.56 µW and 107 MHz, respectively. The active area of the proposed multiplier is 210 µm 140 µm.

An on-chip high voltage generator applicable to low voltage flash memory is introduced. Bootstrapped gate transfer switches of two parallel paths suppress the voltage loss due to threshold voltage drop of transfer transistors. The simulated results demonstrate that proposed circuit designed with NMOS transistors having 0.8 volt threshold voltage works like an ideal charge pump circuit near 1.0 volt range with enough current driving capability.

This paper presents a new technique for modeling High-Voltage lightly-doped-drain MOS (HV MOS) devices accurately with the BSIM3v3 SPICE model. Standard SPICE models do not model the voltage dependency of Rs and Rd in HV MOS devices; this causes large discrepancies between the simulated and measured I-V characteristics of HV MOS devices. We propose to assign physical meanings and values different from the original BSIM3v3 model to three of its parameters to represent the voltage dependency of Rs and Rd. With this method, we have succeeded in highly accurate parameter extraction, and the simulated I-V characteristics of HV MOS devices using the extracted parameters match the measured results well. The relationship between the proposed modeling technique and the physical mechanism of HV MOS devices is also discussed based on measurement and device simulation results. Since our method does not change any model equations of BSIM3v3, it can be applied to any SPICE simulator on which the BSIM3v3 model runs, so we can use SPICE simulation for accurate circuit design of complex circuits using HV MOS devices.

In this paper we introduce a CMOS low voltage/low power (LV/LP) voltage controlled oscillator (VCO). It includes a simple V-I converter, a current controlled ring oscillator based on new differential delay cells, and a source-coupled differential pair to convert differential signal to single-ended signal. The V-I converter is implemented as a source follower type, exhibiting excellent linearity of transconductance with low power consumption. The new delay cell employs local positive feedback to increase its DC gain, achieving stable oscillation at low supply voltage. The simulation and measurement results are given to show the linearity between the input (control voltage) and the output (frequency) in the frequency range of 100 MHz to 400 MHz with 1. 2 V power supply. The VCO only consumes power of 2.25 mW at operating frequency of 400 MHz and 1.2 V supply.

This paper describes a newly developed FET Coupled Logic (FCL) circuit that operates at very high frequencies with very low supply voltages below 3.3 V. An FCL circuit consists of NMOS source-coupled transistor pairs for current switches, load resistors, emitter followers and current sources that are controlled by a band-gap reference bias generator. The characteristics and performance are discussed by comparing this circuit with other high-speed circuits. The optimal circuit parameters for FCL circuits are also discussed, and the fact is noted that a larger swing voltage enhances the circuit's performance. The simulated delay of a 0.25 µm FCL circuit is less than 15 ps for a 2.5 V power supply, and the simulated maximum toggle frequencies are over 5 GHz and 10 GHz at 2.5 V and 3.3 V power supply, respectively. The simulation results show that FCL circuits achieve the best performance among the current mode circuits, which include ECL circuits, NMOS source-coupled logic circuits. The delay of the FCL circuit is less than half that of an ECL circuit. The maximum toggle frequency of the FCL circuit is about triple that of NMOS source-coupled logic circuit. Because the FCL circuit uses low-cost CMOS-based BiCMOS technologies, its cost performance is superior to ECL circuits that require expensive base-emitter self-aligned processes and trench isolation processes. Using depletion-mode NMOS transistors for current switches can lower the minimum supply voltage for FCL circuits and it is below 1.5 V. The FCL circuit is a promising logic gate circuit for multi-Gbit/s tele/data communication LSIs.

Ultra-low-power-consumption and high-speed DCFL circuits have been fabricated by using 0.2-µm Y-shaped gate E/D-heterojunction-FETs (HJFETs) with a high-aspect-ratio gate-structure, which has an advantage of reducing the gate-fringing capacitance (Cf) to about a half of that of a conventional low-aspect-ratio one. A fabricated 51-stage ring oscillator with the 0.2-µm Y-shaped gate n-AlGaAs/i-InGaAs E/D-HJFETs shows the lowest power-delay product of 0.21 fJ with an unloaded propagation delay of 34.9 ps at a supply voltage (VDD) of 0.4 V. We also analyze the DCFL switching characteristics by taking into account the intrinsic gate-to-source capacitance (Cgsint) and the Cf. The analysis results for the power-delay products agree well with our experimental results. Our analysis also indicates the DCFL circuit with the high-aspect-ratio Y-shaped gate E/D-HJFETs can reduce the power-delay products by 35% or more below 0.25-µm gate-length as compared to conventional ones with the low-aspect-ratio Y-shaped gate HJFETs. These results clarify that the Cf-reduction of the Y-shaped gate HJFETs is more effective in improving the power-delay products than reducing the gate-length.

A 1.5 V 8 mW BiCMOS video A/D converter has been developed by using a BiCMOS pumping comparator. Combining Bipolar high-speed and good-matching characteristics with CMOS switched capacitor techniques, this A/D converter is suitable for use in battery-operated multimedia terminals.

A new low voltage high-speed CMOS composite transistor is presented. It lowers supply voltage down to |Vt|+2 Vds,sat and considerably extends input voltage operating range and achieves high speed operation. As an application example, it is used in the design of a high-speed four quadrant analog multiplier. Simulations results using MOSIS 2µm N-well process with a 3 V supply are given.

A high performance voltage down converter (VDC) is proposed in this paper. The proposed VDC can automatically control the driving current in seven phases to reduce the fluctuation of output voltage in VDC. By using above new flexible control technology of driving current, the fluctuation of output voltage can be suppressed to less than 10% and the average consuming current of VDC can be suppressed to 34 µA, even if the operation frequency is 200 MHz at the average driving current 100 mA. Therefore, the proposed VDC can operate with large driving current, low-power consumption and good response at the same time. Above all, this technology is very suitable for high perform ULSIs which require large load current, very low-power and high speed operation.

A novel zero-voltage-switched half-bridge converter is proposed. This converter achieves the zero-voltage switching while maintaining a constant frequency PWM control. Then the power conversion of high efficiency and low noise is realized at a higher switching frequency. In the experiment, a high efficiency of 83% is achieved for a low output voltage of 3.3 V, an output current of 30 A, and an input-voltage range of 200 to 400 V at the switching frequency of 400 kHz.

In this paper, a virtual-short circuit which consists of only two MOS transistors operated in the weak-inversion region is proposed. It has the advantages of almost zero power consumption, low voltage operation, small chip area, and no needlessness of bias voltages or currents. The second order effects, such as the device mismatch, the Early effect, and the temperature dependency of the circuit are analyzed in detail. Next, current-controlled and voltage-controlled current sources using the proposed virtual-short circuit are presented as applications. The performance of the proposed circuits is estimated using SPICE simulation with MOSIS 1. 2 µm CMOS device parameters. The results are reported on this paper.

An elastic-Vt CMOS circuit is proposed which facilitates both high speed and low power consumption at low supply voltages. This circuit permits fine-grain power control on each multiple circuit block composing a chip, and it is not sensitive to design factors as device-parameter deviations or operating-environment variations. It also does not require any such additional fabrication technology as triple-well structure or multi-threshold voltage. The effectiveness of the circuits design was confirmed in applying it to specially fabricated 16-bit adders and 4-kb SRAMs based on 1. 5-V, 0. 35- µm CMOS technology.

A single-chip GaAs Transmit/Receive (T/R)-MMIC front-end has been developed which is applicable to 1. 9-GHz personal communication terminals such as digital cordless phones. This chip is fabricated using a planar self-aligned gate FET useful for low-cost and high-volume production. The chip integrates RF front-end analog circuits a power amplifier, a T/R-switch, and a low-noise amplifier. Additionally integrated are a newly developed voltage-doubler negative-voltage generator (VDNVG) and a control logic circuit to control transmit and receive functions, enabling both a single-voltage operation and an enhanced power handling capability of the switch, even under a single low-voltage supply condition of 2 V. The power amplifier incorporated onto the chip is capable of delivering a 21 dBm output power at a 39% efficiency, and a 30 dB associated gain with a 2 V single power supply in the transmit mode. The gain and efficiency are higher than those of the previously reported amplifier operating with a 2 V single power supply. The VDNVG produces a step-up voltage of 2. 9 V as well as a negative voltage of -1. 8 V from a 2 V power supply, operating with a charge time of less than 0. 25 µs. The control logic circuit on the chip has a newly designed interface circuit utilizing the step-up voltage and negative voltage, thereby enabling the chip to handle high power outputs over 24 dBm with a low operating voltage of 2 V. In the receive mode, a 1. 7 dB noise figure and a 0. 6 dB insertion loss are achieved with a current dissipation of 3. 6 mA. The developed MMIC, which is the first reported 2 V single-voltage operation T/R-MMIC front-end, is expected to contribute to the size and weight reductions in personal communication terminals.